ZHCSTG4 October   2023 ADC12DJ5200-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 描述
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 5.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Comparison
      2. 6.3.2  Analog Inputs
        1. 6.3.2.1 Analog Input Protection
        2. 6.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.2.3 Analog Input Offset Adjust
      3. 6.3.3  ADC Core
        1. 6.3.3.1 ADC Theory of Operation
        2. 6.3.3.2 ADC Core Calibration
        3. 6.3.3.3 Analog Reference Voltage
        4. 6.3.3.4 ADC Over-range Detection
        5. 6.3.3.5 Code Error Rate (CER)
      4. 6.3.4  Temperature Monitoring Diode
      5. 6.3.5  Timestamp
      6. 6.3.6  Clocking
        1. 6.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 6.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 6.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 6.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 6.3.6.3.2 Automatic SYSREF Calibration
      7. 6.3.7  Programmable FIR Filter (PFIR)
        1. 6.3.7.1 Dual Channel Equalization
        2. 6.3.7.2 Single Channel Equalization
        3. 6.3.7.3 Time Varying Filter
      8. 6.3.8  Digital Down Converters (DDC)
        1. 6.3.8.1 Rounding and Saturation
        2. 6.3.8.2 Numerically-Controlled Oscillator and Complex Mixer
          1. 6.3.8.2.1 NCO Fast Frequency Hopping (FFH)
          2. 6.3.8.2.2 NCO Selection
          3. 6.3.8.2.3 Basic NCO Frequency Setting Mode
          4. 6.3.8.2.4 Rational NCO Frequency Setting Mode
          5. 6.3.8.2.5 NCO Phase Offset Setting
          6. 6.3.8.2.6 NCO Phase Synchronization
        3. 6.3.8.3 Decimation Filters
        4. 6.3.8.4 Output Data Format
        5. 6.3.8.5 Decimation Settings
          1. 6.3.8.5.1 Decimation Factor
          2. 6.3.8.5.2 DDC Gain Boost
      9. 6.3.9  JESD204C Interface
        1. 6.3.9.1 Transport Layer
        2. 6.3.9.2 Scrambler
        3. 6.3.9.3 Link Layer
        4. 6.3.9.4 8B/10B Link Layer
          1. 6.3.9.4.1 Data Encoding (8B/10B)
          2. 6.3.9.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 6.3.9.4.3 Code Group Synchronization (CGS)
          4. 6.3.9.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 6.3.9.4.5 Frame and Multiframe Monitoring
        5. 6.3.9.5 64B/66B Link Layer
          1. 6.3.9.5.1 64B/66B Encoding
          2. 6.3.9.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 6.3.9.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 6.3.9.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 6.3.9.5.3.2 Forward Error Correction (FEC) Mode
          4. 6.3.9.5.4 Initial Lane Alignment
          5. 6.3.9.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 6.3.9.6 Physical Layer
          1. 6.3.9.6.1 SerDes Pre-Emphasis
        7. 6.3.9.7 JESD204C Enable
        8. 6.3.9.8 Multi-Device Synchronization and Deterministic Latency
        9. 6.3.9.9 Operation in Subclass 0 Systems
      10. 6.3.10 Alarm Monitoring
        1. 6.3.10.1 Clock Upset Detection
        2. 6.3.10.2 FIFO Upset Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Dual-Channel Mode
      2. 6.4.2 Single-Channel Mode (DES Mode)
      3. 6.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 6.4.4 JESD204C Modes
        1. 6.4.4.1 JESD204C Operating Modes Table
        2. 6.4.4.2 JESD204C Modes continued
        3. 6.4.4.3 JESD204C Transport Layer Data Formats
        4. 6.4.4.4 64B/66B Sync Header Stream Configuration
      5. 6.4.5 Power-Down Modes
      6. 6.4.6 Test Modes
        1. 6.4.6.1 Serializer Test-Mode Details
        2. 6.4.6.2 PRBS Test Modes
        3. 6.4.6.3 Clock Pattern Mode
        4. 6.4.6.4 Ramp Test Mode
        5. 6.4.6.5 Short and Long Transport Test Mode
          1. 6.4.6.5.1 Short Transport Test Pattern
        6. 6.4.6.6 D21.5 Test Mode
        7. 6.4.6.7 K28.5 Test Mode
        8. 6.4.6.8 Repeated ILA Test Mode
        9. 6.4.6.9 Modified RPAT Test Mode
      7. 6.4.7 Calibration Modes and Trimming
        1. 6.4.7.1 Foreground Calibration Mode
        2. 6.4.7.2 Background Calibration Mode
        3. 6.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 6.4.8 Offset Calibration
      9. 6.4.9 Trimming
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
        1. 6.5.1.1 SCS
        2. 6.5.1.2 SCLK
        3. 6.5.1.3 SDI
        4. 6.5.1.4 SDO
        5. 6.5.1.5 Streaming Mode
    6. 6.6 SPI Register Map
  8. 7 Application Information Disclaimer
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Wideband RF Sampling Receiver
        1. 7.2.1.1 Design Requirements
          1. 7.2.1.1.1 Input Signal Path
          2. 7.2.1.1.2 Clocking
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Calculating Values of AC-Coupling Capacitors
        3. 7.2.1.3 Application Curves
    3. 7.3 Initialization Set Up
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 139
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5.2 Layout Example

Figure 7-7 to Figure 7-9 provide examples of the critical traces routed on the device evaluation module (EVM).

GUID-C37C1D77-8C6D-451C-A99F-D76CC5E5919B-low.pngFigure 7-7 Top Layer Routing: Analog Inputs, CLK and SYSREF, DA0-3, DB0-3
GUID-312BE00E-FBAF-4F5F-BD3D-0B5434FF9BA4-low.pngFigure 7-8 GND1 Cutouts to Optimize Impedance of Component Pads
GUID-76556C9E-9010-4493-BC50-F2A5064A2435-low.pngFigure 7-9 Bottom Layer Routing: Additional CLK Routing, DA4-7, DB4-7
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |