ZHCSE48B September   2015  – January 2019 ADC31JB68

PRODUCTION DATA.  

  1. 特性
    1. 18 英寸、5 密耳输出端的传输眼图。5Gb/s、带优化型去加重功能的 FR4 微带迹线
  2. 应用
  3. 说明
    1.     –1dBFS、450MHz 输入时的频谱
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Converter Performance
    6. 6.6 Electrical Characteristics: Power Supply
    7. 6.7 Electrical Characteristics: Interface
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Interface Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs and Input Buffer
      2. 8.3.2  Amplitude and Phase Imbalance Correction
      3. 8.3.3  Over-Range Detection
      4. 8.3.4  Input Clock Divider
      5. 8.3.5  SYSREF Detection Gate
      6. 8.3.6  Serial Differential Output Drivers
        1. 8.3.6.1 De-Emphasis Equalization
        2. 8.3.6.2 Serial Lane Inversion
      7. 8.3.7  ADC Core Calibration
      8. 8.3.8  Data Format
      9. 8.3.9  JESD204B Supported Features
      10. 8.3.10 JESD204B Interface
      11. 8.3.11 Transport Layer Configuration
        1. 8.3.11.1 Lane Configuration
        2. 8.3.11.2 Frame Format
        3. 8.3.11.3 ILA Information
      12. 8.3.12 Test Pattern Sequences
      13. 8.3.13 JESD204B Link Initialization
        1. 8.3.13.1 Frame Alignment
        2. 8.3.13.2 Code Group Synchronization
      14. 8.3.14 SPI
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down and Sleep Modes
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
        1. 8.5.1.1  CONFIG_A (address = 0x0000) [reset = 0x3C]
          1. Table 6. CONFIG_A
        2. 8.5.1.2  DEVICE CONFIG (address = 0x0002) [reset = 0x00]
          1. Table 7. DEVICE CONFIG
        3. 8.5.1.3  CHIP_TYPE (address = 0x0003 ) [reset = 0x03]
          1. Table 8. CHIP_TYPE
        4. 8.5.1.4  CHIP_ID (address = 0x0005, 0x0004) [reset = 0x00, 0x1B]
          1. Table 9. CHIP_ID
        5. 8.5.1.5  CHIP_VERSION (address =0x0006) [reset = 0x00]
          1. Table 10. CHIP_VERSION
        6. 8.5.1.6  VENDOR_ID (address = 0x000D, 0x000C) [reset = 0x04, 0x51]
          1. Table 11. VENDOR_ID
        7. 8.5.1.7  SPI_CFG (address = 0x0010 ) [reset = 0x01]
          1. Table 12. SPI_CFG
        8. 8.5.1.8  OM1 (Operational Mode 1) (address = 0x0012) [reset = 0xC1]
          1. Table 13. OM1 (Operational Mode 1)
        9. 8.5.1.9  OM2 (Operational Mode 2) (address = 0x0013) [reset = 0x20]
          1. Table 14. OM2 (Operational Mode 2)
        10. 8.5.1.10 IMB_ADJ (Imbalance Adjust) (address = 0x0014) [reset = 0x00]
          1. Table 15. IMB_ADJ (Imbalance Adjust)
        11. 8.5.1.11 OVR_EN (Over-Range Enable) (address = 0x003A) [reset = 0x00]
          1. Table 16. OVR_EN (Over-Range Enable)
        12. 8.5.1.12 OVR_HOLD (Over-Range Hold) (address = 0x003B) [reset = 0x00]
          1. Table 17. OVR_HOLD (Over-Range Hold)
        13. 8.5.1.13 OVR_TH (Over-Range Threshold) (address = 0x003C) [reset = 0x00]
          1. Table 18. OVR_TH (Over-Range Threshold)
        14. 8.5.1.14 DC_MODE (DC Offset Correction Mode) (address = 0x003D) [reset = 0x00]
          1. Table 19. DC_MODE (DC Offset Correction Mode)
        15. 8.5.1.15 SER_CFG (Serial Lane Transmitter Configuration) (address = 0x0047) [reset = 0x00]
          1. Table 20. SER_CFG (Serial Lane Transmitter Configuration)
        16. 8.5.1.16 JESD_CTRL1 (JESD Configuration Control 1) (address = 0x0060) [reset = 0x7F]
          1. Table 21. JESD_CTRL1 (JESD Configuration Control 1)
        17. 8.5.1.17 JESD_CTRL2 (JESD Configuration Control 2) (address = 0x0061) [reset = 0x00]
          1. Table 22. JESD_CTRL2 (JESD Configuration Control 2)
        18. 8.5.1.18 JESD_RSTEP (JESD Ramp Pattern Step) (address = 0x0063, 0x0062) [reset = 0x00, 0x01]
          1. Table 23. JESD_RSTEP (JESD Ramp Pattern Step)
        19. 8.5.1.19 SER_INV (Serial Lane Inversion Control) (address = 0x0064) [reset = 0x00]
          1. Table 24. SER_INV (Serial Lane Inversion Control)
        20. 8.5.1.20 JESD_STATUS (JESD Link Status) (address = 0x006C) [reset = N/A]
          1. Table 25. JESD_STATUS (JESD Link Status)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Optimizing Converter Performance
        1. 9.1.1.1 Internal Noise Sources
        2. 9.1.1.2 External Noise Sources
      2. 9.1.2 Analog Input Considerations
        1. 9.1.2.1 Differential Analog Inputs and Full Scale Range
        2. 9.1.2.2 Analog Input Network Model
        3. 9.1.2.3 Input Bandwidth
        4. 9.1.2.4 Driving the Analog Input
        5. 9.1.2.5 Clipping and Over-Range
      3. 9.1.3 CLKIN, SYSREF, and SYNCb Input Considerations
        1. 9.1.3.1 Driving the CLKIN+ and CLKIN– Input
        2. 9.1.3.2 Driving the SYSREF Input
        3. 9.1.3.3 SYSREF Signaling
        4. 9.1.3.4 SYSREF Timing
        5. 9.1.3.5 Effectively Using the Detection Gate Feature
        6. 9.1.3.6 Driving the SYNCb Input
      4. 9.1.4 Output Serial Interface Considerations
        1. 9.1.4.1 Output Serial-Lane Interface
        2. 9.1.4.2 Voltage Swing and De-Emphasis Optimization
        3. 9.1.4.3 Minimizing EMI
      5. 9.1.5 JESD204B System Considerations
        1. 9.1.5.1 Frame and LMFC Clock Alignment Procedure
        2. 9.1.5.2 Link Interruption
        3. 9.1.5.3 Clock Configuration Examples
      6. 9.1.6 SPI
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Design
    2. 10.2 Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关文档 
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

