ZHCSN81 july   2023 ADS131B23-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Offset Drift Measurement
    2. 8.2 Gain Drift Measurement
    3. 8.3 Noise Performance
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Naming Conventions
      2. 9.3.2 Precision Voltage References (REFA, REFB)
      3. 9.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 9.3.4 ADC1y
        1. 9.3.4.1 ADC1y Input Multiplexer
        2. 9.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 9.3.4.3 ADC1y ΔΣ Modulator
        4. 9.3.4.4 ADC1y Digital Filter
        5. 9.3.4.5 ADC1y Offset and Gain Calibration
        6. 9.3.4.6 ADC1y Conversion Data
      5. 9.3.5 ADC2y
        1. 9.3.5.1 ADC2y Input Multiplexer
        2. 9.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 9.3.5.3 ADC2y ΔΣ Modulator
        4. 9.3.5.4 ADC2y Digital Filter
        5. 9.3.5.5 ADC2y Offset and Gain Calibration
        6. 9.3.5.6 ADC2y Sequencer
        7. 9.3.5.7 VCMy Buffers
        8. 9.3.5.8 ADC2y Measurement Configurations
        9. 9.3.5.9 ADC2y Conversion Data
      6. 9.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 9.3.6.1 GPIOx PWM Output Configuration
        2. 9.3.6.2 GPIOx PWM Input Readback
      7. 9.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 9.3.8 Monitors and Diagnostics
        1. 9.3.8.1  Supply Monitors
        2. 9.3.8.2  Clock Monitors
        3. 9.3.8.3  Digital Monitors
          1. 9.3.8.3.1 Register Map CRC
          2. 9.3.8.3.2 Memory Map CRC
          3. 9.3.8.3.3 GPIO Readback
        4. 9.3.8.4  Communication Monitors
        5. 9.3.8.5  Fault Flags and Fault Masking
        6. 9.3.8.6  FAULT Pin
        7. 9.3.8.7  Diagnostics and Diagnostic Procedure
        8. 9.3.8.8  Indicators
        9. 9.3.8.9  Conversion and Sequence Counters
        10. 9.3.8.10 Supply Voltage Readback
        11. 9.3.8.11 Temperature Sensor (TSA)
        12. 9.3.8.12 Test DACs (TDACA, TDACB)
        13. 9.3.8.13 Open-Wire Detection
        14. 9.3.8.14 Missing Host Detection and MHD Pin
        15. 9.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 9.3.8.15.1 OCCA and OCCB Pins
          2. 9.3.8.15.2 Overcurrent Indication Response Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset (POR)
        2. 9.4.1.2 RESETn Pin
        3. 9.4.1.3 RESET Command
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Active Mode
        2. 9.4.2.2 Standby Mode
        3. 9.4.2.3 Power-Down Mode
      3. 9.4.3 ADC Conversion Modes
        1. 9.4.3.1 ADC1y Conversion Modes
          1. 9.4.3.1.1 Continuous-Conversion Mode
          2. 9.4.3.1.2 Single-Shot Conversion Mode
          3. 9.4.3.1.3 Global-Chop Mode
            1. 9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 9.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 9.4.3.2.1 Continuous Sequence Mode
          2. 9.4.3.2.2 Single-Shot Sequence Mode
          3. 9.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Serial Interface Signals
          1. 9.5.1.1.1 Chip Select (CSn)
          2. 9.5.1.1.2 Serial Data Clock (SCLK)
          3. 9.5.1.1.3 Serial Data Input (SDI)
          4. 9.5.1.1.4 Serial Data Output (SDO)
          5. 9.5.1.1.5 Data Ready (DRDYn)
        2. 9.5.1.2 Serial Interface Communication Structure
          1. 9.5.1.2.1 SPI Communication Frames
          2. 9.5.1.2.2 SPI Communication Words
          3. 9.5.1.2.3 STATUS Word
          4. 9.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 9.5.1.2.5 Commands
            1. 9.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 9.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 9.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 9.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 9.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 9.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 9.5.1.2.6 SCLK Counter
          7. 9.5.1.2.7 SPI Timeout
          8. 9.5.1.2.8 Reading ADC1A, ADC1B, and ADC2A Conversion Data
          9. 9.5.1.2.9 DRDYn Pin Behavior
    6. 9.6 Register Map
      1. 9.6.1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Minimum Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Current Shunt Measurement
        2. 10.2.2.2 Battery Pack Voltage Measurement
        3. 10.2.2.3 Shunt Temperature Measurement
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Options
        1. 10.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 10.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 10.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 10.3.2 Power-Supply Sequencing
      3. 10.3.3 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

9.3.8.1 Supply Monitors

Individual power-on reset (POR) circuits are implemented on the AVDD, IOVDD, and DVDD supplies. If any of the three supplies drop below the respective POR threshold, the device is held in reset.

The ADS131B23-Q1 monitors the outputs of the three internal LDOs (AVDD, IOVDD, and DVDD) for overvoltage (OV), undervoltage (UV), and oscillations. See the Electrical Characteristics table for the according monitor detection thresholds. If an OV event occurs, the respective LDO shuts down to prevent damage to the internal circuitry. The LDO turns back on after the output voltage drops below the OV threshold. The device can potentially reset if the supply voltage drops below the POR threshold before the LDO is turned on again. The LDOs do not shut down when an OV diagnostic is performed.

AVDD or IOVDD can be supplied externally when shorting APWR to AVDD or DPWR to IOVDD, respectively, thus bypassing the internal LDOs. The monitors check the externally provided supply when bypassing the internal LDO. Configure the IOVDD OV and UV monitor thresholds using the IOVDD_OV_TH and IOVDD_UV_TH bits based on the used IOVDD supply.

The AVDD and IOVDD LDOs integrate individual temperature sensors to indicate potential overtemperature events. Configure the overtemperature warning thresholds using the AVDD_OTW_CFG[1:0] and IOVDD_OTW_CFG[1:0] bits.

The AGNDA, AGNDB, and DGND pins are monitored for pin disconnections. The AGND pin is implemented redundantly and therefore does not provide a pin disconnection monitor.

The AVDD and IOVDD LDOs are designed with an output current limit to prevent excessive current draw from the LDOs. When the LDOs operate in current limit, the according fault flags are set. If more current draw is demanded from the LDOs than the current limit, then the LDO output voltage typically drops below the POR threshold and causes a POR event.
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