ZHCSDX9E September 2014 – January 2017 AMC1304L05 , AMC1304L25 , AMC1304M05 , AMC1304M25
PRODUCTION DATA.
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2500 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
LDOIN | LDO input supply voltage (LDOIN pin) | 4.0 | 15.0 | 18.0 | V |
DVDD | Digital (controller-side) supply voltage (DVDD pin) | 3.0 | 3.3 | 5.5 | V |
TA | Operating ambient temperature range | –40 | 125 | °C |
THERMAL METRIC (1) | AMC1304x | UNIT | |
---|---|---|---|
DW (SOIC) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 80.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 40.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 45.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 11.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 44.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |
PARAMETER | TEST CONDITIONS | VALUE | UNIT | |
---|---|---|---|---|
GENERAL | ||||
CLR | Minimum air gap (clearance)(1) | Shortest pin-to-pin distance through air | ≥ 8 | mm |
CPG | Minimum external tracking (creepage)(1) | Shortest pin-to-pin distance across the package surface | ≥ 8 | mm |
DTI | Distance through insulation | Minimum internal gap (internal clearance) of the double insulation (2 × 0.0135 mm) | 0.027 | mm |
CTI | Comparative tracking index | DIN EN 60112 (VDE 0303-11); IEC 60112 | ≥ 600 | V |
Material group | According to IEC 60664-1 | I | ||
Overvoltage category per IEC 60664-1 | Rated mains voltage ≤ 300 VRMS | I-IV | ||
Rated mains voltage ≤ 600 VRMS | I-III | |||
Rated mains voltage ≤ 1000 VRMS | I-II | |||
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12(2) | ||||
VIORM | Maximum repetitive peak isolation voltage | At ac voltage (bipolar or unipolar) | 1414 | VPK |
VIOWM | Maximum-rated isolation working voltage | At ac voltage (sine wave) | 1000 | VRMS |
At dc voltage | 1500 | VDC | ||
VIOTM | Maximum transient isolation voltage | VTEST = VIOTM, t = 60 s (qualification test) | 7000 | VPK |
VTEST = 1.2 x VIOTM, t = 1 s (100% production test) | 8400 | |||
VIOSM | Maximum surge isolation voltage(3) | Test method per IEC 60065, 1.2/50-μs waveform, VTEST = 1.6 x VIOSM = 10000 VPK (qualification) | 6250 | VPK |
qpd | Apparent charge(4) | Method a, after input/output safety test subgroup 2 / 3, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.2 x VIORM = 1697 VPK, tm = 10 s | ≤ 5 | pC |
Method a, after environmental tests subgroup 1, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.6 x VIORM = 2263 VPK, tm = 10 s | ≤ 5 | pC | ||
Method b1, at routine test (100% production) and preconditioning (type test), Vini = VIOTM, tini = 1 s, Vpd(m) = 1.875 x VIORM = 2652 VPK, tm = 1 s | ≤ 5 | pC | ||
CIO | Barrier capacitance, input to output(5) | VIO = 0.5 VPP at 1 MHz | 1.2 | pF |
RIO | Insulation resistance, input to output(5) | VIO = 500 V at TS = 150°C | > 109 | Ω |
Pollution degree | 2 | |||
Climatic category | 40/125/21 | |||
UL1577 | ||||
VISO | Withstand isolation voltage | VTEST = VISO = 5000 VRMS or 7000 VDC, t = 60 s (qualification test), VTEST = 1.2 x VISO = 6000 VRMS, t = 1 s (100% production test) | 5000 | VRMS |
VDE | UL | ||
---|---|---|---|
