ZHCSEU3E July   2014  – June 2022 ADC3221 , ADC3222 , ADC3223 , ADC3224

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
    1.     Device Comparison Table
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions (1)
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics: ADC3221, ADC3222
    7. 6.7  Electrical Characteristics: ADC3223, ADC3224
    8. 6.8  AC Performance: ADC3221
    9. 6.9  AC Performance: ADC3222
    10. 6.10 AC Performance: ADC3223
    11. 6.11 AC Performance: ADC3224
    12. 6.12 Digital Characteristics
    13. 6.13 Timing Requirements: General
    14. 6.14 Timing Requirements: LVDS Output
    15. 6.15 Typical Characteristics: ADC3221
    16. 6.16 Typical Characteristics: ADC3222
    17. 6.17 Typical Characteristics: ADC3223
    18. 6.18 Typical Characteristics: ADC3224
    19. 6.19 Typical Characteristics: Common
    20. 6.20 Typical Characteristics: Contour
  7. 7 Parameter Measurement Information
    1. 7.1 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Using the SYSREF Input
        2. 8.3.2.2 SNR and Clock Jitter
      3. 8.3.3 Digital Output Interface
        1. 8.3.3.1 One-Wire Interface: 12X Serialization
        2. 8.3.3.2 Two-Wire Interface: 6X Serialization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Input Clock Divider
      2. 8.4.2 Chopper Functionality
      3. 8.4.3 Power-Down Control
        1. 8.4.3.1 Improving Wake-Up Time From Global Power-Down
      4. 8.4.4 Internal Dither Algorithm
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Register Initialization
          1. 8.5.1.1.1 Serial Register Write
          2. 8.5.1.1.2 Serial Register Readout
      2. 8.5.2 Register Initialization through SPI
    6. 8.6 Register Maps
      1. 8.6.1 Summary of Special Mode Registers
      2. 8.6.2 Serial Register Description
        1. 8.6.2.1  Register 01h
        2. 8.6.2.2  Register 03h
        3. 8.6.2.3  Register 04h
        4. 8.6.2.4  Register 05h
        5. 8.6.2.5  Register 06h
        6. 8.6.2.6  Register 07h
        7. 8.6.2.7  Register 09h
        8. 8.6.2.8  Register 0Ah
        9. 8.6.2.9  Register 0Bh
        10. 8.6.2.10 Register 0Eh
        11. 8.6.2.11 Register 0Fh
        12. 8.6.2.12 Register 13h
        13. 8.6.2.13 Register 15h
        14. 8.6.2.14 Register 25h
        15. 8.6.2.15 Register 27h
        16. 8.6.2.16 Register 41Dh
        17. 8.6.2.17 Register 422h
        18. 8.6.2.18 Register 434h
        19. 8.6.2.19 Register 439h
        20. 8.6.2.20 Register 51Dh
        21. 8.6.2.21 Register 522h
        22. 8.6.2.22 Register 534h
        23. 8.6.2.23 Register 539h
        24. 8.6.2.24 Register 608h
        25. 8.6.2.25 Register 70Ah
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Driving Circuit Design: Low Input Frequencies
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.12 Digital Characteristics

the dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1; AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DIGITAL INPUTS (RESET, SCLK, SDATA, SEN, PDN)
VIHHigh-level input voltageAll digital inputs support 1.8-V and 3.3-V CMOS logic levels1.3V
VILLow-level input voltageAll digital inputs support 1.8-V and 3.3-V CMOS logic levels0.4V
IIHHigh-level input currentRESET, SDATA, SCLK, PDNVHIGH = 1.8 V10µA
SEN(1)VHIGH = 1.8 V0
IILLow-level input currentRESET, SDATA, SCLK, PDNVLOW = 0 V0µA
SENVLOW = 0 V10
DIGITAL INPUTS (SYSREFP, SYSREFM)
Differential swing0.20.81V
Common-mode voltage for SYSREF(2)0.9V
DIGITAL OUTPUTS, CMOS INTERFACE (SDOUT)
VOHHigh-level output voltageDVDD – 0.1DVDDV
VOLLow-level output voltage00.1V
DIGITAL OUTPUTS, LVDS INTERFACE
VODHHigh-level output differential voltageWith an external
100-Ω termination		280350460mV
VODLLow-level output differential voltageWith an external
100-Ω termination		–460–350–280mV
VOCMOutput common-mode voltage1.05V
(1) SEN has an internal 150-kΩ pull-up resistor to AVDD. SPI pins (SEN, SCLK, SDATA) can be driven by 1.8-V or 3.3-V CMOS buffers.
(2) SYSREF is internally biased to 0.9 V.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |