ZHCSLA7C December   2019  – September 2023 AM6526 , AM6528 , AM6546 , AM6548

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
      2. 5.3.2  CAL
        1. 5.3.2.1 MAIN Domain
      3. 5.3.3  CPSW2G
        1. 5.3.3.1 MCU Domain
      4. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
        2. 5.3.4.2 DDRSS Mapping
      5. 5.3.5  DMTIMER
        1. 5.3.5.1 MAIN Domain
        2. 5.3.5.2 MCU Domain
      6. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
      7. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
      8. 5.3.8  EHRPWM
        1. 5.3.8.1 MAIN Domain
      9. 5.3.9  EQEP
        1. 5.3.9.1 MAIN Domain
      10. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
        2. 5.3.10.2 WKUP Domain
      11. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
      12. 5.3.12 HyperBus
        1. 5.3.12.1 MCU Domain
      13. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
        2. 5.3.13.2 MCU Domain
        3. 5.3.13.3 WKUP Domain
      14. 5.3.14 MCAN
        1. 5.3.14.1 MCU Domain
      15. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
      16. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
        2. 5.3.16.2 MCU Domain
      17. 5.3.17 MMCSD
        1. 5.3.17.1 MAIN Domain
      18. 5.3.18 CPTS
        1. 5.3.18.1 MCU Domain
        2. 5.3.18.2 MAIN Domain
      19. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
      20. 5.3.20 OSPI
        1. 5.3.20.1 MCU Domain
      21. 5.3.21 PRU_ICSSG
        1. 5.3.21.1 MAIN Domain
      22. 5.3.22 SERDES
        1. 5.3.22.1 MAIN Domain
      23. 5.3.23 UART
        1. 5.3.23.1 MAIN Domain
        2. 5.3.23.2 MCU Domain
        3. 5.3.23.3 WKUP Domain
      24. 5.3.24 USB
        1. 5.3.24.1 MAIN Domain
      25. 5.3.25 Emulation and Debug
        1. 5.3.25.1 MAIN Domain
      26. 5.3.26 System and Miscellaneous
        1. 5.3.26.1 Boot Mode Configuration
          1. 5.3.26.1.1 MAIN Domain
          2. 5.3.26.1.2 MCU Domain
        2. 5.3.26.2 Clock
          1. 5.3.26.2.1 MAIN Domain
          2. 5.3.26.2.2 WKUP Domain
        3. 5.3.26.3 System
          1. 5.3.26.3.1 MAIN Domain
          2. 5.3.26.3.2 WKUP Domain
        4. 5.3.26.4 Miscellaneous
          1. 5.3.26.4.1 WKUP Domain
        5. 5.3.26.5 EFUSE
          1. 5.3.26.5.1 MAIN Domain
          2. 5.3.26.5.2 MCU Domain
      27. 5.3.27 Power Supply
    4. 5.4 Pin Multiplexing
    5. 5.5 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Power-On Hours (POH)
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
      1. 6.5.1 Voltage and Core Clock Specifications
    6. 6.6 Electrical Characteristics
      1. 6.6.1 I2C OPEN DRAIN DC Electrical Characteristics
      2. 6.6.2 Analog OSC Buffers DC Electrical Characteristics
      3. 6.6.3 Analog ADC DC Electrical Characteristics
      4. 6.6.4 DPHY CSI2 Buffers DC Electrical Characteristics
      5. 6.6.5 OLDI LVDS Buffers DC Electrical Characteristics
