ZHCSN42A
August 2021 – May 2022
ADC08DJ5200RF
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: DC Specifications
6.6
Electrical Characteristics: Power Consumption
6.7
Electrical Characteristics: AC Specifications (Dual-Channel Mode)
6.8
Electrical Characteristics: AC Specifications (Single-Channel Mode)
6.9
Timing Requirements
6.10
Switching Characteristics
6.11
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Device Comparison
7.3.2
Analog Inputs
7.3.2.1
Analog Input Protection
7.3.2.2
Full-Scale Voltage (VFS) Adjustment
7.3.2.3
Analog Input Offset Adjust
7.3.3
ADC Core
7.3.3.1
ADC Theory of Operation
7.3.3.2
ADC Core Calibration
7.3.3.3
Analog Reference Voltage
7.3.3.4
ADC Overrange Detection
7.3.3.5
Code Error Rate (CER)
7.3.4
Temperature Monitoring Diode
7.3.5
Timestamp
7.3.6
Clocking
7.3.6.1
Noiseless Aperture Delay Adjustment (tAD Adjust)
7.3.6.2
Aperture Delay Ramp Control (TAD_RAMP)
7.3.6.3
SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
7.3.6.3.1
SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
7.3.6.3.2
Automatic SYSREF Calibration
7.3.7
Programmable FIR Filter (PFIR)
7.3.7.1
Dual Channel Equalization
7.3.7.2
Single Channel Equalization
7.3.7.3
Time Varying Filter
7.3.8
JESD204C Interface
7.3.8.1
Transport Layer
7.3.8.2
Scrambler
7.3.8.3
Link Layer
7.3.8.4
8B/10B Link Layer
7.3.8.4.1
Data Encoding (8B/10B)
7.3.8.4.2
Multiframes and the Local Multiframe Clock (LMFC)
7.3.8.4.3
Code Group Synchronization (CGS)
7.3.8.4.4
Initial Lane Alignment Sequence (ILAS)
7.3.8.4.5
Frame and Multiframe Monitoring
7.3.8.5
64B/66B Link Layer
7.3.8.5.1
64B/66B Encoding
7.3.8.5.2
Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
7.3.8.5.3
Block, Multiblock and Extended Multiblock Alignment using Sync Header
7.3.8.5.3.1
Cyclic Redundancy Check (CRC) Mode
7.3.8.5.3.2
Forward Error Correction (FEC) Mode
7.3.8.5.4
Initial Lane Alignment
7.3.8.5.5
Block, Multiblock and Extended Multiblock Alignment Monitoring
7.3.8.6
Physical Layer
7.3.8.6.1
SerDes Pre-Emphasis
7.3.8.7
JESD204C Enable
7.3.8.8
Multi-Device Synchronization and Deterministic Latency
7.3.8.9
Operation in Subclass 0 Systems
7.3.9
Alarm Monitoring
7.3.9.1
Clock Upset Detection
7.3.9.2
FIFO Upset Detection
7.4
Device Functional Modes
7.4.1
Dual-Channel Mode
7.4.2
Single-Channel Mode (DES Mode)
7.4.3
Dual-Input Single-Channel Mode (DUAL DES Mode)
7.4.4
JESD204C Modes
7.4.4.1
JESD204C Operating Modes Table
7.4.4.2
JESD204C Modes continued
7.4.4.3
JESD204C Transport Layer Data Formats
7.4.4.4
64B/66B Sync Header Stream Configuration
7.4.5
Power-Down Modes
7.4.6
Test Modes
7.4.6.1
Serializer Test-Mode Details
7.4.6.2
PRBS Test Modes
7.4.6.3
Clock Pattern Mode
7.4.6.4
Ramp Test Mode
7.4.6.5
Short and Long Transport Test Mode
7.4.6.5.1
Short Transport Test Pattern
7.4.6.6
D21.5 Test Mode
7.4.6.7
K28.5 Test Mode
7.4.6.8
Repeated ILA Test Mode
7.4.6.9
Modified RPAT Test Mode
7.4.7
Calibration Modes and Trimming
7.4.7.1
Foreground Calibration Mode
7.4.7.2
Background Calibration Mode
7.4.7.3
Low-Power Background Calibration (LPBG) Mode
7.4.8
Offset Calibration
7.4.9
Trimming
7.5
Programming
7.5.1
Using the Serial Interface
7.5.1.1
SCS
7.5.1.2
SCLK
7.5.1.3
SDI
7.5.1.4
SDO
7.5.1.5
Streaming Mode
7.6
SPI Register Map
8
Application Information Disclaimer
8.1
Application Information
8.2
Typical Applications
8.2.1
Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
8.2.1.1
Design Requirements
8.2.1.1.1
Input Signal Path
8.2.1.1.2
Clocking
8.2.1.1.3
ADC08DJ5200RF
8.3
Initialization Set Up
9
Power Supply Recommendations
9.1
Power Sequencing
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
123
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
AAV|144
MPBGAM2C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsn42a_oa
zhcsn42a_pm
11.1.1
Development Support
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