ZHCSK67B June   2017  – August 2019 ADS1287

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      功能方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input and Multiplexer
      2. 8.3.2 Programmable Gain Amplifier (PGA)
      3. 8.3.3 Modulator
        1. 8.3.3.1 Modulator Overrange
      4. 8.3.4 Voltage Reference Inputs (REFP, REFN)
      5. 8.3.5 Digital Filter
        1. 8.3.5.1 Sinc Filter Stage
        2. 8.3.5.2 FIR Filter Stage
        3. 8.3.5.3 Group Delay and Step Response
          1. 8.3.5.3.1 Linear Phase Response
          2. 8.3.5.3.2 Minimum Phase Response
        4. 8.3.5.4 HPF Stage
      6. 8.3.6 Reset (RESET Pin and Reset Command)
      7. 8.3.7 Master Clock Input (CLK)
    4. 8.4 Device Functional Modes
      1. 8.4.1  Operational Mode
      2. 8.4.2  Chop Mode
      3. 8.4.3  Offset
      4. 8.4.4  Power-Down Mode
      5. 8.4.5  Standby Mode
      6. 8.4.6  Synchronization
        1. 8.4.6.1 Pulse-Sync Mode
        2. 8.4.6.2 Continuous-Sync Mode
      7. 8.4.7  Reading Data
        1. 8.4.7.1 Read-Data-Continuous Mode (RDATAC)
        2. 8.4.7.2 Stop-Read-Data-Continuous-Mode (SDATAC)
      8. 8.4.8  Conversion Data Format
      9. 8.4.9  Offset and Full-Scale Calibration Registers
        1. 8.4.9.1 OFC[2:0] Registers
        2. 8.4.9.2 FSC[2:0] Registers
      10. 8.4.10 Calibration Command
        1. 8.4.10.1 OFSCAL Command
        2. 8.4.10.2 GANCAL Command
      11. 8.4.11 User Calibration
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output (DOUT)
        5. 8.5.1.5 Serial Interface Timeout
        6. 8.5.1.6 Data Ready (DRDY)
      2. 8.5.2 Commands
        1. 8.5.2.1  WAKEUP: Wake Up Command
        2. 8.5.2.2  STANDBY: Standby Mode Command
        3. 8.5.2.3  SYNC: Synchronize ADC Conversions
        4. 8.5.2.4  RESET: Reset Command
        5. 8.5.2.5  RDATAC: Read Data Continuous Mode Command
        6. 8.5.2.6  SDATAC: Stop Read Data Continuous Mode Command
        7. 8.5.2.7  RDATA: Read Data Command
        8. 8.5.2.8  RREG: Read Register Data Command
        9. 8.5.2.9  WREG: Write Register Data Command
        10. 8.5.2.10 OFSCAL: Offset Calibration Command
        11. 8.5.2.11 GANCAL: Gain Calibration Command
    6. 8.6 Register Map
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1 ID/CFG: ID, Configuration Register (address = 00h) [reset = x0h]
          1. Table 22. ID/CFG Register Field Descriptions
        2. 8.6.1.2 CONFIG0: Configuration Register 0 (address = 01h) [reset = 52h]
          1. Table 23. CONFIG0 Register Field Descriptions
        3. 8.6.1.3 CONFIG1: Configuration Register 1 (address = 02h) [reset = 08h]
          1. Table 24. CONFIG1 Register Field Descriptions
        4. 8.6.1.4 High-Pass Filter Corner Frequency (HPFx) Registers (address = 03h, 04h) [reset = 32h, 03h]
          1. Table 25. HPF0, HPF1 Registers Field Description
        5. 8.6.1.5 Offset Calibration (OFCx) Registers (address = 05h, 06h, 07h) [reset = 00h, 00h, 00h]
          1. Table 26. OFC0, OFC1, OFC2 Registers Field Description
        6. 8.6.1.6 Full-Scale Calibration (FSCx) Registers (address = 08h, 09h, 0Ah) [reset = 00h, 00h, 40h]
          1. Table 27. FSC0, FSC1, FSC2 Registers Field Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Geophone Application
      2. 9.2.2 Digital Interface
    3. 9.3 Initialization Set Up
  10. 10Power Supply Recommendations
    1. 10.1 Analog Power Supplies
    2. 10.2 Digital Power Supply
    3. 10.3 Power-Supply Sequence
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RHF|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) ADS1287 UNIT
RHF (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 30.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.5 °C/W
RθJB Junction-to-board thermal resistance 8.5 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 8.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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