        1. 6.6.5.1 LVCMOS Buffers DC Electrical Characteristics
      6. 6.6.6 USBHS Buffers DC Electrical Characteristics
      7. 6.6.7 SERDES Buffers DC Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Sequencing
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 VDDA_1P8_SERDES0 Supply Slew Rate Requirement
        3. 6.9.2.3 Power-Up Sequencing
        4. 6.9.2.4 Power-Down Sequencing
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Electrical Data/Timing
        2. 6.9.3.2 Safety Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input Clocks / Oscillators
          1. 6.9.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
          2. 6.9.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
          4. 6.9.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 Auxiliary OSC1 Not Used
          6. 6.9.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
          7. 6.9.4.1.7 WKUP_LFOSC0 LVCMOS Digital Clock Source
          8. 6.9.4.1.8 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Recommended Clock and Control Signal Transition Behavior
        5. 6.9.4.5 Module and Peripheral Clock Frequencies
      5. 6.9.5 Peripherals
        1. 6.9.5.1  VIN
        2. 6.9.5.2  CPSW2G
          1. 6.9.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.9.5.2.2 CPSW2G RMII Timings
            1. 6.9.5.2.2.1 Timing Requirements for RMII[x]_REFCLK - RMII Mode
            2. 6.9.5.2.2.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode
            3. 6.9.5.2.2.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode
          3. 6.9.5.2.3 CPSW2G RGMII Timings
            1. 6.9.5.2.3.1 Timing Requirements for RGMII[x]_RCLK - RGMII Mode
            2. 6.9.5.2.3.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode
            3. 6.9.5.2.3.3 Switching Characteristics for RGMII[x]_TCLK - RGMII Mode
            4. 6.9.5.2.3.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL - RGMII Mode
        3. 6.9.5.3  CSI2
        4. 6.9.5.4  DDRSS
        5. 6.9.5.5  DSS
        6. 6.9.5.6  eCAP
          1. 6.9.5.6.1 eCAP Timing Requirements
          2. 6.9.5.6.2 eCAP Switching Characteristics
        7. 6.9.5.7  ePWM
          1. 6.9.5.7.1 ePWM Timing Requirements
          2. 6.9.5.7.2 ePWM Switching Characteristics
        8. 6.9.5.8  eQEP
          1. 6.9.5.8.1 eQEP Timing Requirements
          2. 6.9.5.8.2 eQEP Switching Characteristics
        9. 6.9.5.9  GPIO
          1. 6.9.5.9.1 GPIO Timing Requirements
          2. 6.9.5.9.2 GPIO Switching Characteristics
        10. 6.9.5.10 GPMC
          1. 6.9.5.10.1 GPMC and NOR Flash—Synchronous Mode
            1. 6.9.5.10.1.1 GPMC and NOR Flash Timing Requirements—Synchronous Mode
            2. 6.9.5.10.1.2 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
          2. 6.9.5.10.2 GPMC and NOR Flash—Asynchronous Mode
            1. 6.9.5.10.2.1 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
