ZHCSIS6B September   2018  – December 2018 ADS1278-SP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: SPI Format
    7. 7.7 Timing Requirements: Frame-Sync Format
    8. 7.8 Quality Conformance Inspection
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Sampling Aperture Matching
      2. 8.3.2  Frequency Response
        1. 8.3.2.1 High-Speed, Low-Power, And Low-Speed Modes
        2. 8.3.2.2 High-Resolution Mode
      3. 8.3.3  Phase Response
      4. 8.3.4  Settling Time
      5. 8.3.5  Data Format
      6. 8.3.6  Analog Inputs (AINP, AINN)
      7. 8.3.7  Voltage Reference Inputs (VREFP, VREFN)
      8. 8.3.8  Clock Input (CLK)
      9. 8.3.9  Mode Selection (MODE)
      10. 8.3.10 Synchronization (SYNC)
      11. 8.3.11 Power-Down (PWDN)
      12. 8.3.12 Format[2:0]
      13. 8.3.13 Serial Interface Protocols
      14. 8.3.14 SPI Serial Interface
        1. 8.3.14.1 SCLK
        2. 8.3.14.2 DRDY/FSYNC (SPI Format)
        3. 8.3.14.3 DOUT
        4. 8.3.14.4 DIN
      15. 8.3.15 Frame-Sync Serial Interface
        1. 8.3.15.1 SCLK
        2. 8.3.15.2 DRDY/FSYNC (Frame-Sync Format)
        3. 8.3.15.3 DOUT
        4. 8.3.15.4 DIN
      16. 8.3.16 DOUT Modes
        1. 8.3.16.1 TDM Mode
        2. 8.3.16.2 TDM Mode, Fixed-Position Data
        3. 8.3.16.3 TDM Mode, Dynamic Position Data
        4. 8.3.16.4 Discrete Data Output Mode
      17. 8.3.17 Daisy-Chaining
      18. 8.3.18 Modulator Output
      19. 8.3.19 Pin Test Using Test[1:0] Inputs
      20. 8.3.20 VCOM Output
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVDD to AGND –0.3 6 V
AGND to DGND –0.3 0.3 V
DVDD, IOVDD to DGND –0.3 3.6 V
Input current Momentary 100 mA
Continuous 10
Analog input to AGND –0.3 AVDD + 0.3 V
Digital input or output to DGND –0.3 DVDD + 0.3 V
Junction temperature HFQ and HKP Packages –55 217 °C
D Package –55 175
Storage temperature, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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