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ZHCSVF3P December 1990 – March 2024 AM26C31

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

N|16
- MPDI002C
PW|16
- MPDS361A
DB|16
- MPDS507A
D|16
- MPDS178G
NS|16
- MPDS551A

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		AM26C31								UNIT
		D (SOIC)	DB (SSOP)	PW (TSSOP)	NS (SO)	N (PDIP)	J (CDIP)	W (CFP)	FK (LCCC)
		16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾⁽³⁾	84.6	102.6	107.5	88.5	60.6	—	—	—	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	43.5	48.7	38.4	46.2	48.1	39.3⁽⁴⁾	58.9⁽⁴⁾	37.1⁽⁴⁾	°C/W
R_θJB	Junction-to-board thermal resistance	43.2	54.3	53.7	50.7	40.6	56.4⁽⁴⁾	109.3⁽⁴⁾	36.2⁽⁴⁾	°C/W
ψ_JT	Junction-to-top characterization parameter	10.4	11.8	3.2	13.5	27.5	—	—	—	°C/W
ψ_JB	Junction-to-board characterization parameter	42.8	53.5	53.1	50.3	40.3	—	—	—	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	n/a	n/a	12⁽⁴⁾	5.7⁽⁴⁾	4.3⁽⁴⁾	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) Maximum power dissipation is a function of T_J(max), R_θJA, and T_A. The maximum allowable power dissipation at any allowable ambient temperature is P_D = (T_J(max) – T_A) / R_θJA. Operating at the absolute maximum T_J of 150°C can affect reliability.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

(4) Modelling assumption: MIL-STD-883 for R_θJC(top) and R_θJC(bot) JESD51 for R_θJB.