ZHCS960C June   2012  – January 2017 ADS131E04 , ADS131E06 , ADS131E08

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Measurements
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Electromagnetic Interference (EMI) Filter
      2. 9.3.2  Input Multiplexer
        1. 9.3.2.1 Device Noise Measurements
        2. 9.3.2.2 Test Signals (TestP and TestN)
        3. 9.3.2.3 Temperature Sensor (TempP, TempN)
        4. 9.3.2.4 Power-Supply Measurements (MVDDP, MVDDN)
      3. 9.3.3  Analog Input
      4. 9.3.4  PGA Settings and Input Range
        1. 9.3.4.1 Input Common-Mode Range
      5. 9.3.5  ΔΣ Modulator
      6. 9.3.6  Clock
      7. 9.3.7  Digital Decimation Filter
      8. 9.3.8  Voltage Reference
      9. 9.3.9  Input Out-of-Range Detection
      10. 9.3.10 General-Purpose Digital I/O (GPIO)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start
        1. 9.4.1.1 Settling Time
        2. 9.4.1.2 Input Signal Step
      2. 9.4.2 Reset (RESET)
      3. 9.4.3 Power-Down (PWDN)
      4. 9.4.4 Continuous Conversion Mode
      5. 9.4.5 Data Retrieval
        1. 9.4.5.1 Data Ready (DRDY)
        2. 9.4.5.2 Reading Back Data
        3. 9.4.5.3 Status Word
        4. 9.4.5.4 Readback Length
    5. 9.5 Programming
      1. 9.5.1 Data Format
      2. 9.5.2 SPI Interface
        1. 9.5.2.1 Chip Select (CS)
        2. 9.5.2.2 Serial Clock (SCLK)
        3. 9.5.2.3 Data Input (DIN)
        4. 9.5.2.4 Data Output (DOUT)
      3. 9.5.3 SPI Command Definitions
        1. 9.5.3.1  Sending Multibyte Commands
        2. 9.5.3.2  WAKEUP: Exit STANDBY Mode
        3. 9.5.3.3  STANDBY: Enter STANDBY Mode
        4. 9.5.3.4  RESET: Reset Registers to Default Values
        5. 9.5.3.5  START: Start Conversions
        6. 9.5.3.6  STOP: Stop Conversions
        7. 9.5.3.7  OFFSETCAL: Channel Offset Calibration
        8. 9.5.3.8  RDATAC: Start Read Data Continuous Mode
        9. 9.5.3.9  SDATAC: Stop Read Data Continuous Mode
        10. 9.5.3.10 RDATA: Read Data
        11. 9.5.3.11 RREG: Read from Register
        12. 9.5.3.12 WREG: Write to Register
    6. 9.6 Register Map
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 ID: ID Control Register (Factory-Programmed, Read-Only) (address = 00h) [reset = xxh]
        2. 9.6.1.2 CONFIG1: Configuration Register 1 (address = 01h) [reset = 91h]
        3. 9.6.1.3 CONFIG2: Configuration Register 2 (address = 02h) [reset = E0h]
        4. 9.6.1.4 CONFIG3: Configuration Register 3 (address = 03h) [reset = 40]
        5. 9.6.1.5 FAULT: Fault Detect Control Register (address = 04h) [reset = 00h]
        6. 9.6.1.6 CHnSET: Individual Channel Settings (address = 05h to 0Ch) [reset = 10h]
        7. 9.6.1.7 FAULT_STATP: Fault Detect Positive Input Status (address = 12h) [reset = 00h]
        8. 9.6.1.8 FAULT_STATN: Fault Detect Negative Input Status (address = 13h) [reset = 00h]
        9. 9.6.1.9 GPIO: General-Purpose IO Register (address = 14h) [reset = 0Fh]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Setting the Device Up for Basic Data Capture
      3. 10.1.3 Multiple Device Configuration
        1. 10.1.3.1 Synchronizing Multiple Devices
        2. 10.1.3.2 Standard Configuration
        3. 10.1.3.3 Daisy-Chain Configuration
      4. 10.1.4 Power Monitoring Specific Applications
      5. 10.1.5 Current Sensing
      6. 10.1.6 Voltage Sensing
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Timing
    2. 11.2 Recommended External Capacitor Values
    3. 11.3 Device Connections for Unipolar Power Supplies
    4. 11.4 Device Connections for Bipolar Power Supplies
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
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