ZHCSF12G april   2016  – april 2023 AMC1301

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6.   Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
    4. 7.4 Device Functional Modes
  10. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Sizing
        2. 8.2.2.2 Input Filter Design
        3. 8.2.2.3 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  11. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  12. 10Mechanical, Packaging, and Orderable Information

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Revision History

Changes from March 14, 2023 to April 24, 2023 (from Revision F (April 2020) to Revision G (April 2023))

  • 更改了文档标题Go
  • 更改了特性 部分:更改、删除和重新编排了要点Go
  • 将隔离标准从 DIN VDE V 0884-11 (VDE V 0884-10) 更改为 DIN EN IEC 60747-17 (VDE 0884-17),并相应更新了绝缘规格安全相关认证Go
  • 删除了应用 部分中的最后一个要点Go
  • 更改了说明 部分,以将共模去耦电容器作为已知的最佳实践Go
  • Changed pin names VINP to INP, VINN to INN, VOUTP to OUTP, and VOUTN to OUTN throughout documentGo
  • Changed Description column and added footnotes to Pin Functions tableGo
  • Changed CDM ESD standard from JESD22-C101 to JDEC JS-002 Go
  • Changed PD from 81.4 mW to 99 mWGo
  • Changed PD1 (VDD1 = 3.3 V) from  24.85 mW to 31 mWGo
  • Changed PD1 (VDD1 = 5.5 V) from  45.65 mW to 54 mWGo
  • Changed PD2 (VDD2 = 3.3 V) from 20.16 mW to 26 mWGo
  • Changed PD2 (VDD2 = 5.5 V) from 35.75 mW to 45 mWGo
  • Changed DTI from ≥0.027 mm to ≥0.021 mm in Insulation Specifications tableGo
  • Changed IDD1 (3.0 V ≤ VDD1 ≤ 3.6 V) from 5.0 mA (typ) / 6.9 mA (max) to 6.3 mA (typ) / 8.5 mA (max)Go
  • Changed IDD1 (4.5 V ≤ VDD1 ≤ 5.5 V) from 5.9 mA (typ) / 8.3 mA (max) to 7.2 mA (typ) / 9.8 mA (max)Go
  • Changed IDD2 (3.0 V ≤ VDD2 ≤ 3.6 V) from 4.4 mA (typ) / 5.6 mA (max) to 5.3 mA (typ) / 7.2 mA (max)Go
  • Changed IDD2 (4.5 V ≤ VDD2 ≤ 5.5 V) from 4.8 mA (typ) / 6.5 mA (max) to 5.9 mA (typ) / 8.1 mA (max)Go
  • Changed Timing Diagram sectionGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagram imageGo
  • Changed the Analog Input sectionGo
  • Added the Isolation Channel Signal Transmission sectionGo
  • Added Analog Output section, deleted Fail-Safe Output sectionGo
  • Changed Device Functional Modes sectionGo
  • Changed Application Information sectionGo
  • Changed Typical Application sectionGo
  • Changed Best Design Practices sectionGo
  • Changed Power Supply Recommendations sectionGo
  • Changed the Recommended Layout of the AMC1301 figureGo
  • Added a link to the Isolated Voltage-Measurement Circuit in the Related Documentation sectionGo

Changes from Revision E (March 2018) to Revision F (April 2020)

  • 根据 ISO 标准更改了安全相关认证详细信息Go
  • IEC 60950-1 和 IEC60065 更改为 IEC 62368-1 Go
  • 说明 部分中将 VDE V 0884-10 更改为 VDE V 0884-11 Go
  • Changed TA parameter from specified to operating in Device Comparison Table Go
  • Changed CLR and CPG values from 9 mm to 8.5 mmGo
  • Changed Insulation Specifications table per ISO standardGo
  • Changed Safety-Related Certifications table per ISO standardGo
  • Changed Safety Limiting Values description as per ISO standardGo
  • Changed Rise and Fall Time Test Waveforms figureGo
  • Changed Delay Time Test Waveforms figureGo
  • Changed Functional Block Diagram figureGo