ZHCSN80 july   2023 ADS131B24-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Offset Drift Measurement
    2. 8.2 Gain Drift Measurement
    3. 8.3 Noise Performance
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Naming Conventions
      2. 9.3.2 Precision Voltage References (REFA, REFB)
      3. 9.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 9.3.4 ADC1y
        1. 9.3.4.1 ADC1y Input Multiplexer
        2. 9.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 9.3.4.3 ADC1y ΔΣ Modulator
        4. 9.3.4.4 ADC1y Digital Filter
        5. 9.3.4.5 ADC1y Offset and Gain Calibration
        6. 9.3.4.6 ADC1y Conversion Data
      5. 9.3.5 ADC2y
        1. 9.3.5.1 ADC2y Input Multiplexer
        2. 9.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 9.3.5.3 ADC2y ΔΣ Modulator
        4. 9.3.5.4 ADC2y Digital Filter
        5. 9.3.5.5 ADC2y Offset and Gain Calibration
        6. 9.3.5.6 ADC2y Sequencer
        7. 9.3.5.7 VCMy Buffers
        8. 9.3.5.8 ADC2y Measurement Configurations
        9. 9.3.5.9 ADC2y Conversion Data
      6. 9.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 9.3.6.1 GPIOx PWM Output Configuration
        2. 9.3.6.2 GPIOx PWM Input Readback
      7. 9.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 9.3.8 Monitors and Diagnostics
        1. 9.3.8.1  Supply Monitors
        2. 9.3.8.2  Clock Monitors
        3. 9.3.8.3  Digital Monitors
          1. 9.3.8.3.1 Register Map CRC
          2. 9.3.8.3.2 Memory Map CRC
          3. 9.3.8.3.3 GPIO Readback
        4. 9.3.8.4  Communication Monitors
        5. 9.3.8.5  Fault Flags and Fault Masking
        6. 9.3.8.6  FAULT Pin
        7. 9.3.8.7  Diagnostics and Diagnostic Procedure
        8. 9.3.8.8  Indicators
        9. 9.3.8.9  Conversion and Sequence Counters
        10. 9.3.8.10 Supply Voltage Readback
        11. 9.3.8.11 Temperature Sensors (TSA, TSB)
        12. 9.3.8.12 Test DACs (TDACA, TDACB)
        13. 9.3.8.13 Open-Wire Detection
        14. 9.3.8.14 Missing Host Detection and MHD Pin
        15. 9.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 9.3.8.15.1 OCCA and OCCB Pins
          2. 9.3.8.15.2 Overcurrent Indication Response Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset (POR)
        2. 9.4.1.2 RESETn Pin
        3. 9.4.1.3 RESET Command
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Active Mode
        2. 9.4.2.2 Standby Mode
        3. 9.4.2.3 Power-Down Mode
      3. 9.4.3 ADC Conversion Modes
        1. 9.4.3.1 ADC1y Conversion Modes
          1. 9.4.3.1.1 Continuous-Conversion Mode
          2. 9.4.3.1.2 Single-Shot Conversion Mode
          3. 9.4.3.1.3 Global-Chop Mode
            1. 9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 9.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 9.4.3.2.1 Continuous Sequence Mode
          2. 9.4.3.2.2 Single-Shot Sequence Mode
          3. 9.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Serial Interface Signals
          1. 9.5.1.1.1 Chip Select (CSn)
          2. 9.5.1.1.2 Serial Data Clock (SCLK)
          3. 9.5.1.1.3 Serial Data Input (SDI)
          4. 9.5.1.1.4 Serial Data Output (SDO)
          5. 9.5.1.1.5 Data Ready (DRDYn)
        2. 9.5.1.2 Serial Interface Communication Structure
          1. 9.5.1.2.1 SPI Communication Frames
          2. 9.5.1.2.2 SPI Communication Words
          3. 9.5.1.2.3 STATUS Word
          4. 9.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 9.5.1.2.5 Commands
            1. 9.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 9.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 9.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 9.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 9.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 9.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 9.5.1.2.6 SCLK Counter
          7. 9.5.1.2.7 SPI Timeout
          8. 9.5.1.2.8 Reading ADC1A, ADC1B, ADC2A, and ADC2B Conversion Data
          9. 9.5.1.2.9 DRDYn Pin Behavior
    6. 9.6 Register Map
      1. 9.6.1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Minimum Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Current Shunt Measurement
        2. 10.2.2.2 Battery Pack Voltage Measurement
        3. 10.2.2.3 Shunt Temperature Measurement
        4. 10.2.2.4 Analog Output Temperature Sensor Measurement
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Options
        1. 10.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 10.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 10.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 10.3.2 Power-Supply Sequencing
      3. 10.3.3 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3.8.8 Indicators

The ADS131B24-Q1 provides a set of indicator bits inside the STATUS_MSB and STATUS_LSB registers that help to verify the state of the device:

  • Command response: The COMMAND_RESPONSE[3:0] bit field is transmitted in every SPI frame and provides feedback about the command that was received by the device in the previous frame. Information about which command was executed is also provided. See the COMMAND_RESPONSE[3:0] register bit field description for details.
  • Lock state: The LOCK bit indicates if the device is currently locked or unlocked. See the Commands section for details on how to lock and unlock the device.
  • Clock source: The CLOCK bit indicates which clock source the device is using as the main clock, either the internal main oscillator (OSCM) or an external clock provided at the CLK pin.
  • Operating mode: The MODE bit indicates which mode the device is currently operating in, either active, standby, or power-down mode.
  • ADC2A sequence active: The SEQ2A_ACTIVE bit indicates if a sequence on ADC2A is currently in progress.
  • ADC2B sequence active: The SEQ2B_ACTIVE bit indicates if a sequence on ADC2B is currently in progress.

An additional OTP_BANK status bit is provided in the DIGITAL_STATUS register. The device includes two one-time programmable (OTP) memory banks, bank 0 and bank 1. Device configuration and calibration data are stored during device production in those OTP banks. A corrupted OTP bank can cause undetermined device behavior or degraded device performance. The information in bank 0 is duplicated in bank 1 for redundancy. At device power-up or during reset, the device loads the content of OTP bank 0 into the internal memory. If the device fails to acquire the data from bank 0, then the device loads the content from OTP bank 1. The OTP_BANK bit indicates which bank was acquired. The device performs normally even when running from OTP bank 1.

If the device fails to acquire data from OTP bank 1 as well, then the memory map CRC fault flag is set to 0b. If resetting the device does not clear the MEM_MAP_CRC_FAULTn fault flag, consider the device damaged.
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