6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC |
|
6 |
V |
Analog input |
–0.3 |
VCC + 0.3 |
V |
Logic input |
–0.3 |
6 |
°C |
External reference voltage |
|
5.5 |
V |
Input current to any pin except supply |
|
±10 |
mA |
Case temperature |
|
100 |
°C |
Junction temperature |
|
150 |
°C |
Storage temperature, Tstg |
|
125 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
±2000 |
V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) |
±1000 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
|
MIN |
NOM |
MAX |
UNIT |
Supply voltage, VCC to GND |
Low voltage levels |
2.7 |
|
3.3 |
V |
5-V logic levels |
4.75 |
5 |
5.25 |
Reference input voltage, VREF |
0.5 |
|
VCC |
V |
Analog input voltage |
–IN to GND |
–0.1 |
0 |
0.5 |
V |
+IN to GND |
–0.1 |
|
VCC + 0.1 |
+IN to – (–IN) |
0 |
|
VREF |
Operating temperature, TA |
–40 |
|
85 |
°C |
6.4 Thermal Information
THERMAL METRIC(1) |
ADS8320 |
UNIT |
DGK (VSSOP) |
8 PINS |
RθJA |
Junction-to-ambient thermal resistance |
163.1 |
°C/W |
RθJC(top) |
Junction-to-case (top) thermal resistance |
56.6 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
83.4 |
°C/W |
ψJT |
Junction-to-top characterization parameter |
6.7 |
°C/W |
ψJB |
Junction-to-board characterization parameter |
82 |
°C/W |
RθJC(bot) |
Junction-to-case (bottom) thermal resistance |
— |
°C/W |
6.5 Electrical Characteristics: VCC = 5 V
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
RESOLUTION |
Resolution |
|
|
|
16 |
Bits |
ANALOG INPUT |
Full-scale input span |
+In – (–In) |
0 |
|
VREF |
V |
Absolute input |
+In |
–0.1 |
|
VCC + 0.1 |
V |
–In |
–0.1 |
|
1 |
Capacitance |
|
|
45 |
|
pF |
Leakage current |
|
|
1 |
|
nA |
SYSTEM PERFORMANCE |
No missing codes |
ADS8320E |
14 |
|
|
Bits |
ADS8320EB |
15 |
|
|
Integral linearity error |
ADS8320E |
|
±0.008% |
±0.018% |
FSR |
ADS8320EB |
|
±0.006% |
±0.012% |
Offset error |
ADS8320E |
|
±1 |
±2 |
mV |
ADS8320EB |
|
±0.5 |
±1 |
Offset temperature drift |
|
|
±3 |
|
µV/°C |
Gain error |
ADS8320E |
|
|
±0.05% |
FSR |
ADS8320EB |
|
|
±0.024% |
Gain error temperature drift |
|
|
±0.3 |
|
ppm/°C |
Noise |
|
|
20 |
|
µVrms |
Power-supply rejection ratio |
4.7 V < VCC < 5.25 V |
|
3 |
|
LSB(1) |
SAMPLING DYNAMICS |
Conversion time |
|
|
|
16 |
Clock Cycles |
Acquisition time |
|
4.5 |
|
|
Clock Cycles |
Throughput rate |
|
|
|
100 |
kHz |
Clock frequency |
|
0.024 |
|
2.4 |
MHz |
DYNAMIC CHARACTERISTICS |
Total harmonic distortion |
VIN = 5 VP-P at 10 kHz |
ADS8320E |
|
–84 |
|
dB |
ADS8320EB |
|
–86 |
|
SINAD |
VIN = 5 VP-P at 10 kHz |
ADS8320E |
|
82 |
|
dB |
ADS8320EB |
|
84 |
|
Spurious-free dynamic |
VIN = 5 VP-P at 10 kHz |
ADS8320E |
|
84 |
|
dB |
ADS8320EB |
|
86 |
|
SNR |
ADS8320E |
|
90 |
|
dB |
ADS8320EB |
|
92 |
|
REFERENCE INPUT |
Voltage |
|
0.5 |
|
VCC |
V |
Resistance |
CS = GND, fSAMPLE = 0 Hz |
|
5 |
|
GΩ |
CS = VCC |
|
5 |
|
Current drain |
|
|
40 |
80 |
µA |
fSAMPLE = 0 Hz |
|
0.8 |
|
CS = VCC |
|
0.1 |
3 |
DIGITAL INPUT/OUTPUT |
Logic family |
|
|
CMOS |
|
|
Logic levels |
VIH |
IIH = 5 µA |
3 |
|
VCC + 0.3 |
V |
VIL |
IIL = 5 µA |
–0.3 |
|
0.8 |
VOH |
IOH = –250 µA |
4 |
|
|
VOL |
IOL = 250 µA |
|
|
0.4 |
Data format |
|
Straight Binary |
|
POWER SUPPLY REQUIREMENTS |
|
VCC |
Specified performance |
4.75 |
|
5.25 |
V |
VCC(2) |
|
2 |
|
5.25 |
V |
Quiescent current |
|
|
900 |
1700 |
µA |
fSAMPLE = 10 kHz(3)(4) |
|
200 |
|
Power dissipation |
|
|
4.5 |
8.5 |
mW |
Power down |
CS = VCC |
|
0.3 |
3 |
µA |
(1) LSB means Least Significant Bit with VREF equal to 2.5 V, one LSB is 0.038 mV.
