ZHCSRW7 march   2023 AFE781H1 , AFE881H1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: HART Modem
    12. 6.12 Typical Characteristics: Power Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2 Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3 Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm-Based Interrupts
        2. 7.3.3.2 Alarm Action Configuration Register
        3. 7.3.3.3 Alarm Voltage Generator
        4. 7.3.3.4 Temperature Sensor Alarm Function
        5. 7.3.3.5 Internal Reference Alarm Function
        6. 7.3.3.6 ADC Alarm Function
        7. 7.3.3.7 Fault Detection
      4. 7.3.4 IRQ
      5. 7.3.5 HART Interface
        1. 7.3.5.1  FIFO Buffers
          1. 7.3.5.1.1 FIFO Buffer Access
          2. 7.3.5.1.2 FIFO Buffer Flags
        2. 7.3.5.2  HART Modulator
        3. 7.3.5.3  HART Demodulator
        4. 7.3.5.4  HART Modem Modes
          1. 7.3.5.4.1 Half-Duplex Mode
          2. 7.3.5.4.2 Full-Duplex Mode
        5. 7.3.5.5  HART Modulation and Demodulation Arbitration
          1. 7.3.5.5.1 HART Receive Mode
          2. 7.3.5.5.2 HART Transmit Mode
        6. 7.3.5.6  HART Modulator Timing and Preamble Requirements
        7. 7.3.5.7  HART Demodulator Timing and Preamble Requirements
        8. 7.3.5.8  IRQ Configuration for HART Communication
        9. 7.3.5.9  HART Communication Using the SPI
        10. 7.3.5.10 HART Communication Using UART
        11. 7.3.5.11 Memory Built-In Self-Test (MBIST)
      6. 7.3.6 Internal Reference
      7. 7.3.7 Integrated Precision Oscillator
      8. 7.3.8 One-Time Programmable (OTP) Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Power-Down Mode
      2. 7.4.2 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
        3. 7.5.1.3 SPI Plus UART Mode
        4. 7.5.1.4 HART Functionality Setup Options
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Frame Definition
        2. 7.5.2.2 SPI Read and Write
        3. 7.5.2.3 Frame Error Checking
        4. 7.5.2.4 Synchronization
      3. 7.5.3 UART Interface
        1. 7.5.3.1 UART Break Mode (UBM)
          1. 7.5.3.1.1 Interface With FIFO Buffers and Register Map
      4. 7.5.4 Status Bits
      5. 7.5.5 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx81H1 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Start-Up Circuit
          2. 8.2.1.2.2 Current Loop Control
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.5 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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