ZHCSLR7B March   2021  – September 2024 ADS7067

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Analog Input and Multiplexer
      2. 6.3.2  Reference
        1. 6.3.2.1 External Reference
        2. 6.3.2.2 Internal Reference
      3. 6.3.3  ADC Transfer Function
      4. 6.3.4  ADC Offset Calibration
      5. 6.3.5  Programmable Averaging Filters
      6. 6.3.6  CRC on Data Interface
      7. 6.3.7  Oscillator and Timing Control
      8. 6.3.8  Diagnostic Modes
        1. 6.3.8.1 Bit-Walk Test Mode
        2. 6.3.8.2 Fixed Voltage Test Mode
      9. 6.3.9  Output Data Format
        1. 6.3.9.1 Status Flags
        2. 6.3.9.2 Output CRC (Device to Host)
        3. 6.3.9.3 Input CRC (Host to Device)
      10. 6.3.10 Device Programming
        1. 6.3.10.1 Enhanced-SPI Interface
        2. 6.3.10.2 Daisy-Chain Mode
        3. 6.3.10.3 Register Read/Write Operation
          1. 6.3.10.3.1 Register Write
          2. 6.3.10.3.2 Register Read
            1. 6.3.10.3.2.1 Register Read With CRC
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Power-Up and Reset
      2. 6.4.2 Manual Mode
      3. 6.4.3 On-the-Fly Mode
      4. 6.4.4 Auto-Sequence Mode
    5. 6.5 ADS7067 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 AVDD and DVDD Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) ADS7067 UNIT
YBH (DSBGA) RTE (WQFN)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 80.2 46.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 47.2 °C/W
RθJB Junction-to-board thermal resistance 18.8 21.2 °C/W
ΨJT Junction-to-top characterization parameter 0.2 0.8 °C/W
ΨJB Junction-to-board characterization parameter 18.8 21.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA 6.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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