米6体育平台手机版

ZHCSQ92B march 2022 – june 2023 AFE7903

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		17x17mm FC-BGA	UNIT
THERMAL METRIC⁽¹⁾		400 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	16.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.42	°C/W
R_θJB	Junction-to-board thermal resistance	4.85	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.12	°C/W
Ψ_JB	Junction-to-board characterization parameter	4.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.