ZHCSLR7B March   2021  – September 2024 ADS7067

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Analog Input and Multiplexer
      2. 6.3.2  Reference
        1. 6.3.2.1 External Reference
        2. 6.3.2.2 Internal Reference
      3. 6.3.3  ADC Transfer Function
      4. 6.3.4  ADC Offset Calibration
      5. 6.3.5  Programmable Averaging Filters
      6. 6.3.6  CRC on Data Interface
      7. 6.3.7  Oscillator and Timing Control
      8. 6.3.8  Diagnostic Modes
        1. 6.3.8.1 Bit-Walk Test Mode
        2. 6.3.8.2 Fixed Voltage Test Mode
      9. 6.3.9  Output Data Format
        1. 6.3.9.1 Status Flags
        2. 6.3.9.2 Output CRC (Device to Host)
        3. 6.3.9.3 Input CRC (Host to Device)
      10. 6.3.10 Device Programming
        1. 6.3.10.1 Enhanced-SPI Interface
        2. 6.3.10.2 Daisy-Chain Mode
        3. 6.3.10.3 Register Read/Write Operation
          1. 6.3.10.3.1 Register Write
          2. 6.3.10.3.2 Register Read
            1. 6.3.10.3.2.1 Register Read With CRC
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Power-Up and Reset
      2. 6.4.2 Manual Mode
      3. 6.4.3 On-the-Fly Mode
      4. 6.4.4 Auto-Sequence Mode
    5. 6.5 ADS7067 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Charge-Kickback Filter and ADC Amplifier
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 AVDD and DVDD Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.7 Switching Characteristics

at AVDD = 3 V to 5.5 V, DVDD = 1.65 V to 5.5 V, and maximum throughput (unless otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C.
PARAMETER TEST CONDITIONS MIN MAX UNIT
CONVERSION CYCLE
tCONV ADC conversion time 950 ns
RESET
tPU Power-up time for device AVDD ≥ 3 V 5 ms
tRST Delay time; RST bit = 1b to device reset complete(1) 5 ms
SPI INTERFACE TIMINGS
tDEN_CSDO Delay time: CS falling to data enable 22 ns
tDZ_CSDO Delay time: CS rising to SDO going Hi-Z 50 ns
tD_CKDO Delay time: SCLK launch edge to (next) data valid on SDO 16 ns
(1) RST bit is automatically reset to 0b after tRST.
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