ZHCSBG4B May   2013  – February 2019 ADS8862

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      ADC 电源无需独立的 LDO
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: 3-Wire Operation
    7. 7.7 Timing Requirements: 4-Wire Operation
    8. 7.8 Timing Requirements: Daisy-Chain
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Equivalent Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Reference
      3. 9.3.3 Clock
      4. 9.3.4 ADC Transfer Function
    4. 9.4 Device Functional Modes
      1. 9.4.1 CS Mode
        1. 9.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 9.4.1.2 3-Wire CS Mode With a Busy Indicator
        3. 9.4.1.3 4-Wire CS Mode Without a Busy Indicator
        4. 9.4.1.4 4-Wire CS Mode With a Busy Indicator
      2. 9.4.2 Daisy-Chain Mode
        1. 9.4.2.1 Daisy-Chain Mode Without a Busy Indicator
        2. 9.4.2.2 Daisy-Chain Mode With a Busy Indicator
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 Charge-Kickback Filter
    2. 10.2 Typical Applications
      1. 10.2.1 DAQ Circuit for a 1.5-µs, Full-Scale Step Response
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 DAQ Circuit for Lowest Distortion and Noise Performance at 680 kSPS
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
      3. 10.2.3 Ultralow-Power DAQ Circuit at 10 kSPS
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Power Saving
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (December 2013) to B Revision

  • Added 添加了器件信息 表、ESD 额定值 表、建议运行条件 表、参数测量信息 部分、特性 说明部分、器件功能模式 部分、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Changed 通篇将模拟输入从伪差分更改为单端Go
  • Changed 通篇将 MSOP 更改为 VSSOP Go
  • Changed title of Device Comparison Table from Family InformationGo
  • Changed footnotes of Family Information tableGo
  • Changed LSB footnote in Electrical Characteristics table to include how to convert LSB to ppm Go
  • Added more information about validity of data on SCLK edges in all interface modesGo
  • Changed diagrams and text for better explanation of the daisy-chain feature in the Daisy-Chain Mode sectionGo
  • Changed Equation 1 and Equation 2Go
  • Changed Charge-Kickback Filter section title and functionality description Go

Changes from * Revision (May 2013) to A Revision

  • Changed 更改了交流和直流性能 特性 项目中的子项目Go
  • Changed 更改了满标度步进趋稳 特性 项目Go
  • Deleted 删除了最后两个 应用 项目Go
  • Changed 说明 部分Go
  • Changed 首页图Go
  • Added Family Information, Absolute Maximum Ratings, and Thermal Information tablesGo
  • Added Pin Configurations sectionGo
  • Added Electrical Characteristics tableGo
  • Added Timing Characteristics sectionGo
  • Added Typical Characteristics sectionGo
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