ZHCSLR7B March   2021  – September 2024 ADS7067

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Analog Input and Multiplexer
      2. 6.3.2  Reference
        1. 6.3.2.1 External Reference
        2. 6.3.2.2 Internal Reference
      3. 6.3.3  ADC Transfer Function
      4. 6.3.4  ADC Offset Calibration
      5. 6.3.5  Programmable Averaging Filters
      6. 6.3.6  CRC on Data Interface
      7. 6.3.7  Oscillator and Timing Control
      8. 6.3.8  Diagnostic Modes
        1. 6.3.8.1 Bit-Walk Test Mode
        2. 6.3.8.2 Fixed Voltage Test Mode
      9. 6.3.9  Output Data Format
        1. 6.3.9.1 Status Flags
        2. 6.3.9.2 Output CRC (Device to Host)
        3. 6.3.9.3 Input CRC (Host to Device)
      10. 6.3.10 Device Programming
        1. 6.3.10.1 Enhanced-SPI Interface
        2. 6.3.10.2 Daisy-Chain Mode
        3. 6.3.10.3 Register Read/Write Operation
          1. 6.3.10.3.1 Register Write
          2. 6.3.10.3.2 Register Read
            1. 6.3.10.3.2.1 Register Read With CRC
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Power-Up and Reset
      2. 6.4.2 Manual Mode
      3. 6.4.3 On-the-Fly Mode
      4. 6.4.4 Auto-Sequence Mode
    5. 6.5 ADS7067 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 AVDD and DVDD Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
DVDD to GND –0.3 5.5 V
AVDD to GND –0.3 5.5 V
AINx/GPIOx(2) to GND GND – 0.3 AVDD + 0.3 V
REF to GND GND – 0.3 AVDD + 0.3 V
Digital inputs (CS, SDI, SCLK) to GND GND – 0.3 5.5 V
Input current to any pin except supply pins(3) –10 10 mA
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) AINx/GPIOx refers to AIN0/GPIO0, AIN1/GPIO1, AIN2/GPIO2, AIN3/GPIO3, AIN4/GPIO4, AIN5/GPIO5, AIN6/GPIO6, and AIN7/GPIO7 pins.
(3) Pin current must be limited to 10 mA or less.
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