SLAS669E September   2010  – may 2020 ADS5400-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Interleaving Adjustments
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Configuration
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Analog Input Over-Range Recovery Error
      4. 7.3.4  Clock Inputs
      5. 7.3.5  Over Range
      6. 7.3.6  Data Scramble
      7. 7.3.7  Test Patterns
      8. 7.3.8  Die Identification and Revision
      9. 7.3.9  Die Temperature Sensor
      10. 7.3.10 Interleaving
        1. 7.3.10.1 Gain Adjustment
        2. 7.3.10.2 Offset Adjustment
        3. 7.3.10.3 Input Clock Coarse Phase Adjustment
        4. 7.3.10.4 Input Clock Fine Phase Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Bus and Clock Options
      2. 7.4.2 Reset and Synchronization
      3. 7.4.3 LVDS
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. Table 2. Instruction Byte of the Serial Interface
    6. 7.6 Serial Register Map
      1. 7.6.1 Description of Serial Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clocking Source for ADS5400-SP
        2. 8.2.2.2 Amplifier Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Definition of Specifications
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4.3 LVDS

Differential source loads of 100 Ω and 200 Ω are provided internal to the device and can be implemented using register 0x06 (as well as no internal load). Normal LVDS operation expects 3.5 mA of current, but alternate values of 2.5, 4.5, and 5.5 mA are provided to save power or improve the LVDS signal quality when the environment provides excessive loading.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |