ZHCSAJ4D November   2012  – September 2019 ADS1018

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      K 型热电偶测量使用集成温度传感器进行冷结点补偿
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Temperature Sensor
        1. 8.3.6.1 Converting from Temperature to Digital Codes
        2. 8.3.6.2 Converting from Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Mode and Power-Down
        2. 8.4.2.2 Continuous-Conversion Mode
      3. 8.4.3 Duty Cycling for Low Power
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Chip Select (CS)
      3. 8.5.3 Serial Clock (SCLK)
      4. 8.5.4 Data Input (DIN)
      5. 8.5.5 Data Output and Data Ready (DOUT/DRDY)
      6. 8.5.6 Data Format
      7. 8.5.7 Data Retrieval
        1. 8.5.7.1 32-Bit Data Transmission Cycle
        2. 8.5.7.2 16-Bit Data Transmission Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Conversion Register [reset = 0000h]
        1. Table 4. Conversion Register Field Descriptions
      2. 8.6.2 Config Register [reset = 058Bh]
        1. Table 5. Config Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 GPIO Ports for Communication
      3. 9.1.3 Analog Input Filtering
      4. 9.1.4 Single-Ended Inputs
      5. 9.1.5 Connecting Multiple Devices
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (November 2015) to D Revision

  • Changed maximum VDD voltage from 5.5 V to 7 V in the Absolute Maximum Ratings tableGo
  • Changed bit description of Config Register bit 0Go

Changes from B Revision (October 2013) to C Revision

  • Added 添加了 ESD 额定值 表、特性 说明 部分，噪声性能部分，器件功能模式部分，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • 已更改标题，说明部分，特性部分以及首页框图Go
  • Changed title from Product Family to Device Comparison Table and deleted Package Designator columnGo
  • Updated descriptions and changed name of I/O column in Pin Configurations and Functions tableGo
  • Changed digital input voltage range and added minimum specification for TJ in Absolute Maximum Ratings tableGo
  • Added Differential input impedance specification in Electrical CharacteristicsGo
  • Changed Condition statement in Timing Requirements: Serial InterfaceGo
  • Moved tCSDOD, tDOPD, and tCSDOZ parameters from Timing Requirements to Switching CharacteristicsGo
  • Moved tCSDOD and tCSDOZ values from MIN column to MAX column.Go
  • Deleted Figure 7, Noise PlotGo
  • Updated Overview section and deleted "Gain = 2/3, 1, 2, 4, 8, or 16" from Functional Block DiagramGo
  • Updated Analog Inputs sectionGo
  • Updated Full-Scale Range (FSR) and LSB Size sectionGo
  • Updated Reset and Power Up sectionGo
  • Updated 32-Bit Data Transmission Cycle sectionGo
  • Updated Register Maps sectionGo
  • Updated Application Information sectionGo
  • Updated Figure 21Go
  • Deleted Thermocouple Measurement With Cold Junction Temperature section, and moved Figure 23 to Typical Application sectionGo

Changes from A Revision (December 2012) to B Revision

  • Deleted 器件图片Go
  • Changed bit 1 to NOP0 in Table 5Go
  • Changed NOP bit description in Table 5: changed bits[2:0] to bits [2:1] and changed NOP to NOP[1:0]Go

Changes from * Revision (November 2012) to A Revision

  • 已更新首页图片Go
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