            2. 6.9.5.10.2.2 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
          3. 6.9.5.10.3 GPMC and NAND Flash—Asynchronous Mode
            1. 6.9.5.10.3.1 GPMC and NAND Flash Timing Requirements—Asynchronous Mode
            2. 6.9.5.10.3.2 GPMC and NAND Flash Switching Characteristics—Asynchronous Mode
        11. 6.9.5.11 HyperBus
          1. 6.9.5.11.1 Timing Requirements for HyperBus Initialization
          2. 6.9.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.9.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.9.5.12 I2C
        13. 6.9.5.13 MCAN
        14. 6.9.5.14 MCASP
          1. 6.9.5.14.1 MCASP Timing Requirements and Switching Characteristics
        15. 6.9.5.15 MCSPI
          1. 6.9.5.15.1 SPI—Master Mode
          2. 6.9.5.15.2 SPI—Slave Mode
        16. 6.9.5.16 MMCSD
          1. 6.9.5.16.1 MMCSDi — eMMC/SD/SDIO Card Interface
            1. 6.9.5.16.1.1 Default Speed, 3.3V Legacy SDR Mode
            2. 6.9.5.16.1.2 High Speed, 3.3V High Speed SDR Mode
            3. 6.9.5.16.1.3 UHS-I SDR12, 1.8-V Legacy SDR Mode
            4. 6.9.5.16.1.4 UHS-I SDR25 Mode
            5. 6.9.5.16.1.5 UHS-I DDR50 Mode
            6. 6.9.5.16.1.6 UHS-I SDR50 Mode
            7. 6.9.5.16.1.7 UHS-I SDR104 / HS200 Mode
        17. 6.9.5.17 CPTS
          1. 6.9.5.17.1 CPTS Timing Requirements
          2. 6.9.5.17.2 CPTS Switching Characteristics
        18. 6.9.5.18 OSPI
          1. 6.9.5.18.1 OSPI with Data Training
            1. 6.9.5.18.1.1 OSPI Switching Characteristics - Data Training
          2. 6.9.5.18.2 OSPI without Data Training
            1. 6.9.5.18.2.1 OSPI Timing Requirements - SDR Mode
            2. 6.9.5.18.2.2 OSPI Switching Characteristics - SDR Mode
            3. 6.9.5.18.2.3 OSPI Timing Requirements - DDR Mode
            4. 6.9.5.18.2.4 OSPI Switching Characteristics - DDR Mode
        19. 6.9.5.19 OLDI
          1. 6.9.5.19.1 OLDI Switching Characteristics
        20. 6.9.5.20 PCIE
        21. 6.9.5.21 PRU_ICSSG
          1. 6.9.5.21.1 Programmable Real-Time Unit (PRU_ICSSG PRU)
            1. 6.9.5.21.1.1 PRU_ICSSG PRU Direct Input/Output Mode Electrical Data and Timing
              1. 6.9.5.21.1.1.1 PRU_ICSSG PRU Switching Characteristics - Direct Output Mode
            2. 6.9.5.21.1.2 PRU_ICSSG PRU Parallel Capture Mode Electrical Data and Timing
              1. 6.9.5.21.1.2.1 PRU_ICSSG PRU Timing Requirements - Parallel Capture Mode
            3. 6.9.5.21.1.3 PRU_ICSSG PRU Shift Mode Electrical Data and Timing
              1. 6.9.5.21.1.3.1 PRU_ICSSG PRU Timing Requirements - Shift In Mode
              2. 6.9.5.21.1.3.2 PRU_ICSSG PRU Switching Characteristics - Shift Out Mode
            4. 6.9.5.21.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Modes Electrical Data and Timing
              1. 6.9.5.21.1.4.1 PRU_ICSSG PRU Timing Requirements - Sigma Delta Mode
