ZHCSJ89B January   2019  – July 2022 ADS8353-Q1

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input: Full-Scale Range Selection
        2. 7.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 7.3.3 Transfer Function
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Write to User-Programmable Registers
      3. 7.5.3 Data Read Operation
        1. 7.5.3.1 Reading User-Programmable Registers
        2. 7.5.3.2 Conversion Data Read
          1. 7.5.3.2.1 32-CLK, Dual-SDO Mode (CFR.B11 = 0, CFR.B10 = 0, Default)
          2. 7.5.3.2.2 32-CLK, Single-SDO Mode (CFR.B11 = 0, CFR.B10 = 1)
      4. 7.5.4 Low-Power Modes
        1. 7.5.4.1 STANDBY Mode
        2. 7.5.4.2 Software Power-Down (SPD) Mode
      5. 7.5.5 Frame Abort, Reconversion, or Short-Cycling
    6. 7.6 Register Maps
      1. 7.6.1 ADS8353-Q1 Registers
  8. 8Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Amplifier Selection
      2. 8.1.2 Charge Kickback Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
      1.      Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC(1) ADS8353-Q1 UNIT
PW (TSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 99 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.6 °C/W
RθJB Junction-to-board thermal resistance 45 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
YJB Junction-to-board characterization parameter 44.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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