ZHCSMK4A september   2022  – july 2023 ADS131B26-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Offset Drift Measurement
    2. 8.2 Gain Drift Measurement
    3. 8.3 Noise Performance
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Naming Conventions
      2. 9.3.2 Precision Voltage References (REFA, REFB)
      3. 9.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 9.3.4 ADC1y
        1. 9.3.4.1 ADC1y Input Multiplexer
        2. 9.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 9.3.4.3 ADC1y ΔΣ Modulator
        4. 9.3.4.4 ADC1y Digital Filter
        5. 9.3.4.5 ADC1y Offset and Gain Calibration
        6. 9.3.4.6 ADC1y Conversion Data
      5. 9.3.5 ADC2y
        1. 9.3.5.1 ADC2y Input Multiplexer
        2. 9.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 9.3.5.3 ADC2y ΔΣ Modulator
        4. 9.3.5.4 ADC2y Digital Filter
        5. 9.3.5.5 ADC2y Offset and Gain Calibration
        6. 9.3.5.6 ADC2y Sequencer
        7. 9.3.5.7 VCMy Buffers
        8. 9.3.5.8 ADC2y Measurement Configurations
        9. 9.3.5.9 ADC2y Conversion Data
      6. 9.3.6 ADC3y
      7. 9.3.7 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 9.3.7.1 GPIOx PWM Output Configuration
        2. 9.3.7.2 GPIOx PWM Input Readback
      8. 9.3.8 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      9. 9.3.9 Monitors and Diagnostics
        1. 9.3.9.1  Supply Monitors
        2. 9.3.9.2  Clock Monitors
        3. 9.3.9.3  Digital Monitors
          1. 9.3.9.3.1 Register Map CRC
          2. 9.3.9.3.2 Memory Map CRC
          3. 9.3.9.3.3 GPIO Readback
        4. 9.3.9.4  Communication Monitors
        5. 9.3.9.5  Fault Flags and Fault Masking
        6. 9.3.9.6  FAULT Pin
        7. 9.3.9.7  Diagnostics and Diagnostic Procedure
        8. 9.3.9.8  Indicators
        9. 9.3.9.9  Conversion and Sequence Counters
        10. 9.3.9.10 Supply Voltage Readback
        11. 9.3.9.11 Temperature Sensors (TSA, TSB)
        12. 9.3.9.12 Test DACs (TDACA, TDACB)
        13. 9.3.9.13 Open-Wire Detection
        14. 9.3.9.14 Missing Host Detection and MHD Pin
        15. 9.3.9.15 Overcurrent Comparators (OCCA, OCCB)
          1. 9.3.9.15.1 OCCA and OCCB Pins
          2. 9.3.9.15.2 Overcurrent Indication Response Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset (POR)
        2. 9.4.1.2 RESETn Pin
        3. 9.4.1.3 RESET Command
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Active Mode
        2. 9.4.2.2 Standby Mode
        3. 9.4.2.3 Power-Down Mode
      3. 9.4.3 ADC Conversion Modes
        1. 9.4.3.1 ADC1y and ADC3y Conversion Modes
          1. 9.4.3.1.1 Continuous-Conversion Mode
          2. 9.4.3.1.2 Single-Shot Conversion Mode
          3. 9.4.3.1.3 Global-Chop Mode
            1. 9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 9.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 9.4.3.2.1 Continuous Sequence Mode
          2. 9.4.3.2.2 Single-Shot Sequence Mode
          3. 9.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Serial Interface Signals
          1. 9.5.1.1.1 Chip Select (CSn)
          2. 9.5.1.1.2 Serial Data Clock (SCLK)
          3. 9.5.1.1.3 Serial Data Input (SDI)
          4. 9.5.1.1.4 Serial Data Output (SDO)
          5. 9.5.1.1.5 Data Ready (DRDYn)
        2. 9.5.1.2 Serial Interface Communication Structure
          1. 9.5.1.2.1 SPI Communication Frames
          2. 9.5.1.2.2 SPI Communication Words
          3. 9.5.1.2.3 STATUS Word
          4. 9.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 9.5.1.2.5 Commands
            1. 9.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 9.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 9.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 9.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 9.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 9.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 9.5.1.2.6 SCLK Counter
          7. 9.5.1.2.7 SPI Timeout
          8. 9.5.1.2.8 Reading ADC1A, ADC1B, ADC2A, ADC2B, ADC3A, and ADC3B Conversion Data
          9. 9.5.1.2.9 DRDYn Pin Behavior
    6. 9.6 Register Map
      1. 9.6.1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Minimum Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Current Shunt Measurement
        2. 10.2.2.2 Battery Pack Voltage Measurement
        3. 10.2.2.3 Other Voltage Measurements
        4. 10.2.2.4 Shunt Temperature Measurement
        5. 10.2.2.5 Analog Output Temperature Sensor Measurement
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Options
        1. 10.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 10.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 10.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 10.3.2 Power-Supply Sequencing
      3. 10.3.3 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

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机械数据 (封装 | 引脚)
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订购信息
9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode

Enabling global-chop mode of ADC1y changes the overcurrent detection behavior of OCCy when ADC1y is converting. The OCCy digital fast filter resets each time ADC1y inverts the polarity of the analog inputs. After every fast filter reset, the device ignores the first two conversions of the OCCy filter because these conversions are unsettled. The device does not increment the OCCy_NUM counter for these two conversions. Depending on the OCCy_NUM and OSR1y settings, the overcurrent indication response time in global-chop mode can therefore be longer compared to when global-chop mode is disabled. The difference in response time is most noticeable when using large OCCy_NUM and small OSR1y settings.

Figure 9-21 shows an example of the OCCy behavior with OSR1y = 128. The OCCy DRDYn signal indicates when conversions of the OCCy fast filter complete. This signal is internal only and is not accessible by the host. In this specific example, the OCCy_NUM counter only manages to increment four times per ADC1y conversion period. If OCCy_NUM = 8, up to two full ADC1y conversion periods are required before the OCCy_NUM counter reaches 8. Which means that the overcurrent detection time increases from 8 × 64 / fMOD (global-chop mode disabled) to 12 × 64 / fMOD (global-chop mode enabled).

GUID-20221205-SS0I-N4JX-BTKC-6HFH1CF0XBNR-low.svg Figure 9-21 Overcurrent Detection Behavior With Global-Chop Mode Enabled (ADC1y OSR = 128)
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