ZHCSN80 july   2023 ADS131B24-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Offset Drift Measurement
    2. 8.2 Gain Drift Measurement
    3. 8.3 Noise Performance
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Naming Conventions
      2. 9.3.2 Precision Voltage References (REFA, REFB)
      3. 9.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 9.3.4 ADC1y
        1. 9.3.4.1 ADC1y Input Multiplexer
        2. 9.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 9.3.4.3 ADC1y ΔΣ Modulator
        4. 9.3.4.4 ADC1y Digital Filter
        5. 9.3.4.5 ADC1y Offset and Gain Calibration
        6. 9.3.4.6 ADC1y Conversion Data
      5. 9.3.5 ADC2y
        1. 9.3.5.1 ADC2y Input Multiplexer
        2. 9.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 9.3.5.3 ADC2y ΔΣ Modulator
        4. 9.3.5.4 ADC2y Digital Filter
        5. 9.3.5.5 ADC2y Offset and Gain Calibration
        6. 9.3.5.6 ADC2y Sequencer
        7. 9.3.5.7 VCMy Buffers
        8. 9.3.5.8 ADC2y Measurement Configurations
        9. 9.3.5.9 ADC2y Conversion Data
      6. 9.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 9.3.6.1 GPIOx PWM Output Configuration
        2. 9.3.6.2 GPIOx PWM Input Readback
      7. 9.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 9.3.8 Monitors and Diagnostics
        1. 9.3.8.1  Supply Monitors
        2. 9.3.8.2  Clock Monitors
        3. 9.3.8.3  Digital Monitors
          1. 9.3.8.3.1 Register Map CRC
          2. 9.3.8.3.2 Memory Map CRC
          3. 9.3.8.3.3 GPIO Readback
        4. 9.3.8.4  Communication Monitors
        5. 9.3.8.5  Fault Flags and Fault Masking
        6. 9.3.8.6  FAULT Pin
        7. 9.3.8.7  Diagnostics and Diagnostic Procedure
        8. 9.3.8.8  Indicators
        9. 9.3.8.9  Conversion and Sequence Counters
        10. 9.3.8.10 Supply Voltage Readback
        11. 9.3.8.11 Temperature Sensors (TSA, TSB)
        12. 9.3.8.12 Test DACs (TDACA, TDACB)
        13. 9.3.8.13 Open-Wire Detection
        14. 9.3.8.14 Missing Host Detection and MHD Pin
        15. 9.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 9.3.8.15.1 OCCA and OCCB Pins
          2. 9.3.8.15.2 Overcurrent Indication Response Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset (POR)
        2. 9.4.1.2 RESETn Pin
        3. 9.4.1.3 RESET Command
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Active Mode
        2. 9.4.2.2 Standby Mode
        3. 9.4.2.3 Power-Down Mode
      3. 9.4.3 ADC Conversion Modes
        1. 9.4.3.1 ADC1y Conversion Modes
          1. 9.4.3.1.1 Continuous-Conversion Mode
          2. 9.4.3.1.2 Single-Shot Conversion Mode
          3. 9.4.3.1.3 Global-Chop Mode
            1. 9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 9.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 9.4.3.2.1 Continuous Sequence Mode
          2. 9.4.3.2.2 Single-Shot Sequence Mode
          3. 9.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Serial Interface Signals
          1. 9.5.1.1.1 Chip Select (CSn)
          2. 9.5.1.1.2 Serial Data Clock (SCLK)
          3. 9.5.1.1.3 Serial Data Input (SDI)
          4. 9.5.1.1.4 Serial Data Output (SDO)
          5. 9.5.1.1.5 Data Ready (DRDYn)
        2. 9.5.1.2 Serial Interface Communication Structure
          1. 9.5.1.2.1 SPI Communication Frames
          2. 9.5.1.2.2 SPI Communication Words
          3. 9.5.1.2.3 STATUS Word
          4. 9.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 9.5.1.2.5 Commands
            1. 9.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 9.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 9.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 9.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 9.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 9.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 9.5.1.2.6 SCLK Counter
          7. 9.5.1.2.7 SPI Timeout
          8. 9.5.1.2.8 Reading ADC1A, ADC1B, ADC2A, and ADC2B Conversion Data
          9. 9.5.1.2.9 DRDYn Pin Behavior
    6. 9.6 Register Map
      1. 9.6.1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Minimum Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Current Shunt Measurement
        2. 10.2.2.2 Battery Pack Voltage Measurement
        3. 10.2.2.3 Shunt Temperature Measurement
        4. 10.2.2.4 Analog Output Temperature Sensor Measurement
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Options
        1. 10.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 10.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 10.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 10.3.2 Power-Supply Sequencing
      3. 10.3.3 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
9.3.8.15.2 Overcurrent Indication Response Time

The fault indication response time to an overcurrent event depends on the amount of overshoot of the input signal beyond the comparator threshold. The reason for this dependency is the settling time of the sinc3 filter that is used for the digital comparator function.

Figure 9-14 and Figure 9-15 show two examples for the OCCA fault indication behavior with OCCA_NUM[4:0] = 00000b, that is only one conversion must exceed the threshold to trigger a fault. In Figure 9-14 the comparator triggers in less than 64/fMOD (= 15.6 μs when using fMCLK = 8.192 MHz) because the sinc3 filter already settles to a value above the set high threshold in one conversion due to the large overshoot beyond the high threshold on the input signal. Figure 9-15 shows a worst case scenario where the sinc3 filter needs even four conversion periods to settle to a value above the set high threshold because the input signal barely exceeds the high threshold and the overcurrent event happens in the middle of a fast filter conversion cycle.

GUID-20221014-SS0I-SB7D-XVW6-JVZXR4SLTSC7-low.svg Figure 9-14 OCCA Behavior With Large Input Overshoot
GUID-20221014-SS0I-FCZM-JJP3-XPXGTNTBP06X-low.svg Figure 9-15 OCCA Behavior With Small Input Overshoot

The response time changes when global-chop mode of ADC1y is enabled and ADC1y is converting. See the Global-Chop ModeOvercurrent Indication Response Time in Global-Chop ModeGlobal-Chop Mode section for details.
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