SPI

The SPI allows access to the internal configuration registers of the ADC through read and write commands to a specific address. The interface protocol has a 1-bit command, 15-bit address word and 8-bit data word as shown in Figure 37. A read or write command is 24 bits in total, starting with the read or write command bit where 0 indicates a write command and 1 indicates a read command. The read or write command bit is clocked into the device on the first rising edge of SCLK after CSb is asserted to 0. During a write command, the 15-bit address and 8-bit data values follow the read or write bit MSB-first and are latched on the rising edge of SCLK. During a read command, the SDO output is enabled shortly after the 16th rising edge of SCLK and outputs the read value MSB first before the SDO output is returned to a high impedance state. The read or write command is completed on the SCLK rising edge on which the data word’s LSB is latched. CSb may be de-asserted to 1 after the LSB is latched into the device.

The SPI allows command streaming where multiple commands are made without de-asserting CSb in-between commands. The commands in the stream must be of similar types, either read or write. Each subsequent command applies to the register address adjacent to the register accessed in the previous command. The address order can be configured as either ascending or descending. Command streaming is accomplished by immediately following a completed command with another set of 8 rising edges of SCLK without de-asserting CSb. During a write command, an 8-bit data word is input on the SDI input for each subsequent set of SCLK edges. During a read command, data is output from SDO for each subsequent set of SCLK edges. Each subsequent command is considered finished after the 8th rising edge of SCLK. De-asserting CSb aborts an incomplete command.

The SDO output is high impedance at all times other than during the final portion of a read command. During the time that the SDO output is active, the logic level is determined by a configuration register. The SPI output logic level must be properly configured after power up and before making a read command to prevent damaging the receiving device or any other device connected to the SPI bus. Until the SPI_CFG register is properly configured, voltages on the SDO output may be as high as the VA3.0 supply during a read command. The SDI, SCLK, and CSB pins are all 1.2-V to 3.0-V compatible.

ADC31JB68 SPI_Protocol_Diagram.gifFigure 37. Serial Interface Protocol