米6体育平台手机版

ZHCSSA6C september 2009 – june 2023 ADS1000-Q1

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		DBV (SOT-23)	UNIT
THERMAL METRIC⁽¹⁾		6 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	182.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	126.5	°C/W
R_θJB	Junction-to-board thermal resistance	34.1	°C/W
ψ_JT	Junction-to-top characterization parameter	20.7	°C/W
ψ_JB	Junction-to-board characterization parameter	33.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.