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ZHCSHJ0C June 2018 – November 2022 AMC1211-Q1

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		DWV (SOIC)	UNIT
THERMAL METRIC⁽¹⁾		8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	84.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	28.3	°C/W
R_θJB	Junction-to-board thermal resistance	41.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	4.9	°C/W
Ψ_JB	Junction-to-board characterization parameter	39.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.