ZHCSF12G april   2016  – april 2023 AMC1301

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6.   Device Comparison Table
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Sizing
        2. 8.2.2.2 Input Filter Design
        3. 8.2.2.3 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  12. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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6.6 Insulation Specifications

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VALUE UNIT
GENERAL
CLR External clearance(1) Shortest pin-to-pin distance through air ≥ 8.5 mm
CPG External creepage(1) Shortest pin-to-pin distance across the package surface ≥ 8.5 mm
DTI Distance through insulation Minimum internal gap (internal clearance) of the double insulation ≥ 0.021 mm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 ≥ 600 V
Material group According to IEC 60664-1 I
Overvoltage category
per IEC 60664-1		 Rated mains voltage ≤ 600 VRMS I-IV
Rated mains voltage ≤ 1000 VRMS I-III
DIN EN IEC 60747-17 (VDE 0884-17)(2)
VIORM Maximum repetitive peak isolation voltage At AC voltage 1500 VPK
VIOWM Maximum-rated isolation
working voltage		 At AC voltage (sine wave) 1000 VRMS
At DC voltage 1500 VDC
VIOTM Maximum transient
isolation voltage		 VTEST = VIOTM, t = 60 s (qualification test),
VTEST = 1.2 × VIOTM, t = 1 s (100% production test)		 7000 VPK
VIMP Maximum impulse voltage(2) Tested in air, 1.2/50-µs waveform per IEC 62368-1 7700 VPK
VIOSM Maximum surge
isolation voltage(3)		 Tested in oil (qualification test),
1.2/50-µs waveform per IEC 62368-1		 10000 VPK
qpd Apparent charge(5) Method a, after input/output safety test subgroups 2 and 3,
Vpd(ini) = VIOTM, tini = 60 s, Vpd(m) = 1.2 × VIORM, tm = 10 s		 ≤ 5 pC
Method a, after environmental tests subgroup 1,
Vpd(ini) = VIOTM, tini = 60 s, Vpd(m) = 1.6 × VIORM, tm = 10 s		 ≤ 5
Method b1, at preconditioning (type test) and routine test,
Vpd(ini) = 1.2 x VIOTM, tini = 1 s, Vpd(m) = 1.875 × VIORM, tm = 1 s		 ≤ 5
Method b2, at routine test (100% production)(7),
Vpd(ini) = Vpd(m) = 1.2 x VIOTM, tini =  tm = 1 s		 ≤ 5
CIO Barrier capacitance,
input to output(5)		 VIO = 0.5 VPP at 1 MHz ~1.2 pF
RIO Insulation resistance,
input to output(5)		 VIO = 500 V at TA = 25°C > 1012 Ω
VIO = 500 V at 100°C ≤ TA ≤ 125°C > 1011
VIO = 500 V at TS = 150°C > 109
Pollution degree 2
Climatic category AMC1301 40/125/21
AMC1301S 55/125/21
UL1577
VISO Withstand isolation voltage VTEST = VISO, t = 60 s (qualification test),
VTEST = 1.2 × VISO, t = 1 s (100% production test)		 5000 VRMS
(1) Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal in certain cases. Techniques such as inserting grooves, ribs, or both on a PCB are used to help increase these specifications.
(2) Testing is carried out in air to determine the surge immunity of the package.
(3) Testing is carried in oil to determine the intrinsic surge immunity of the isolation barrier.
(4) Apparent charge is electrical discharge caused by a partial discharge (pd).
(5) All pins on each side of the barrier are tied together, creating a two-pin device.
(6) Either method b1 or b2 is used in production.
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