ZHCSCA6B April   2014  – October 2020 ADS4245-EP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics:
    6. 6.6  Electrical Characteristics: General
    7. 6.7  Digital Characteristics
    8. 6.8  Timing Characteristics: LVDS And CMOS Modes
    9. 6.9  Typical Characteristics:
    10. 6.10 Typical Characteristics: General
    11. 6.11 Typical Characteristics: Contour
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Functions
      2. 7.4.2 Gain For SFDR/SNR Trade-Off
      3. 7.4.3 Offset Correction
      4. 7.4.4 Power-Down
        1. 7.4.4.1 Global Power-Down
        2. 7.4.4.2 Channel Standby
        3. 7.4.4.3 Input Clock Stop
      5. 7.4.5 Digital Output Information
        1. 7.4.5.1 Output Interface
        2. 7.4.5.2 DDR LVDS Outputs
        3. 7.4.5.3 LVDS Buffer
        4. 7.4.5.4 Parallel CMOS Interface
        5. 7.4.5.5 CMOS Interface Power Dissipation
        6. 7.4.5.6 Multiplexed Mode Of Operation
        7. 7.4.5.7 Output Data Format
      6. 7.4.6 Device Configuration
        1. 7.4.6.1 Parallel Configuration Only
        2. 7.4.6.2 Serial Interface Configuration Only
        3. 7.4.6.3 Using Both Serial Interface And Parallel Controls
        4. 7.4.6.4 Parallel Configuration Details
        5. 7.4.6.5 Serial Interface Details
          1. 7.4.6.5.1 Register Initialization
          2. 7.4.6.5.2 Serial Register Readout
    5. 7.5 Serial Register Map
    6. 7.6 Description Of Serial Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Clock Input
    2. 8.2 Typical Applications
      1. 8.2.1 Analog Input
        1. 8.2.1.1 Design Requirements for Drive Circuits
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Grounding
      2. 10.1.2 Supply Decoupling
      3. 10.1.3 Exposed Pad
      4. 10.1.4 Routing Analog Inputs
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Support
        1. 11.1.1.1 Definition Of Specifications
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision A (September 2018) to Revision B (October 2020)

Changes from Revision * (April 2014) to Revision A (September 2018)

  • Moved Storage temperature, Tstg From the ESD Ratings table to the Absolute Maximum Ratings tableGo
  • Changed Handling Rating To: ESD Ratings Go
  • Added a MIN value of 1 MSPS to Low-speed mode enabled in the Recommended Operating Conditions Go
  • Added NOTE to the Application and Implementation Go
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