ZHCSIF3D June 2018 – June 2021 AMC1302
PRODUCTION DATA
THERMAL METRIC(1) |
AMC1302
|
UNIT | |
---|---|---|---|
DWV (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 85.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 26.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 43.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 4.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 41.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |