ZHCSDC0A May   2014  – January 2015 ADC34J22 , ADC34J23 , ADC34J24 , ADC34J25

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Summary of Special Mode Registers
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics: ADC34J24, ADC34J25
    7. 7.7  Electrical Characteristics: ADC34J22, ADC34J23
    8. 7.8  Electrical Characteristics: General
    9. 7.9  AC Performance: ADC34J25
    10. 7.10 AC Performance: ADC34J24
    11. 7.11 AC Performance: ADC34J23
    12. 7.12 AC Performance: ADC34J22
    13. 7.13 Digital Characteristics
    14. 7.14 Timing Characteristics
    15. 7.15 Typical Characteristics: ADC34J25
    16. 7.16 Typical Characteristics: ADC34J24
    17. 7.17 Typical Characteristics: ADC34J23
    18. 7.18 Typical Characteristics: ADC34J22
    19. 7.19 Typical Characteristics: Common Plots
    20. 7.20 Typical Characteristics: Contour Plots
  8. Parameter Measurement Information
    1. 8.1 Timing Diagrams
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Inputs
      2. 9.3.2 Clock Input
        1. 9.3.2.1 SNR and Clock Jitter
        2. 9.3.2.2 Input Clock Divider
      3. 9.3.3 Power-Down Control
      4. 9.3.4 Internal Dither Algorithm
      5. 9.3.5 JESD204B Interface
        1. 9.3.5.1 JESD204B Initial Lane Alignment (ILA)
        2. 9.3.5.2 JESD204B Test Patterns
        3. 9.3.5.3 JESD204B Frame Assembly
        4. 9.3.5.4 Digital Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Gain
      2. 9.4.2 Overrange Indication
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Register Initialization
          1. 9.5.1.1.1 Serial Register Write
          2. 9.5.1.1.2 Serial Register Readout
      2. 9.5.2 Register Initialization
      3. 9.5.3 Start-Up Sequence
    6. 9.6 Register Map
      1. 9.6.1 Serial Register Description
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Driving Circuit Design: Low Input Frequencies
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 相关链接
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 相关链接

Table 48 列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件,并且可以快速访问样片或购买链接。

13.2 商标

PowerPAD is a trademark of Texas Instruments, Inc.

All other trademarks are the property of their respective owners.

13.3 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.4 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。