ZHCSFT8B December   2016  – March 2021 ADS8691 , ADS8695 , ADS8699

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Conversion Cycle
    7. 6.7  Timing Requirements: Asynchronous Reset
    8. 6.8  Timing Requirements: SPI-Compatible Serial Interface
    9. 6.9  Timing Requirements: Source-Synchronous Serial Interface (External Clock)
    10. 6.10 Timing Requirements: Source-Synchronous Serial Interface (Internal Clock)
    11. 6.11 Timing Diagrams
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input Structure
      2. 7.3.2 Analog Input Impedance
      3. 7.3.3 Input Protection Circuit
      4. 7.3.4 Programmable Gain Amplifier (PGA)
      5. 7.3.5 Second-Order, Low-Pass Filter (LPF)
      6. 7.3.6 ADC Driver
      7. 7.3.7 Reference
        1. 7.3.7.1 Internal Reference
        2. 7.3.7.2 External Reference
      8. 7.3.8 ADC Transfer Function
      9. 7.3.9 Alarm Features
        1. 7.3.9.1 Input Alarm
        2. 7.3.9.2 AVDD Alarm
    4. 7.4 Device Functional Modes
      1. 7.4.1 Host-to-Device Connection Topologies
        1. 7.4.1.1 Single Device: All multiSPI Options
        2. 7.4.1.2 Single Device: Standard SPI Interface
        3. 7.4.1.3 Multiple Devices: Daisy-Chain Topology
      2. 7.4.2 Device Operational Modes
        1. 7.4.2.1 RESET State
        2. 7.4.2.2 ACQ State
        3. 7.4.2.3 CONV State
    5. 7.5 Programming
      1. 7.5.1 Data Transfer Frame
      2. 7.5.2 Input Command Word and Register Write Operation
      3. 7.5.3 Output Data Word
      4. 7.5.4 Data Transfer Protocols
        1. 7.5.4.1 Protocols for Configuring the Device
        2. 7.5.4.2 Protocols for Reading From the Device
          1. 7.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols with a Single SDO-x
          2. 7.5.4.2.2 Legacy, SPI-Compatible (SYS-xy-S) Protocols With Dual SDO-x
          3. 7.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 7.5.4.2.3.1 Output Clock Source Options
            2. 7.5.4.2.3.2 Output Bus Width Options
    6. 7.6 Register Maps
      1. 7.6.1 Device Configuration and Register Maps
        1. 7.6.1.1 DEVICE_ID_REG Register (address = 00h)
        2. 7.6.1.2 RST_PWRCTL_REG Register (address = 04h)
        3. 7.6.1.3 SDI_CTL_REG Register (address = 08h)
        4. 7.6.1.4 SDO_CTL_REG Register (address = 0Ch)
        5. 7.6.1.5 DATAOUT_CTL_REG Register (address = 10h)
        6. 7.6.1.6 RANGE_SEL_REG Register (address = 14h)
        7. 7.6.1.7 ALARM_REG Register (address = 20h)
        8. 7.6.1.8 ALARM_H_TH_REG Register (address = 24h)
        9. 7.6.1.9 ALARM_L_TH_REG Register (address = 28h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
    2. 9.2 Power Saving
      1. 9.2.1 NAP Mode
      2. 9.2.2 Power-Down (PD) Mode
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision A (October 2018) to Revision B (March 2021)

  • 更新了整个文档的表、图和交叉参考的编号格式 Go
  • 更改了应用 部分Go
  • Changed AIN_P, AIN_GND to GND specification in Absolute Maximum Ratings table Go
  • Updated specification of Input Overvoltage Protection Circuit, VOVP parameter, to ±15 V for test condition AVDD = floatingGo
  • Changed Standard SPI Timing Protocol figuresGo
  • Changed DEVICE_ADDR[3:0] type to R/W from R in DEVICE_ID_REG Register Go
  • Changed the description of PAR_EN bit in DATAOUT_CTL_REG Register Go

Changes from Revision * (December 2016) to Revision A (October 2018)

  • 删除了特性 部分警报 → 高，低阈值 项目符号中的每通道Go
  • 从文档中删除了 WQFN 封装选项Go
  • Deleted RUM (WQFN) information from Pin Configuration and Functions sectionGo
  • Deleted offers a low impedance of 30 kΩ from footnotes 2 and 3 in Absolute Maximum Ratings table Go
  • Deleted RUM (WQFN) column from Thermal Information tableGo
  • Changed test conditions of Input Overvoltage Protection Circuit, VOVP parameterGo
  • Deleted WQFN row from VREFIO and dVREFIO/dTA parametersGo
  • Deleted multichannel reference from Overview sectionGo
  • Changed the input voltage range for each analog channel to the input voltage range in Analog Input Structure sectionGo
  • Changed Input Overvoltage Protection Limits When AVDD = 5 V table name from Input Overvoltage Protection Limits When AVDD = 5 V or Offers a Low Impedance of 30 kΩ Go
  • Changed AVDD is floating with an impedance 30 kΩ to AVDD is floating in Input Protection Circuit sectionGo
  • Changed Input Overvoltage Protection Limits When AVDD = Floating table title from Input Overvoltage Protection Limits When AVDD = Floating with Impedance 30 kΩ Go
  • Deleted RUM (WQFN) package information from Internal Reference sectionGo
  • Deleted RUM (WQFN) package information from External Reference sectionGo
  • Added footnotes to List of Input Commands tableGo
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