SPRS658F February   2010  – March 2014 AM1806

PRODUCTION DATA.  

  1. 1 AM1806 ARM Microprocessor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 Memory Map Summary
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Memory Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Programmable Real-Time Unit (PRU)
      9. 3.7.9  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      10. 3.7.10 Enhanced Pulse Width Modulators (eHRPWM)
      11. 3.7.11 Boot
      12. 3.7.12 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      13. 3.7.13 Inter-Integrated Circuit Modules(I2C0, I2C1)
      14. 3.7.14 Timers
      15. 3.7.15 Multichannel Audio Serial Ports (McASP)
      16. 3.7.16 Multichannel Buffered Serial Ports (McBSP)
      17. 3.7.17 Universal Serial Bus Modules (USB0)
      18. 3.7.18 Multimedia Card/Secure Digital (MMC/SD)
      19. 3.7.19 Liquid Crystal Display Controller(LCD)
      20. 3.7.20 Universal Host-Port Interface (UHPI)
      21. 3.7.21 Universal Parallel Port (uPP)
      22. 3.7.22 Video Port Interface (VPIF)
      23. 3.7.23 General Purpose Input Output
      24. 3.7.24 Reserved and No Connect
      25. 3.7.25 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments
        5. 6.7.1.5 AINTC Memory Map
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Module States
    9. 6.9  EDMA
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 External Memory Interface Register Descriptions
      5. 6.10.5 EMIFA Electrical Data/Timing
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 MDDR/DDR2 Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
    14. 6.14 Multichannel Audio Serial Port (McASP)
      1. 6.14.1 McASP Peripheral Registers Description(s)
      2. 6.14.2 McASP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
    15. 6.15 Multichannel Buffered Serial Port (McBSP)
      1. 6.15.1 McBSP Peripheral Register Description(s)
      2. 6.15.2 McBSP Electrical Data/Timing
        1. 6.15.2.1 Multichannel Buffered Serial Port (McBSP) Timing
    16. 6.16 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.16.1 SPI Peripheral Registers Description(s)
      2. 6.16.2 SPI Electrical Data/Timing
        1. 6.16.2.1 Serial Peripheral Interface (SPI) Timing
    17. 6.17 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.17.1 I2C Device-Specific Information
      2. 6.17.2 I2C Peripheral Registers Description(s)
      3. 6.17.3 I2C Electrical Data/Timing
        1. 6.17.3.1 Inter-Integrated Circuit (I2C) Timing
    18. 6.18 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.18.1 UART Peripheral Registers Description(s)
      2. 6.18.2 UART Electrical Data/Timing
    19. 6.19 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.19.1 USB Peripheral Registers Description(s)
      2. 6.19.2 USB0 [USB2.0] Electrical Data/Timing
    20. 6.20 LCD Controller (LCDC)
      1. 6.20.1 LCD Interface Display Driver (LIDD Mode)
      2. 6.20.2 LCD Raster Mode
    21. 6.21 Host-Port Interface (UHPI)
      1. 6.21.1 HPI Device-Specific Information
      2. 6.21.2 HPI Peripheral Register Description(s)
      3. 6.21.3 HPI Electrical Data/Timing
    22. 6.22 Universal Parallel Port (uPP)
      1. 6.22.1 uPP Register Descriptions
      2. 6.22.2 uPP Electrical Data/Timing
    23. 6.23 Video Port Interface (VPIF)
      1. 6.23.1 VPIF Register Descriptions
      2. 6.23.2 VPIF Electrical Data/Timing
    24. 6.24 Enhanced Capture (eCAP) Peripheral
    25. 6.25 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.25.1 eHRPWM Register Descriptions
      2. 6.25.2 Enhanced Pulse Width Modulator (eHRPWM) Timing
      3. 6.25.3 Trip-Zone Input Timing
    26. 6.26 Timers
      1. 6.26.1 Timer Electrical Data/Timing
    27. 6.27 Real Time Clock (RTC)
      1. 6.27.1 Clock Source
      2. 6.27.2 Real-Time Clock Register Descriptions
    28. 6.28 General-Purpose Input/Output (GPIO)
      1. 6.28.1 GPIO Register Description(s)
      2. 6.28.2 GPIO Peripheral Input/Output Electrical Data/Timing
      3. 6.28.3 GPIO Peripheral External Interrupts Electrical Data/Timing
    29. 6.29 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.29.1 PRUSS Register Descriptions
    30. 6.30 Emulation Logic
      1. 6.30.1 JTAG Port Description
      2. 6.30.2 Scan Chain Configuration Parameters
      3. 6.30.3 Initial Scan Chain Configuration
        1. 6.30.3.1 Adding TAPS to the Scan Chain
      4. 6.30.4 IEEE 1149.1 JTAG
        1. 6.30.4.1 JTAG Peripheral Register Description(s) - JTAG ID Register (DEVIDR0)
        2. 6.30.4.2 JTAG Test-Port Electrical Data/Timing
      5. 6.30.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZCE|361
  • ZWT|361
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

TI offers an extensive line of development tools for the device platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the device applications:

Software Development Tools:

Code Composer Studio™ Integrated Development Environment (IDE): including Editor

C/C++/Assembly Code Generation, and Debug plus additional development tools

Hardware Development Tools:

Extended Development System (XDS™) Emulator

For a complete listing of development-support tools for the device, visit the Texas Instruments web site on the Worldwide Web at www.ti.com uniform resource locator (URL). For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

7.1.2 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all AM1xxx processors and support tools. Each commercial AM1xxx platform member has one of three prefixes: X, P, or null (no prefix). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications.
    P Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification.
    NULL Fully-qualified production device.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

NULL devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

Figure 7-1 provides a legend for reading the complete device.

nomen_AM1806_prs658.gif
A. BGA = Ball Grid Array
B. Parts marked revision B are silicon revision 2.1 if '21' is marked on the package, and silicon revision 2.0 if there is no '21' marking.
Figure 7-1 Device Nomenclature

7.2 Documentation Support

The following documents describe the device. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.

    Reference Guides
    SPRUGU4 AM1806 ARM Microprocessor System Reference Guide
    SPRUFU0 AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide

7.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.4 Trademarks

E2E is a trademark of Texas Instruments.

ARM926EJ-S is a trademark of ARM Ltd.

Windows is a registered trademark of Microsoft.

I2C Bus is a trademark of Phillips.

All other trademarks are the property of their respective owners.

7.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.
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