              2. 6.9.5.21.1.4.2 PRU_ICSSG PRU Timing Requirements - Peripheral Interface Mode
              3. 6.9.5.21.1.4.3 PRU_ICSSG PRU Switching Characteristics - Peripheral Interface Mode
          2. 6.9.5.21.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.9.5.21.2.1 PRU_ICSSG PWM Electrical Data and Timing
              1. 6.9.5.21.2.1.1 PRU_ICSSG PWM Switching Characteristics
          3. 6.9.5.21.3 PRU_ICSSG Industrial Ethernet Peripheral (PRU_ICSSG IEP)
            1. 6.9.5.21.3.1 PRU_ICSSG IEP Electrical Data and Timing
              1. 6.9.5.21.3.1.1 PRU_ICSSG IEP Timing Requirements - Input Validated with SYNCx
              2. 6.9.5.21.3.1.2 PRU_ICSSG IEP Timing Requirements - Digital IOs
              3. 6.9.5.21.3.1.3 PRU_ICSSG IEP Timing Requirements - LATCHx_IN
          4. 6.9.5.21.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
            1. 6.9.5.21.4.1 PRU_ICSSG UART Electrical Data and Timing
              1. 6.9.5.21.4.1.1 PRU_ICSSG UART Timing Requirements
              2. 6.9.5.21.4.1.2 PRU_ICSSG UART Switching Characteristics
          5. 6.9.5.21.5 PRU_ICSSG Enhanced Capture Peripheral (PRU-ICSS ECAP)
            1. 6.9.5.21.5.1 PRU_ICSSG ECAP Electrical Data and Timing
              1. 6.9.5.21.5.1.1 PRU_ICSSG ECAP Timing Requirements
              2. 6.9.5.21.5.1.2 PRU_ICSSG ECAP Switching Characteristics
          6. 6.9.5.21.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.9.5.21.6.1 PRU_ICSSG MDIO Electrical Data and Timing
              1. 6.9.5.21.6.1.1 PRU_ICSSG MDIO Timing Requirements
              2. 6.9.5.21.6.1.2 PRU_ICSSG MDIO Switching Characteristics - MDIO_CLK
              3. 6.9.5.21.6.1.3 PRU_ICSSG MDIO Switching Characteristics – MDIO_DATA
            2. 6.9.5.21.6.2 PRU_ICSSG RGMII Electrical Data and Timing
              1. 6.9.5.21.6.2.1 PRU_ICSSG RGMII Timing Requirements - RGMII_RXC
              2. 6.9.5.21.6.2.2 PRU_ICSSG RGMII Timing Requirements - RGMII_RD[3:0] and RGMII_RX_CTL
              3. 6.9.5.21.6.2.3 PRU_ICSSG RGMII Switching Characteristics - RGMII_TXC
              4. 6.9.5.21.6.2.4 PRU_ICSSG RGMII Switching Characteristics - RGMII_TD[3:0] and RGMII_TX_CTL
            3. 6.9.5.21.6.3 PRU_ICSSG MII_RT Electrical Data and Timing
              1. 6.9.5.21.6.3.1 PRU_ICSSG MII_RT Timing Requirements – MII_RX_CLK
              2. 6.9.5.21.6.3.2 PRU_ICSSG MII_RT Timing Requirements – MII_RXD[3:0], MII_RX_DV, and MII_RX_ER
              3. 6.9.5.21.6.3.3 PRU_ICSSG MII_RT Switching Characteristics – MII_TX_CLK
              4. 6.9.5.21.6.3.4 PRU_ICSSG MII_RT Switching Characteristics – MII_TXD[3:0] and MII_TXEN
        22. 6.9.5.22 Timers
          1. 6.9.5.22.1 Timing Requirements for Timers
          2. 6.9.5.22.2 Switching Characteristics for Timers
        23. 6.9.5.23 UART
          1. 6.9.5.23.1 Timing Requirements for UART
