ZHCSPJ8B December   2021  – December 2023 AM2732 , AM2732-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM273x ZCE Pin Diagram
      2. 5.1.2 AM273x NZN Pin Diagram
    2. 5.2 Pin Attributes (AM273x ZCE, NZN Packages)
      1.      13
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC Signal Descriptions
        1.       16
      2. 5.3.2  CPTS Signal Descriptions
        1.       18
      3. 5.3.3  CSI 2.0 Signal Descriptions
        1.       20
      4. 5.3.4  DMM Signal Descriptions
        1.       22
      5. 5.3.5  ECAP Signal Descriptions
        1.       24
      6. 5.3.6  EPWM Signal Descriptions
        1.       26
        2.       27
        3.       28
        4.       29
      7. 5.3.7  GPIO Signal Descriptions
        1.       31
        2.       32
      8. 5.3.8  I2C Signal Descriptions
        1.       34
        2.       35
        3.       36
      9. 5.3.9  Clock Signal Descriptions
        1.       38
        2.       39
      10. 5.3.10 JTAG Signal Descriptions
        1.       41
      11. 5.3.11 LVDS Signal Descriptions
        1.       43
      12. 5.3.12 MCAN Signal Descriptions
        1.       45
        2.       46
      13. 5.3.13 MCASP Signal Descriptions
        1.       48
        2.       49
        3.       50
      14. 5.3.14 Ethernet Signal Descriptions
        1.       52
        2.       53
        3.       54
        4.       55
      15. 5.3.15 GPIO Signal Descriptions
        1.       57
        2.       58
      16. 5.3.16 Power Supply Signal Descriptions
        1.       60
      17. 5.3.17 QSPI Signal Descriptions
        1.       62
      18. 5.3.18 Reserverd Signal Descriptions
        1.       64
      19. 5.3.19 UART Signal Descriptions
        1.       66
        2.       67
      20. 5.3.20 SPI Signal Descriptions
        1.       69
        2.       70
        3.       71
        4.       72
      21. 5.3.21 System Signal Descriptions
        1.       74
      22. 5.3.22 Trace Signal Descriptions
        1.       76
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - Automotive
    3. 6.3  Power-On Hours (POH)
      1. 6.3.1 Automotive Temperature Profile
      2. 6.3.2 Industrial Temperature Profile
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Supply Specifications
    7. 6.7  I/O Buffer Type and Voltage Rail Dependency
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for nFBGA Package [ZCE285A]
    10. 6.10 Thermal Resistance Characteristics for nFBGA Package [NZN225A]
    11. 6.11 Power Consumption Summary
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Power Supply Sequencing and Reset Timing
      2. 6.12.2 Clock Specifications
      3. 6.12.3 Peripheral Information
        1. 6.12.3.1  QSPI Flash Memory Peripheral
          1. 6.12.3.1.1 QSPI Timing Conditions
          2. 6.12.3.1.2 QSPI Timing Requirements
          3. 6.12.3.1.3 QSPI Switching Characteristics
        2. 6.12.3.2  MIBSPI Peripheral
          1. 6.12.3.2.1 SPI Timing Conditions
          2. 6.12.3.2.2 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.12.3.2.3 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. 6.12.3.2.4 SPI Slave Mode Timing and Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        3. 6.12.3.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
          1. 6.12.3.3.1  RGMII/GMII/MII Timing Conditions
          2. 6.12.3.3.2  RGMII Transmit Clock Switching Characteristics
          3. 6.12.3.3.3  RGMII Transmit Data and Control Switching Characteristics
          4. 6.12.3.3.4  RGMII Recieve Clock Timing Requirements
          5. 6.12.3.3.5  RGMII Recieve Data and Control Timing Requirements
          6. 6.12.3.3.6  RMII Transmit Clock Switching Characteristics
          7. 6.12.3.3.7  RMII Transmit Data and Control Switching Characteristics
          8. 6.12.3.3.8  RMII Receive Clock Timing Requirements
          9. 6.12.3.3.9  RMII Receive Data and Control Timing Requirements
          10. 6.12.3.3.10 MII Transmit Switching Characteristics
          11. 6.12.3.3.11 MII Receive Clock Timing Requirements
          12. 6.12.3.3.12 MII Receive Timing Requirements
          13. 6.12.3.3.13 MII Transmit Clock Timing Requirements
          14. 6.12.3.3.14 MDIO Interface Timings
        4. 6.12.3.4  LVDS/Aurora Instrumentation and Measurement Peripheral
          1. 6.12.3.4.1 LVDS Interface Configuration
          2. 6.12.3.4.2 LVDS Interface Timings
        5. 6.12.3.5  UART Peripheral
          1. 6.12.3.5.1 UART Timing Requirements
        6. 6.12.3.6  I2C Protocol Definition
          1. 6.12.3.6.1 I2C Timing Requirements #GUID-D615B3D8-5F52-430D-93CB-70204118ACE4/T4362547-185
        7. 6.12.3.7  Controller Area Network - Flexible Data-Rate (CAN-FD)
          1. 6.12.3.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
        8. 6.12.3.8  CSI-2 Peripheral
        9. 6.12.3.9  General Purpose ADC (GPADC)
        10. 6.12.3.10 Enhanced Pulse-Width Modulator (ePWM)
        11. 6.12.3.11 Enhanced Capture (eCAP)
        12. 6.12.3.12 General-Purpose Input/Output
          1. 6.12.3.12.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-45 #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-50
      4. 6.12.4 Emulation and Debug
        1. 6.12.4.1 Emulation and Debug Description
        2. 6.12.4.2 JTAG Interface
          1. 6.12.4.2.1 Timing Requirements for IEEE 1149.1 JTAG
          2. 6.12.4.2.2 Switching Characteristics for IEEE 1149.1 JTAG
        3. 6.12.4.3 ETM Trace Interface
          1. 6.12.4.3.1 ETM TRACE Timing Requirements
          2. 6.12.4.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Main Subsystem
    3. 7.3 DSP Subsystem
    4. 7.4 Radar Control Subsystem
    5. 7.5 Other Subsystems
      1. 7.5.1 Radar A2D Data Format Over CSI2 Interface
      2. 7.5.2 ADC Channels (Service) for User Application
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Typical Application
      1. 8.1.1 Schematic
      2. 8.1.2 Layout
        1. 8.1.2.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NZN|225
  • ZCE|285
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Signal Descriptions

