ZHCSQN6 May   2022 ADC3644

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Power Consumption
    6. 6.6 Electrical Characteristics - DC Specifications
    7. 6.7 Electrical Characteristics - AC Specifications
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Bandwidth
        2. 8.3.1.2 Analog Front End Design
          1. 8.3.1.2.1 Sampling Glitch Filter Design
          2. 8.3.1.2.2 Single Ended Input
          3. 8.3.1.2.3 Analog Input Termination and DC Bias
            1. 8.3.1.2.3.1 AC-Coupling
            2. 8.3.1.2.3.2 DC-Coupling
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Clock Amplitude
        2. 8.3.2.2 Single Ended vs Differential Clock Input
      3. 8.3.3 Voltage Reference
        1. 8.3.3.1 Internal voltage reference
        2. 8.3.3.2 External voltage reference (VREF)
        3. 8.3.3.3 External voltage reference with internal buffer (REFBUF)
      4. 8.3.4 Digital Down Converter
        1. 8.3.4.1 DDC MUX
        2. 8.3.4.2 Digital Filter Operation
        3. 8.3.4.3 FS/4 Mixing with Real Output
        4. 8.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 8.3.4.5 Decimation Filter
        6. 8.3.4.6 SYNC
        7. 8.3.4.7 Output Formatting with Decimation
          1. 8.3.4.7.1 Parallel CMOS
          2. 8.3.4.7.2 Serialized CMOS Interface
      5. 8.3.5 Digital Interface
        1. 8.3.5.1 Parallel CMOS Output
        2. 8.3.5.2 Serialized CMOS output
          1. 8.3.5.2.1 SDR Output Clocking
        3. 8.3.5.3 Output Data Format
        4. 8.3.5.4 Output Formatter
        5. 8.3.5.5 Output Bit Mapper
        6. 8.3.5.6 Output Interface or Mode Configuration
          1. 8.3.5.6.1 Configuration Example
      6. 8.3.6 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal operation
      2. 8.4.2 Power Down Options
    5. 8.5 Programming
      1. 8.5.1 Configuration using PINs only
      2. 8.5.2 Configuration using the SPI interface
        1. 8.5.2.1 Register Write
        2. 8.5.2.2 Register Read
    6. 8.6 Register Maps
      1. 8.6.1 Detailed Register Description
  9. 9 Application Information Disclaimer
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Signal Path
        2. 9.1.2.2 Sampling Clock
        3. 9.1.2.3 Voltage Reference
      3. 9.1.3 Application Curves
    2. 9.2 Initialization Set Up
      1. 9.2.1 Register Initialization During Operation
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support (Optional)
      1. 10.1.1 Development Support (Optional)
      2. 10.1.2 Device Nomenclature (Optional)
    2. 10.2 Documentation Support (if applicable)
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics - Power Consumption

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD, IOVDD = 1.8 V, external 1.6 V reference, 5 pF output load, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power Consumption
IAVDD Analog supply current External reference 65 79 mA
IIOVDD I/O supply current(1) DDR CMOS 26 39
PDIS Power dissipation(1) External reference, DDR CMOS 164 212 mW
IIOVDD I/O supply current(1) 29 mA
MISCELLANEOUS
IAVDD Internal reference, additional analog supply current 3 mA
External reference, Internal reference buffer (REFBUF), additional analog supply current 0.5
Single ended clock input, reduces analog supply current by Enabled via SPI 1
PDIS Power consumption in global power down mode Default mask settings, internal reference 5 mW
Default mask settings, external reference 9
(1) Measured with a full-scale sine wave input signal with ~ 5 pF loading on each CMOS output pin.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |