ZHCSQZ9A March   2022  – October 2022 ADS117L11

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements (1.65 V ≤ IOVDD ≤ 2 V)
    7. 6.7  Switching Characteristics (1.65 V ≤ IOVDD ≤ 2 V)
    8. 6.8  Timing Requirements (2 V < IOVDD ≤ 5.5 V)
    9. 6.9  Switching Characteristics (2 V < IOVDD ≤ 5.5 V)
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  Offset Error Measurement
    2. 7.2  Offset Drift Measurement
    3. 7.3  Gain Error Measurement
    4. 7.4  Gain Drift Measurement
    5. 7.5  NMRR Measurement
    6. 7.6  CMRR Measurement
    7. 7.7  PSRR Measurement
    8. 7.8  INL Error Measurement
    9. 7.9  THD Measurement
    10. 7.10 SFDR Measurement
    11. 7.11 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input (AINP, AINN)
        1. 8.3.1.1 Input Range
      2. 8.3.2 Reference Voltage (REFP, REFN)
        1. 8.3.2.1 Reference Voltage Range
      3. 8.3.3 Clock Operation
        1. 8.3.3.1 Internal Oscillator
        2. 8.3.3.2 External Clock
      4. 8.3.4 Modulator
      5. 8.3.5 Digital Filter
        1. 8.3.5.1 Wideband Filter
        2. 8.3.5.2 Low-Latency Filter (Sinc)
          1. 8.3.5.2.1 Sinc4 Filter
          2. 8.3.5.2.2 Sinc4 + Sinc1 Filter
          3. 8.3.5.2.3 Sinc3 Filter
          4. 8.3.5.2.4 Sinc3 + Sinc1 Filter
      6. 8.3.6 Power Supplies
        1. 8.3.6.1 AVDD1 and AVSS
        2. 8.3.6.2 AVDD2
        3. 8.3.6.3 IOVDD
        4. 8.3.6.4 Power-On Reset (POR)
        5. 8.3.6.5 CAPA and CAPD
      7. 8.3.7 VCM Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Scalable Speed Modes
      2. 8.4.2 Idle Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Reset
        1. 8.4.5.1 RESET Pin
        2. 8.4.5.2 Reset by SPI Register Write
        3. 8.4.5.3 Reset by SPI Input Pattern
      6. 8.4.6 Synchronization
        1. 8.4.6.1 Synchronized Control Mode
        2. 8.4.6.2 Start/Stop Control Mode
        3. 8.4.6.3 One-Shot Control Mode
      7. 8.4.7 Conversion-Start Delay Time
      8. 8.4.8 Calibration
        1. 8.4.8.1 OFFSET2, OFFSET1, OFFSET0 Calibration Registers (Addresses 9h, Ah, Bh)
        2. 8.4.8.2 GAIN2, GAIN1, GAIN0 Calibration Registers (Addresses 0Ch, 0Dh, 0Eh)
        3. 8.4.8.3 Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface (SPI)
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output/Data Ready (SDO/DRDY)
      2. 8.5.2 SPI Frame
      3. 8.5.3 SPI CRC
      4. 8.5.4 Register Map CRC
      5. 8.5.5 Full-Duplex Operation
      6. 8.5.6 Device Commands
        1. 8.5.6.1 No-Operation
        2. 8.5.6.2 Read Register Command
        3. 8.5.6.3 Write Register Command
      7. 8.5.7 Read Conversion Data
        1. 8.5.7.1 Conversion Data
        2. 8.5.7.2 Data Ready
          1. 8.5.7.2.1 DRDY
          2. 8.5.7.2.2 SDO/DRDY
          3. 8.5.7.2.3 DRDY Bit
          4. 8.5.7.2.4 Clock Counting
        3. 8.5.7.3 STATUS Header
      8. 8.5.8 Daisy-Chain Operation
      9. 8.5.9 3-Wire SPI Mode
        1. 8.5.9.1 3-Wire SPI Mode Frame Reset
    6. 8.6 Registers
      1. 8.6.1  DEV_ID Register (Address = 0h) [reset = 01h]
      2. 8.6.2  REV_ID Register (Address = 1h) [reset = xxh]
      3. 8.6.3  STATUS Register (Address = 2h) [reset = x1100xxxb]
      4. 8.6.4  CONTROL Register (Address = 3h) [reset = 00h]
      5. 8.6.5  MUX Register (Address = 4h) [reset = 00h]
      6. 8.6.6  CONFIG1 Register (Address = 5h) [reset = 00h]
      7. 8.6.7  CONFIG2 Register (Address = 6h) [reset = 00h]
      8. 8.6.8  CONFIG3 Register (Address = 7h) [reset = 00h]
      9. 8.6.9  CONFIG4 Register (Address = 8h) [reset = 08h]
      10. 8.6.10 OFFSET2, OFFSET1, OFFSET0 Registers (Addresses = 9h, Ah, Bh) [reset = 00h, 00h, 00h]
      11. 8.6.11 GAIN2, GAIN1, GAIN0 Registers (Addresses = Ch, Dh, Eh) [reset = 40h, 00h, 00h]
      12. 8.6.12 CRC Register (Address = Fh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
      4. 9.1.4 Simultaneous-Sampling Systems
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RUK|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Timing Requirements (1.65 V ≤ IOVDD ≤ 2 V)

over operating ambient temperature range, unless otherwise noted
MIN MAX UNIT
tc(CLK) CLK period, high-speed mode 38.2 2000 ns
CLK period, low-speed mode, CLK_DIV = 1b 38.2 2000
CLK period, low-speed mode, CLK_DIV = 0b 305 2000
tw(CLKL) Pulse duration, CLK low 17 ns
Pulse duration, CLK low, low-speed mode, CLK_DIV = 0b 128
tw(CLKH) Pulse duration, CLK high 17 ns
Pulse duration, CLK high, low-speed mode, CLK_DIV = 0b 128
SERIAL INTERFACE
tc(SC) SCLK period 25 1/(4 ∙ fDATA) ns
tw(SCL) Pulse duration, SCLK low 10 ns
tw(SCH) Pulse duration, SCLK high 10 ns
td(CSSC) Delay time, first SCLK rising edge after CS falling edge 10 ns
tsu(DI) Setup time, SDI valid before SCLK falling edge 4 ns
th(DI) Hold time, SDI valid after SCLK falling edge 6 ns
td(SCCS) Delay time, CS rising edge after final SCLK falling edge 10 ns
tw(CSH) Pulse duration, CS high 20 ns
RESET PIN
tw(RSL) Pulse duration, RESET low 4 tCLK
td(RSSC) Delay time, communication start after RESET rising edge or after SPI RESET pattern 10000 tCLK
START PIN
tw(STL) Pulse duration, START low 4 tCLK
tw(STH) Pulse duration, START high 4 tCLK
tsu(STCLK) Setup time, START transition before CLK rising edge (1) 9 ns
th(STCLK) Hold time, START transition after CLK rising edge (1) 12 ns
tsu(STDR) Setup time, START falling edge or STOP bit before DRDY falling edge to stop next conversion (start/stop conversion mode) 8 tCLK
(1) START transition should not occur in the interval between the setup and hold times of the rising edge of CLK
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |