ZHCSDY0A May   2014  – June 2015 ADC32J22 , ADC32J23 , ADC32J24 , ADC32J25

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics: ADC32J22, ADC32J23
    7. 7.7  Electrical Characteristics: ADC32J24, ADC32J25
    8. 7.8  AC Performance: ADC32J25
    9. 7.9  AC Performance: ADC32J24
    10. 7.10 AC Performance: ADC32J23
    11. 7.11 AC Performance: ADC32J22
    12. 7.12 Digital Characteristics
    13. 7.13 Timing Requirements
    14. 7.14 Typical Characteristics: ADC32J25
    15. 7.15 Typical Characteristics: ADC32J24
    16. 7.16 Typical Characteristics: ADC32J23
    17. 7.17 Typical Characteristics: ADC32J22
    18. 7.18 Typical Characteristics: Common Plots
    19. 7.19 Typical Characteristics: Contour Plots
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Inputs
      2. 9.3.2 Clock Input
        1. 9.3.2.1 SNR and Clock Jitter
        2. 9.3.2.2 Input Clock Divider
      3. 9.3.3 Power-Down Control
      4. 9.3.4 Internal Dither Algorithm
      5. 9.3.5 JESD204B Interface
        1. 9.3.5.1 JESD204B Initial Lane Alignment (ILA)
        2. 9.3.5.2 JESD204B Test Patterns
        3. 9.3.5.3 JESD204B Frame Assembly
        4. 9.3.5.4 Digital Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Gain
      2. 9.4.2 Overrange Indication
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Register Initialization
          1. 9.5.1.1.1 Serial Register Write
          2. 9.5.1.1.2 Serial Register Readout
      2. 9.5.2 Register Initialization
      3. 9.5.3 Start-Up Sequence
    6. 9.6 Register Maps
      1. 9.6.1 Summary of Special Mode Registers
      2. 9.6.2 Serial Register Descriptions
        1. 9.6.2.1  Register 01h (address = 01h)
        2. 9.6.2.2  Register 03h (address = 03h)
        3. 9.6.2.3  Register 04h (address = 04h)
        4. 9.6.2.4  Register 06h (address = 06h)
        5. 9.6.2.5  Register 07h (address = 07h)
        6. 9.6.2.6  Register 08h (address = 08h)
        7. 9.6.2.7  Register 09h (address = 09h)
        8. 9.6.2.8  Register 0Ah (address = 0Ah)
        9. 9.6.2.9  Register 0Bh (address = 0Bh)
        10. 9.6.2.10 Register 0Ch (address = 0Ch)
        11. 9.6.2.11 Register 0Dh (address = 0Dh)
        12. 9.6.2.12 Register 0Eh (address = 0Eh)
        13. 9.6.2.13 Register 0Fh (address = 0Fh)
        14. 9.6.2.14 Register 13h (address = 13h)
        15. 9.6.2.15 Register 15h (address = 15h)
        16. 9.6.2.16 Register 27h (address = 27h)
        17. 9.6.2.17 Register 2Ah (address = 2Ah)
        18. 9.6.2.18 Register 2Bh (address = 2Bh)
        19. 9.6.2.19 Register 2Fh (address = 2Fh)
        20. 9.6.2.20 Register 30h (address = 30h)
        21. 9.6.2.21 Register 31h (address = 31h)
        22. 9.6.2.22 Register 34h (address = 34h)
        23. 9.6.2.23 Register 3Ah (address = 3Ah)
        24. 9.6.2.24 Register 3Bh (address = 3Bh)
        25. 9.6.2.25 Register 3Ch (address = 3Ch)
        26. 9.6.2.26 Register 422h (address = 422h)
        27. 9.6.2.27 Register 434h (address = 434h)
        28. 9.6.2.28 Register 522h (address = 522h)
        29. 9.6.2.29 Register 534 (address = 534h)
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Driving Circuit Design: Low Input Frequencies
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 相关链接
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 相关链接

Table 42 列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件，并且可以快速访问样片或购买链接。

Table 42. 相关链接

器件 米6体育平台手机版_好二三四文件夹 样片与购买 技术文档 工具与软件 支持与社区
ADC32J22 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADC32J23 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADC32J24 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADC32J25 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

13.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 商标

E2E is a trademark of Texas Instruments.

PowerPAD is a trademark of Texas Instruments, Inc.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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