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ZHCSIZ2M December 1990 – October 2023 AM26C32 , AM26C32C , AM26C32M

PRODUCTION DATA

1
1 特性
2 应用
3 说明
4 Pin Configuration and Functions
5 Specifications
6 Parameter Measurement Information
7 Detailed Description
8 Application and Implementation
9 Device and Documentation Support
10Revision History
11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DB|16

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsiz2m_oa
zhcsiz2m_pm

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC⁽¹⁾		16 PINS	16 PINS	16 PINS	16 PINS	16 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	84.6	102.6	60.6	88.5	107.5	°C/W
R_θJC(top)	Junction-to-case(top) thermal resistance	43.5	48.7	48.1	46.2	38.4	°C/W
R_θJB	Junction-to-board thermal resistance	43.2	54.3	40.6	50.7	53.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	10.4	11.8	27.5	13.5	3.2	°C/W
Ψ_JB	Junction-to-bottom characterization parameter	42.8	53.5	40.3	50.3	53.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.