Note:

All digital IO pins of the device (except NERROR IN, NERROR_OUT, and WARM_RESET) are non-failsafe; hence, care needs to be taken that they are not driven externally without the VIO supply being present to the device

Note:

The GPIO state during the power supply ramp is not ensured. In case the GPIO is used in the application where the state of the GPIO is critical, even when NRESET is low, a tri-state buffer should be used to isolate the GPIO output from any attached device. An additional pull resister should be used to define the required state in the application. The NRESET signal could be used to control the output enable (OE) of the tri-state buffer.

Signal Description Header List

Many signals are available on multiple pins, according to the software configuration of the pin multiplexing options.

The following list describes the column headers:

  1. Signal Name: The name of the signal passing through the pin.
    Note:

    Signal names and descriptions provided in each Signal Descriptions table, represent the pin multiplexed signal function implemented at the pin and selected via PADCONFIG registers. Some device subsystems provide an additional layer of multiplexing for signal functions that are not described in these tables. For more information on secondary multiplexed signal functions, see the respective peripheral chapter of the device TRM.

  2. Signal Type: Signal type and direction:

    • I = Input

    • O = Output

    • IO = Input, Output, or simultaneously Input and Output

    • OD = Output, with open-drain output function

    • IOD = Input, Output, or simultaneously Input and Output, with open-drain output function

    • IOZ = Input, Output, or simultaneously Input and Output, with three-state output function

    • OZ = Output with three-state output function

    • A = Analog

    • CAP = LDO capacitor

    • PWR = Power

    • GND = Ground

  3. Description: Description of the signal
  4. Ball #: Ball number associated with signal

For more information on the I/O cell configurations, see the Pad Configuration Registers section within the Device Configuration chapter of the device TRM.
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