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12, DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08, and DIN EN 60095 (VDE 0860): 2005-11 | Recognized under UL1577 component recognition and CSA component acceptance NO 5 programs | ||
Reinforced insulation | Single protection | ||
File number: 40040142 | File number: E181974 |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
IS | Safety input, output, or supply current | θJA = 80.2°C/W, LDOIN = 18 V, TJ = 150°C, TA = 25°C, see Figure 3 |
86.5 | mA | ||
PS | Safety input, output, or total power | θJA = 80.2°C/W, TJ = 150°C, TA = 25°C, see Figure 4 | 1558(1) | mW | ||
TS | Maximum safety temperature | 150 | °C |
The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
ANALOG INPUTS | ||||||
VClipping | Maximum differential voltage input range (AINP-AINN) |
±62.5 | mV | |||
FSR | Specified linear full-scale range (AINP-AINN) |
–50 | 50 | mV | ||
VCM | Operating common-mode input range | –0.032 | 1.2 | V | ||
CID | Differential input capacitance | 2 | pF | |||
IIB | Input bias current | Inputs shorted to AGND | –97 | –72 | –57 | μA |
RID | Differential input resistance | 5 | kΩ | |||
IIO | Input offset current | ±5 | nA | |||
CMTI | Common-mode transient immunity | 15 | kV/μs | |||
CMRR | Common-mode rejection ratio | fIN = 0 Hz, VCM min ≤ VIN ≤ VCM max |
–98 | dB | ||
fIN from 0.1 Hz to 50 kHz, VCM min ≤ VIN ≤ VCM max |
–85 | |||||
BW | Input bandwidth | 800 | kHz | |||
DC ACCURACY | ||||||
DNL | Differential nonlinearity | Resolution: 16 bits | –0.99 | 0.99 | LSB | |
INL | Integral nonlinearity (1) | Resolution: 16 bits | –4 | ±1.5 | 4 | LSB |
EO | Offset error | Initial, at 25°C | –50 | ±2.5 | 50 | µV |
TCEO | Offset error thermal drift (2) | –1.3 | 1.3 | μV/°C | ||
EG | Gain error | Initial, at 25°C | –0.3% | –0.02% | 0.3% | |
TCEG | Gain error thermal drift (3) | –40 | ±20 | 40 | ppm/°C | |
PSRR | Power-supply rejection ratio | LDOIN from 4 V to 18 V, at dc | –110 | dB | ||
LDOIN from 4 V to 18 V, from 0.1 Hz to 50 kHz | –110 | |||||
AC ACCURACY | ||||||
SNR | Signal-to-noise ratio | fIN = 1 kHz | 76 | 81.5 | dB | |
SINAD | Signal-to-noise + distortion | fIN = 1 kHz | 76 | 81 | dB | |
THD | Total harmonic distortion | fIN = 1 kHz | –90 | –81 | dB | |
SFDR | Spurious-free dynamic range | fIN = 1 kHz | 81 | 90 | dB | |
DIGITAL INPUTS/OUTPUTS | ||||||
External Clock | ||||||
fCLKIN | Input clock frequency | 5 | 20 | 20.1 | MHz | |
DutyCLKIN | Duty cycle | 5 MHz ≤ fCLKIN ≤ 20.1 MHz | 40% | 50% | 60% | |
CMOS Logic Family (AMC1304M05, CMOS with Schmitt Trigger) | ||||||
IIN | Input current | DGND ≤ VIN ≤ DVDD | –1 | 1 | μA | |
CIN | Input capacitance | 5 | pF | |||
VIH | High-level input voltage | 0.7 × DVDD | DVDD + 0.3 | V | ||
VIL | Low-level input voltage | –0.3 | 0.3 × DVDD | V | ||
CLOAD | Output load capacitance | fCLKIN = 20 MHz | 30 | pF | ||
VOH | High-level output voltage | IOH = –20 µA | DVDD – 0.1 | V | ||
IOH = –4 mA | DVDD – 0.4 | |||||
VOL | Low-level output voltage | IOL = 20 µA | 0.1 | V | ||
IOL = 4 mA | 0.4 | |||||
LVDS Logic Family (AMC1304L05)(4) | ||||||
VT | Differential output voltage | RLOAD = 100 Ω | 250 | 350 | 450 | mV |
VOC | Common-mode output voltage | 1.125 | 1.23 | 1.375 | V | |
VID | Differential input voltage | 100 | 350 | 600 | mV | |
VIC | Common-mode input voltage | VID = 100 mV | 0.05 | 1.25 | 3.25 | V |
II | Receiver input current | DGND ≤ VIN ≤ 3.3 V | –24 | 0 | 20 | µA |