(3) fCLK = 2.4 MHz, CS = VCC for 216 clock cycles out of every 240.
6.6 Electrical Characteristics: VCC = 2.7 V
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
RESOLUTION |
Resolution |
|
|
|
16 |
Bits |
ANALOG INPUT |
Full-scale input span |
+In – (–In) |
0 |
|
VREF |
V |
Absolute input |
+In |
–0.1 |
|
VCC + 0.1 |
V |
–In |
–0.1 |
|
0.5 |
Capacitance |
|
|
45 |
|
pF |
Leakage current |
|
|
1 |
|
nA |
SYSTEM PERFORMANCE |
No missing codes |
ADS8320E |
14 |
|
|
Bits |
ADS8320EB |
15 |
|
|
Integral linearity error |
ADS8320E |
|
±0.008% |
±0.018% |
FSR |
ADS8320EB |
|
±0.006% |
±0.012% |
Offset error |
ADS8320E |
|
±1 |
±2 |
mV |
ADS8320EB |
|
±0.5 |
±1 |
Offset temperature drift |
|
|
±3 |
|
µV/°C |
Gain error |
ADS8320E |
|
|
±0.05% |
FSR |
ADS8320EB |
|
|
±0.024% |
Gain error temperature drift |
|
|
±0.3 |
|
ppm/°C |
Noise |
|
|
20 |
|
ppm/°C |
Power-supply rejection ratio |
2.7 V < VCC < 3.3 V |
|
3 |
|
LSB(1) |
SAMPLING DYNAMICS |
Conversion time |
|
|
|
16 |
Clock Cycles |
Acquisition time |
|
4.5 |
|
|
Clock Cycles |
Throughput rate |
|
|
|
100 |
kHz |
Clock frequency |
|
0.024 |
|
2.4 |
MHz |
DYNAMIC CHARACTERISTICS |
Total harmonic distortion |
VIN = 2.7 VP-P at 1 kHz |
ADS8320E |
|
–86 |
|
dB |
ADS8320EB |
|
–88 |
|
SINAD |
VIN = 2.7 VP-P at 1 kHz |
ADS8320E |
|
84 |
|
dB |
ADS8320EB |
|
86 |
|
Spurious-free dynamic |
VIN = 2.7 VP-P at 1 kHz |
ADS8320E |
|
86 |
|
dB |
ADS8320EB |
|
88 |
|
SNR |
ADS8320E |
|
88 |
|
dB |
ADS8320EB |
|
90 |
|
REFERENCE INPUT |
Voltage |
|
0.5 |
|
VCC |
V |
Resistance |
CS = GND, fSAMPLE = 0 Hz |
|
5 |
|
GΩ |
CS = VCC |
|
5 |
|
Current drain |
|
|
20 |
50 |
µA |
CS = VCC |
|
0.1 |
3 |
DIGITAL INPUT/OUTPUT |
Logic Family |
|
|
CMOS |
|
|
Logic levels |
VIH |
IIH = 5 µA |
2 |
|
VCC + 0.3 |
V |
VIL |
IIL = 5 µA |
–0.3 |
|
0.8 |
VOH |
IOH = –250 µA |
2.1 |
|
|
VOL |
IOL = 250 µA |
|
|
0.4 |
Data format |
|
Straight Binary |
|
POWER SUPPLY REQUIREMENTS |
VCC |
Specified performance |
2.7 |
|
3.3 |
V |
VCC(3) |
|
2 |
|
5.25 |
V |
See(2) |
2 |
|
2.7 |
Quiescent current |
|
|
650 |
1300 |
µA |
fSAMPLE = 10 kHz(4)(5) |
|
100 |
|
Power dissipation |
|
|
1.8 |
3.8 |
mW |
Power down |
CS = VCC |
|
0.3 |
3 |
µA |
(1) LSB means Least Significant Bit with VREF equal to 2.5 V, one LSB is 0.038 mV.
(2) The maximum clock rate of the ADS8320 is less than 2.4 MHz in this power supply range.
(4) fCLK = 2.4 MHz, CS = VCC for 216 clock cycles out of every 240.
6.7 Typical Characteristics
Figure 1. Integral Non-Linearity (INL) vs Code (25°C)
Figure 3. Supply Current vs Temperature
Figure 5. Quiescent Current vs VCC
Figure 7. Change In Offset vs Reference Voltage
Figure 9. Change In Gain Error vs Reference Voltage
Figure 11. Frequency Spectrum (8192 Point FFT,
FIN = 10.120 kHz, –0.3 dB)
Figure 13. Spurious-Free Dynamic Range and Signal-to-Noise Ratio vs Frequency
Figure 15. Signal-to-(Noise + Distortion) vs Frequency
Figure 17. Reference Current vs Sample Rate
Figure 2. Differential Non-Linearity Error vs Code (25°C)
Figure 4. Power-Down Supply Current
Code (25°C)
Figure 6. Maximum Sample Rate vs VCC
Figure 8. Change In Offset vs Temperature
Figure 10. Change In Gain Error vs Temperature
Figure 12. Peak-to-Peak Noise vs Reference Voltage
Figure 14. Total Harmonic Distortion vs Frequency
Figure 16. Signal-to-(Noise + Distortion) vs Input Level
Figure 18. Reference Current vs Temperature