          2. 6.9.5.23.2 Switching Characteristics Over Recommended Operating Conditions for UART
        24. 6.9.5.24 USB
        25. 6.9.5.25 Emulation and Debug
          1. 6.9.5.25.1 Debug Trace
          2. 6.9.5.25.2 JTAG
            1. 6.9.5.25.2.1 JTAG Electrical Data and Timing
              1. 6.9.5.25.2.1.1 JTAG Timing Requirements
              2. 6.9.5.25.2.1.2 JTAG Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53
      2. 7.2.2 Arm Cortex-R5F
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 PRU_ICSSG
        1. 7.3.1.1 PRU_ICSSG PRU and RTU_PRU Cores
        2. 7.3.1.2 PRU_ICSSG Broadside Accelerators Overview
        3. 7.3.1.3 PRU_ICSSG UART Module
        4. 7.3.1.4 PRU_ICSSG ECAP Module
        5. 7.3.1.5 PRU_ICSSG PWM Module
        6. 7.3.1.6 PRU_ICSSG MII_G_RT Module
        7. 7.3.1.7 PRU_ICSSG MII MDIO Module
        8. 7.3.1.8 PRU_ICSSG IEP
      2. 7.3.2 GPU
    4. 7.4 Other Subsystems
      1. 7.4.1 DMSC
      2. 7.4.2 MSMC
      3. 7.4.3 NAVSS
        1. 7.4.3.1 NAVSS0
        2. 7.4.3.2 MCU_NAVSS0
      4. 7.4.4 PDMA Controller
      5. 7.4.5 Peripherals
        1. 7.4.5.1  ADC
        2. 7.4.5.2  CAL
        3. 7.4.5.3  CPSW2G
        4. 7.4.5.4  DCC
        5. 7.4.5.5  DDRSS
        6. 7.4.5.6  DSS
        7. 7.4.5.7  ЕCAP
        8. 7.4.5.8  EPWM
        9. 7.4.5.9  ELM
        10. 7.4.5.10 ESM
        11. 7.4.5.11 EQEP
        12. 7.4.5.12 GPIO
        13. 7.4.5.13 GPMC
        14. 7.4.5.14 HyperBus
        15. 7.4.5.15 I2C
        16. 7.4.5.16 MCAN
        17. 7.4.5.17 MCASP
        18. 7.4.5.18 MCRC
        19. 7.4.5.19 MCSPI
        20. 7.4.5.20 MMCSD
        21. 7.4.5.21 OSPI
        22. 7.4.5.22 PCIE
        23. 7.4.5.23 SerDes
        24. 7.4.5.24 RTI
        25. 7.4.5.25 Timers
        26. 7.4.5.26 UART
        27. 7.4.5.27 USB
    5. 7.5 Identification
      1. 7.5.1 Revision Identification
      2. 7.5.2 Die Identification
      3. 7.5.3 JTAG Identification
      4. 7.5.4 ROM Code Identification
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for AM65x/DRA80xM Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (Only Available in Octal Flash Devices)
      3. 8.2.3 USB Design Guidelines
      4. 8.2.4 High Speed Differential Signal Routing Guidance
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 MMC Design Guidelines
      7. 8.2.7 Integrated Power Management Features
      8. 8.2.8 External Capacitors
        1. 8.2.8.1 LVCMOS External Capacitor Connections
      9. 8.2.9 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ACD|784
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3.4.2 DDRSS Mapping

Table 5-9 presents DDRSS interface signal mapping per device memory type.

Note:

DDR3L and LPDDR4 memory types are not supported on this SoC.

Table 5-9 DDRSS Signal Mapping
SIGNAL NAME [1] MEMORY TYPE PIN TYPE[3] BALL[4]
DDR3L(2) DDR4(1)(2) LPDDR4(1)
DDR_AC0 A0 A0 CA0_A IO A10
DDR_AC1 A1 A1 CA1_A IO D9
DDR_AC2 A2 A2 CA2_A IO C9
DDR_AC3 A3 A3 CA3_A IO E9
DDR_AC4 A4 A4 CA4_A IO A9
DDR_AC5 A5 A5 CA5_A IO E8
DDR_AC6 A6 A6 CA0_B IO F8
DDR_AC7 A7 A7 CA1_B IO C7
DDR_AC8 A8 A8 CA2_B IO C8
DDR_AC9 A9 A9 CA3_B IO D7
DDR_AC10 A10 A10 CA4_B IO E7
DDR_AC11 A11 A11 CA5_B IO A6
DDR_AC12 A12 A12 CS0_B IO F7
DDR_AC13 A13 A13 CKE0_B IO D6
DDR_AC14 A14 A14/WE_n CS1_B IO C6
DDR_AC15 A15 A15/CAS_n CKE1_B IO F6
DDR_AC16 WE_n A16/RAS_n IO E6
DDR_AC17 CAS_n A17 IO E5
DDR_AC18 RAS_n ACT_n IO D8
DDR_AC19 BA0 BA0 IO D10
DDR_AC20 BA1 BA1 IO E10
DDR_AC21 BA2 BG0 IO C10
DDR_AC22 BG1 IO F11
DDR_AC23 PAR IO B10
DDR_AC24 CS0_n CS0_n CS0_A IO D11
DDR_AC25 ODT0 ODT0 IO B11
DDR_AC26 CKE0 CKE0 CKE0_A IO C11
DDR_AC27 CS1_n CS1_n CS1_A IO E11
DDR_AC28 ODT1 ODT1 IO E12
DDR_AC29 CKE1 CKE1 CKE1_A IO D12
DDR_ALERTn ALERT_n IO D5
DDR_CK0P CK0 CK0_t CK_t_A IO A8
DDR_CK0N CK0_n CK0_c CK_c_A IO B8
DDR_CK1P CK1 CK1_t CK_t_B IO A7
DDR_CK1N CK1_n CK1_c CK_c_B IO B7
DDR_DQ0 DQ0 DQ0 DQ0 IO A3
DDR_DQ1 DQ1 DQ1 DQ1 IO B2
DDR_DQ2 DQ2 DQ2 DQ2 IO C2
DDR_DQ3 DQ3 DQ3 DQ3 IO D2
DDR_DQ4 DQ4 DQ4 DQ4 IO E2
DDR_DQ5 DQ5 DQ5 DQ5 IO G1
DDR_DQ6 DQ6 DQ6 DQ6 IO F2
DDR_DQ7 DQ7 DQ7 DQ7 IO F1
DDR_DM0 DM0 DM0_n DMI0 IO E1
DDR_DQ8 DQ8 DQ8 DQ8 IO E3
DDR_DQ9 DQ9 DQ9 DQ9 IO C3
DDR_DQ10 DQ10 DQ10 DQ10 IO D3
DDR_DQ11 DQ11 DQ11 DQ11 IO B3
DDR_DQ12 DQ12 DQ12 DQ12 IO D4
DDR_DQ13 DQ13 DQ13 DQ13 IO C4
DDR_DQ14 DQ14 DQ14 DQ14 IO B4
DDR_DQ15 DQ15 DQ15 DQ15 IO B5
DDR_DM1 DM1 DM1_n DMI1 IO C5
DDR_DQ16 DQ16 DQ16 DQ16 IO E13
DDR_DQ17 DQ17 DQ17 DQ17 IO C14
DDR_DQ18 DQ18 DQ18 DQ18 IO B14
DDR_DQ19 DQ19 DQ19 DQ19 IO A14
DDR_DQ20 DQ20 DQ20 DQ20 IO E14
DDR_DQ21 DQ21 DQ21 DQ21 IO B13
DDR_DQ22 DQ22 DQ22 DQ22 IO C13
DDR_DQ23 DQ23 DQ23 DQ23 IO D13
DDR_DM2 DM2 DM2_n DMI2 IO D14
DDR_DQ24 DQ24 DQ24 DQ24 IO D15
DDR_DQ25 DQ25 DQ25 DQ25 IO C15
DDR_DQ26 DQ26 DQ26 DQ26 IO E16
DDR_DQ27 DQ27 DQ27 DQ27 IO E15
DDR_DQ28 DQ28 DQ28 DQ28 IO D16
DDR_DQ29 DQ29 DQ29 DQ29 IO B16
DDR_DQ30 DQ30 DQ30 DQ30 IO C16
DDR_DQ31 DQ31 DQ31 DQ31 IO A17
DDR_DM3 DM3 DM3_n DMI3 IO B17
DDR_ECC_D0 DQ32 DQ32 DQ32 IO B19
DDR_ECC_D1 DQ33 DQ33 DQ33 IO B18
DDR_ECC_D2 DQ34 DQ34 DQ34 IO C18
DDR_ECC_D3 DQ35 DQ35 DQ35 IO D18
DDR_ECC_D4 DQ36 DQ36 DQ36 IO E18
DDR_ECC_D5 DQ37 DQ37 DQ37 IO E17
DDR_ECC_D6 DQ38 DQ38 DQ38 IO D17
DDR_ECC_DM DM4 DM4_n DM4 IO C17
DDR_DQS0P DQS0 DQS0_t DQS0 IO D1
DDR_DQS0N DQS0_n DQS0_c DQS0_n IO C1
DDR_DQS1P DQS1 DQS1_t DQS1 IO A5
DDR_DQS1N DQS1_n DQS1_c DQS1_n IO A4
DDR_DQS2P DQS2 DQS2_t DQS2 IO A13
DDR_DQS2N DQS2_n DQS2_c DQS2_n IO A12
DDR_DQS3P DQS3 DQS3_t DQS3 IO A15
DDR_DQS3N DQS3_n DQS3_c DQS3_n IO A16
DDR_ECC_DQSP DQS4 DQS4_t DQS4 IO A19
DDR_ECC_DQSN DQS4_n DQS4_c DQS4_n IO A18
DDR_RESETn RESET_n RESET_n RESET_n IO A11
DDR_VREF0 VREF0 VREF0 VREF0 A F12
DDR_VREF_ZQ VREF_ZQ VREF_ZQ VREF_ZQ A F15
DDR_VTP VTP VTP VTP A F13
(1) This device cannot support two independent channels.
(2) Only single rank is supported for DDR3L and DDR4.
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