ZHCSJC0 January   2019 ADS1260-Q1 , ADS1261-Q1

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Analog Inputs
        1. 9.3.1.1 ESD Diodes
        2. 9.3.1.2 Input Multiplexer
        3. 9.3.1.3 Temperature Sensor
        4. 9.3.1.4 Power-Supply Readback
        5. 9.3.1.5 Inputs Open
        6. 9.3.1.6 Internal VCOM Connection
        7. 9.3.1.7 Alternate Functions
      2. 9.3.2  PGA
        1. 9.3.2.1 PGA Bypass Mode
        2. 9.3.2.2 PGA Voltage Monitor
      3. 9.3.3  Reference Voltage
        1. 9.3.3.1 Internal Reference
        2. 9.3.3.2 External Reference
        3. 9.3.3.3 AVDD - AVSS Reference (Default)
        4. 9.3.3.4 Reference Monitor
      4. 9.3.4  Level-Shift Voltage (VBIAS)
      5. 9.3.5  Burn-Out Current Sources
      6. 9.3.6  Sensor-Excitation Current Sources (IDAC1 and IDAC2)
      7. 9.3.7  General-Purpose Input/Outputs (GPIOs)
      8. 9.3.8  Oversampling
      9. 9.3.9  Modulator
      10. 9.3.10 Digital Filter
        1. 9.3.10.1 Sinc Filter
          1. 9.3.10.1.1 Sinc Filter Frequency Response
        2. 9.3.10.2 FIR Filter
          1. 9.3.10.2.1 FIR Filter Frequency Response
        3. 9.3.10.3 Filter Bandwidth
        4. 9.3.10.4 50-Hz and 60-Hz Normal Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Chop Mode
      3. 9.4.3 AC-Excitation Mode
      4. 9.4.4 ADC Clock Mode
      5. 9.4.5 Power-Down Mode
        1. 9.4.5.1 Hardware Power-Down
        2. 9.4.5.2 Software Power-Down
      6. 9.4.6 Reset
        1. 9.4.6.1 Power-on Reset
        2. 9.4.6.2 Reset by Pin
        3. 9.4.6.3 Reset by Command
      7. 9.4.7 Calibration
        1. 9.4.7.1 Offset and Full-Scale Calibration
          1. 9.4.7.1.1 Offset Calibration Registers
          2. 9.4.7.1.2 Full-Scale Calibration Registers
        2. 9.4.7.2 Offset Self-Calibration (SFOCAL)
        3. 9.4.7.3 Offset System-Calibration (SYOCAL)
        4. 9.4.7.4 Full-Scale Calibration (GANCAL)
        5. 9.4.7.5 Calibration Command Procedure
        6. 9.4.7.6 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
        5. 9.5.1.5 Serial Interface Auto-Reset
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status byte (STATUS)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 CRC
      5. 9.5.5 Commands
        1. 9.5.5.1  NOP Command
        2. 9.5.5.2  RESET Command
        3. 9.5.5.3  START Command
        4. 9.5.5.4  STOP Command
        5. 9.5.5.5  RDATA Command
        6. 9.5.5.6  SYOCAL Command
        7. 9.5.5.7  GANCAL Command
        8. 9.5.5.8  SFOCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
        11. 9.5.5.11 LOCK Command
        12. 9.5.5.12 UNLOCK Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = xxh]
        1. Table 30. ID Register Field Descriptions
      2. 9.6.2  Device Status (STATUS) Register (address = 01h) [reset = 01h]
        1. Table 31. STATUS Register Field Descriptions
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 32. MODE0 Register Field Descriptions
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 33. MODE1 Register Field Descriptions
      5. 9.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 34. MODE2 Register Field Descriptions
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 35. MODE3 Register Field Descriptions
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 36. REF Register Field Descriptions
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 37. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 38. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 9.6.10 IDAC Multiplexer (IMUX) Register (address = 0Dh) [reset = FFh]
        1. Table 39. IMUX Register Field Descriptions
      11. 9.6.11 IDAC Magnitude (IMAG) Register (address = 0Eh) [reset = 00h]
        1. Table 40. IMAG Register Field Descriptions
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 41. RESERVED Register Field Descriptions
      13. 9.6.13 PGA Configuration (PGA) Register (address = 10h) [reset = 00h]
        1. Table 42. PGA Register Field Descriptions
      14. 9.6.14 Input Multiplexer (INPMUX) Register (address = 11h) [reset = FFh]
        1. Table 43. INPMUX Register Field Descriptions
      15. 9.6.15 Input Bias (INPBIAS) Register (address = 12h) [reset = 00h]
        1. Table 44. INPBIAS Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Range
      2. 10.1.2 Input Overload
      3. 10.1.3 Burn-Out Current Source
      4. 10.1.4 Unused Inputs and Outputs
      5. 10.1.5 AC-Excitation
      6. 10.1.6 Serial Interface and Digital Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.4.7.6 User Calibration Procedure

To user calibrate, apply the calibration voltage, acquire conversion data, and compute the calibration value. The computed value is written to the corresponding calibration registers. Before starting calibration, preset the offset and full-scale registers to 000000h and 400000h, respectively.

To offset calibrate, short the ADC inputs (or inputs to the system) and average n number of the conversion results. Averaging conversion data reduces noise to improve calibration accuracy. Write the averaged value of the conversion data to the offset registers.

To gain calibrate using a full scale calibration voltage, temporarily reduce the full scale register 95% to avoid output clipped codes (set FSCAL[2:0] to 3CCCCCh). Acquire n number of conversions and average the conversions to reduce noise to improve calibration accuracy. Compute the full-scale calibration value as shown in Equation 7:

Equation 7. Full-Scale Calibration Value = Expected Code / Actual Code · 400000h

where

  • Expected code = 799998h using full scale calibration signal and 95% scale factor
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