Packaging Information
| Orderable Device | Status(1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan(2) | Lead/Ball Finish(6) | MSL Peak Temp(3) | Op Temp (°C) | Device Marking(4)(5) |
|---|
| AFE4432YCHR | ACTIVE | DSBGA | YCH | 25 | 3000 | Green (RoHS & no Sn/Br) | SNAGCU | Level-1-260C-UNLIM | -20 to 85 | AFE4432 |
| AFE4432YCHT |
ACTIVE |
DSBGA |
YCH |
25 |
250 |
Green (RoHS & no
Sn/Br) |
SNAGCU |
Level-1-260C-UNLIM |
-20 to 85 |
AFE4432 |
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new
designs.
LIFEBUY: TI has announced that the
device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs.
Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
PRE_PROD
Unannounced device, not in production, not available for mass market, nor on the
web, samples not available.
PREVIEW: Device
has been announced but is not in production. Samples may or may not be
available.
OBSOLETE: TI has discontinued
the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free
(RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has
not been defined.
Pb-Free (RoHS): TI's
terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible
with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where
designed to be soldered at high temperatures, TI Pb-Free products are suitable
for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for
either 1) lead-based flip-chip solder bumps used between the die and package, or
2) lead-based die adhesive used between the die and leadframe. The component is
otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no
Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of
Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed
0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating
according to the JEDEC industry standard classifications, and peak solder
temperature.
(4) There may be additional marking, which relates to the logo,
the lot trace code information, or the environmental category on the
device.
(5) Multiple Device markings will be inside parentheses. Only
one Device Marking contained in parentheses and separated by a "~" will appear
on a device. If a line is indented then it is a continuation of the previous
line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple
material finish options. Finish options are separated by a vertical ruled line.
Lead/Ball Finish values may wrap to two lines if the finish value exceeds the
maximum column width.