ZHCSM18A January   2023  – December 2023 ADS9815 , ADS9817

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
        4. 6.3.1.4 Gain Error Calibration
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Sample Synchronization
      6. 6.3.6 Data Interface
        1. 6.3.6.1 Data Clock Output
        2. 6.3.6.2 ADC Output Data Randomizer
        3. 6.3.6.3 Test Patterns for Data Interface
          1. 6.3.6.3.1 User-Defined Test Pattern
          2. 6.3.6.3.2 User-Defined Alternating Test Pattern
          3. 6.3.6.3.3 Ramp Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down
      2. 6.4.2 Reset
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) System
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 CMOS Data Interface
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) ADS981x UNIT
RSH (VQFN)
56 PINS
RθJA Junction-to-ambient thermal resistance 23.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 10.5 °C/W
RθJB Junction-to-board thermal resistance 6.1 °C/W
ΨJT Junction-to-top characterization parameter 0.1 °C/W
ΨJB Junction-to-board characterization parameter 6.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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