ZHCSCC6D May 2013 – March 2018 ADS7250 , ADS7850 , ADS8350
PRODUCTION DATA.
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
AINM-A | 16 | Analog input | Negative analog input, ADC_A |
AINM-B | 5 | Analog input | Negative analog input, ADC_B |
AINP-A | 15 | Analog input | Positive analog input, ADC_A |
AINP-B | 6 | Analog input | Positive analog input, ADC_B |
AVDD | 14 | Supply | ADC supply voltage |
CS | 9 | Digital input | Chip-select signal; active low |
DVDD | 7 | Supply | Digital I/O supply |
GND | 8, 13 | Supply | Device ground |
REFGND-A | 2 | Supply | Reference ground potential, ADC_A |
REFGND-B | 3 | Supply | Reference ground potential, ADC_B |
REFIN-A | 1 | Analog input | Reference voltage input, ADC_A |
REFIN-B | 4 | Analog input | Reference voltage input, ADC_B |
SCLK | 10 | Digital input | Serial communication clock |
SDO-A | 11 | Digital output | Data output for serial communication, ADC_A |
SDO-B | 12 | Digital output | Data output for serial communication, ADC_B |
Thermal pad | Supply | Exposed thermal pad. TI recommends connecting the thermal pad to the printed circuit board (PCB) ground. |