SBASAQ6 April   2024 ADS9813

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Synchronizing Multiple ADCs
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Test Patterns for Data Interface
        1. 6.3.6.1 Fixed Pattern
        2. 6.3.6.2 Digital Ramp
        3. 6.3.6.3 Alternating Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Reset
      2. 6.4.2 Power-Down
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices in a Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Parametric Measurement Unit (PMU)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.7 Switching Characteristics

at AVDD_5V = 4.75V to 5.25V, VDD_1V8 = 1.75V to 1.85V, IOVDD = 1.15V to 1.85V, VREF = 4.096V (internal or external), and maximum throughput (unless otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C
PARAMETER TEST CONDITIONS MIN MAX UNIT
RESET
tPU Power-up time for device 25 ms
SPI INTERFACE TIMINGS (Configuration Interface)
tden_CKDO Delay time: 8th SCLK rising edge to data enable 22 ns
tdz_CKDO Delay time: 24th SCLK rising edge to SDO going Hi-Z 50 ns
td_CKDO Delay time: SCLK falling edge to corresponding data valid on SDO 16 ns
tht_CKDO Delay time: SCLK falling edge to previous data valid on SDO 2 ns
CMOS DATA INTERFACE
tDCLK Data clock output DDR mode 10 ns
SDR mode 20
Clock duty cycle 45 55 %
toff_DCLKDO_r Time offset: DCLK rising to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
toff_DCLKDO_f​ Time offset: DCLK falling to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
td_DCLKDO​ Time delay: DCLK rising to corresponding data valid SDR mode –1 1 ns
td_SYNC_FCLK Time delay: SMPL_CLK falling edge with SYNC signal to corresponding FCLKOUT rising edge 3 4 tSMPL_CLK
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |