SBASB14 October   2024 AMC0311S-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (D Package)
    5. 6.5  Thermal Information (DWV Package)
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications (Basic Isolation)
    8. 6.8  Insulation Specifications (Reinforced Isolation)
    9. 6.9  Safety-Related Certifications (Basic Isolation)
    10. 6.10 Safety-Related Certifications (Reinforced Isolation)
    11. 6.11 Safety Limiting Values (D Package)
    12. 6.12 Safety Limiting Values (DWV Package)
    13. 6.13 Electrical Characteristics
    14. 6.14 Switching Characteristics
    15. 6.15 Timing Diagram
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Best Design Practices
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DWV|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Device Functional Modes

The AMC0x11S-Q1 operates in one of the following states:

  • OFF-state: The low-side supply (VDD2) is below the VDD2UV threshold. The device is not responsive. OUT is in Hi-Z state. Internally, OUT is clamped to VDD2 and GND2 by ESD protection diodes.
  • Missing high-side supply: The low-side of the device (VDD2) is supplied and within the Recommended Operating Conditions section. The high-side supply (VDD1) is below the VDD1UV threshold. The OUT pin is driven to VREFIN (0V if REFIN is shorted to GND2).
  • Analog input overrange (positive fullscale input): VDD1 and VDD2 are within recommended operating conditions but the analog input voltage VIN is above the maximum clipping voltage VClipping, MAX. The device outputs VClipping + VREFIN at the OUT pin.
  • Analog input underrange (negative fullscale input): VDD1 and VDD2 are within recommended operating conditions but the analog input voltage VIN is below the minimum clipping voltage VClipping, MIN. The OUT pin is driven to VREFIN (0V if REFIN is shorted to GND2).
  • Normal operation: VDD1, VDD2, and VIN are within the recommended operating conditions. The device outputs a voltage that is proportional to the input voltage.

Table 7-1 lists the operating modes.

Table 7-1 Device Operational Modes
OPERATING CONDITION VDD1 VDD2 VIN DEVICE
RESPONSE
OFF Don't care VDD2 < VDD2UV Don't care OUT is in Hi-Z state. Internally, OUT is clamped to VDD2 and GND2 by ESD protection diodes.
Missing high-side supply VDD1 < VDD1UV Valid(1) Don't care The OUT pin is driven to VREFIN (0V if REFIN is shorted to GND2).
Input overrange Valid(1) Valid(1) VIN > VClipping, MAX The device outputs VClipping + VREFIN at the OUT pin.
Input underrange Valid(1) Valid(1) VIN < VClipping, MIN The OUT pin is driven to VREFIN (0V if REFIN is shorted to GND2).
Normal operation Valid(1) Valid(1) Valid(1) The device outputs a voltage that is proportional to the input voltage.
(1) "Valid" denotes within the recommended operating conditions.
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