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ZHCSF12G april 2016 – april 2023 AMC1301

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		DWV (SOIC)	UNIT
THERMAL METRIC⁽¹⁾		8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	110.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.7	°C/W
R_θJB	Junction-to-board thermal resistance	66.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	16.0	°C/W
Ψ_JB	Junction-to-board characterization parameter	64.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.