THERMAL METRIC(1) | ADS58J64 | UNIT |
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RMP (VQFNP) | RHH (VQFN) |
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72 PINS | 72 PINS |
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RθJA | Junction-to-ambient thermal resistance (2) | 22.3 | 18.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance (3) | 5.1 | 5.8 | °C/W |
RθJB | Junction-to-board thermal resistance (3) | 2.4 | 4.5 | °C/W |
ψJT | Junction-to-top characterization parameter (4) | 0.1 | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter (5) | 2.3 | 4.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance (6) | 0.2 | 0.3 | °C/W |
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).