ZHCSM18A January   2023  – December 2023 ADS9815 , ADS9817

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
        4. 6.3.1.4 Gain Error Calibration
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Sample Synchronization
      6. 6.3.6 Data Interface
        1. 6.3.6.1 Data Clock Output
        2. 6.3.6.2 ADC Output Data Randomizer
        3. 6.3.6.3 Test Patterns for Data Interface
          1. 6.3.6.3.1 User-Defined Test Pattern
          2. 6.3.6.3.2 User-Defined Alternating Test Pattern
          3. 6.3.6.3.3 Ramp Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down
      2. 6.4.2 Reset
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) System
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 CMOS Data Interface
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

4 Pin Configuration and Functions

GUID-20210423-CA0I-T5WB-GNFW-DCC090LWSDWQ-low.svg Figure 4-1 RSH Package,56-Pin VQFN(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
AIN1M 55 AI Analog input channel 1, negative input.
AIN1P 54 AI Analog input channel 1, positive input.
AIN2M 2 AI Analog input channel 2, negative input.
AIN2P 1 AI Analog input channel 2, positive input.
AIN3M 4 AI Analog input channel 3, negative input.
AIN3P 3 AI Analog input channel 3, positive input.
AIN4M 6 AI Analog input channel 4, negative input.
AIN4P 5 AI Analog input channel 4, positive input.
AIN5M 10 AI Analog input channel 5, negative input.
AIN5P 9 AI Analog input channel 5, positive input.
AIN6M 12 AI Analog input channel 6, negative input.
AIN6P 11 AI Analog input channel 6, positive input.
AIN7M 14 AI Analog input channel 7, negative input.
AIN7P 13 AI Analog input channel 7, positive input.
AIN8M 17 AI Analog input channel 8, negative input.
AIN8P 16 AI Analog input channel 8, positive input.
AVDD_5V 15, 56 P 5-V analog supply. Connect 1-µF and 0.1-µF decoupling capacitors to GND.
CS 25 DI Chip-select input for SPI interface configuration; active low. This pin has an internal 100-kΩ pullup resistor to IOVDD.
D0 34 DO Serial output data lane 0.
D1 35 DO Serial data output lane 1.
D2 36 DO Serial data output lane 2.
D3 37 DO Serial data output lane 3.
DCLKOUT 33 DO Clock output for data interface.
FCLKOUT 40 DO Frame synchronization output for data interface.
GND 7, 23, 29, 42, 46 P Ground.
IOVDD 30, 41 P Digital I/O supply for data interface. Connect 1-µF and 0.1-µF decoupling capacitor to GND.
NC 20, 38, 39, 50, 51 — Not connected. No external connection.
PWDN 32 DI Power-down control; active low. PWDN has an internal 100-kΩ pullup resistor to the digital interface supply.
REFIO 52 AI/AO REFIO acts as an internal reference output when the internal reference is enabled. REFIO functions as an input pin for the external reference when the internal reference is disabled. Connect a 10-µF decoupling capacitor to the REFM pins.
REFM 8, 18, 53 AI Reference ground potential. Connect to GND.
REFOUT_2V5 19 AO 2.5-V reference output. Connect a decoupling 10-µF capacitor to the REFM pins.
RESET 31 DI Reset input for the device; active low. RESET has an internal 100-kΩ pullup resistor to the digital interface supply.
SCLK 26 DI Serial clock input for the configuration interface. SCLK has an internal 100-kΩ pulldown resistor to the digital interface ground.
SDI 27 DI SDI is a multifunction logic input; pin function is determined by the SPI_EN pin. SDI has an internal 100-kΩ pulldown resistor to GND.
SPI_EN = 0b: SDI is the logic input to select between the internal or external reference. Connect SDI to GND for the external reference. Connect SDI to IOVDD for the internal reference.
SPI_EN = 1b: Serial data input for the configuration interface.
SDO 28 DO Serial data output for the configuration interface.
SMPL_CLKP 44 DI Single-ended ADC sampling clock input. SMPL_CLKP is the positive input for the differential sampling clock input to the ADC.
SMPL_CLKM 43 DI Connect SMPL_CLKM to GND for a single-ended ADC sampling clock input. SMPL_CLKM is the negative input for the differential sampling clock input to the ADC.
SMPL_SYNC 45 DI Synchronization input. See the Sample Synchronization section on how to use the SMPL_SYNC pin.
SPI_EN 24 DI Logic input to enable the SPI interface configuration (CS, SCLK, SDI, and SDO). SPI_EN has an internal 100-kΩ pullup resistor to the digital interface supply.
VDD_1V8 21, 22, 47, 48, 49 P 1.8-V power-supply. Connect 1-µF and 0.1-µF decoupling capacitors to GND.
Thermal pad — P Exposed thermal pad; connect to GND.
(1) I = input, O = output, I/O = input or output, G = ground, and P = power.
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