POWER SUPPLY | ||||||
LDOIN | LDOIN pin input voltage | 4.0 | 15.0 | 18.0 | V | |
VCAP | VCAP pin voltage | 3.45 | V | |||
ILDOIN | LDOIN pin input current | 5.3 | 6.5 | mA | ||
DVDD | Controller-side supply voltage | 3.0 | 3.3 | 5.5 | V | |
IDVDD | Controller-side supply current | LVDS, RLOAD = 100 Ω | 6.1 | 8 | mA | |
CMOS, 3.0 V ≤ DVDD ≤ 3.6 V, CLOAD = 5 pF |
2.7 | 4.0 | ||||
CMOS, 4.5 V ≤ DVDD ≤ 5.5 V, CLOAD = 5 pF |
3.2 | 5.5 |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
ANALOG INPUTS | ||||||
VClipping | Maximum differential voltage input range (AINP-AINN) |
±312.5 | mV | |||
FSR | Specified linear full-scale range (AINP-AINN) |
–250 | 250 | mV | ||
VCM | Operating common-mode input range | –0.16 | 1.2 | V | ||
CID | Differential input capacitance | 1 | pF | |||
IIB | Input bias current | Inputs shorted to AGND | –82 | –60 | –48 | μA |
RID | Differential input resistance | 25 | kΩ | |||
IIO | Input offset current | ±5 | nA | |||
CMTI | Common-mode transient immunity | 15 | kV/μs | |||
CMRR | Common-mode rejection ratio | fIN = 0 Hz, VCM min ≤ VIN ≤ VCM max |
–98 | dB | ||
fIN from 0.1 Hz to 50 kHz, VCM min ≤ VIN ≤ VCM max |
–98 | |||||
BW | Input bandwidth | 1000 | kHz | |||
DC ACCURACY | ||||||
DNL | Differential nonlinearity | Resolution: 16 bits | –0.99 | 0.99 | LSB | |
INL | Integral nonlinearity(1) | Resolution: 16 bits | –4 | ±1.5 | 4 | LSB |
EO | Offset error | Initial, at 25°C | –100 | ±25 | 100 | µV |
TCEO | Offset error thermal drift(2) | –1.3 | 1.3 | μV/°C | ||
EG | Gain error | Initial, at 25°C | –0.2% | –0.05% | 0.2% | |
TCEG | Gain error thermal drift(3) | –40 | ±20 | 40 | ppm/°C | |
PSRR | Power-supply rejection ratio | LDOIN from 4 V to 18 V, at dc | –110 | dB | ||
LDOIN from 4 V to 18 V, from 0.1 Hz to 50 kHz |
–110 | |||||
AC ACCURACY | ||||||
SNR | Signal-to-noise ratio | fIN = 1 kHz | 82 | 85 | dB | |
SINAD | Signal-to-noise + distortion | fIN = 1 kHz | 80 | 84 | dB | |
THD | Total harmonic distortion | fIN = 1 kHz | –90 | –81 | dB | |
SFDR | Spurious-free dynamic range | fIN = 1 kHz | 81 | 90 | dB | |
DIGITAL INPUTS/OUTPUTS | ||||||
External Clock | ||||||
fCLKIN | Input clock frequency | 5 | 20 | 20.1 | MHz | |
DutyCLKIN | Duty cycle | 5 MHz ≤ fCLKIN ≤ 20.1 MHz | 40% | 50% | 60% | |
CMOS Logic Family (AMC1304M25, CMOS with Schmitt Trigger) | ||||||
IIN | Input current | DGND ≤ VIN ≤ DVDD | –1 | 1 | μA | |
CIN | Input capacitance | 5 | pF | |||
VIH | High-level input voltage | 0.7 × DVDD | DVDD + 0.3 | V | ||
VIL | Low-level input voltage | –0.3 | 0.3 × DVDD | V | ||
CLOAD | Output load capacitance | fCLKIN = 20 MHz | 30 | pF | ||
VOH | High-level output voltage | IOH = –20 µA | DVDD – 0.1 | V | ||
IOH = –4 mA | DVDD – 0.4 | V | ||||
VOL | Low-level output voltage | IOL = 20 µA | 0.1 | V | ||
IOL = 4 mA | 0.4 | V | ||||
LVDS Logic Family (AMC1304L25)(4) | ||||||
VT | Differential output voltage | RLOAD = 100 Ω | 250 | 350 | 450 | mV |
VOC | Common-mode output voltage | 1.125 | 1.23 | 1.375 | V | |
VID | Differential input voltage | 100 | 350 | 600 | mV | |
VIC | Common-mode input voltage | VID = 100 mV | 0.05 | 1.25 | 3.25 | V |
II | Receiver input current | DGND ≤ VIN ≤ 3.3 V | –24 | 0 | 20 | µA |
POWER SUPPLY | ||||||
LDOIN | LDOIN pin input voltage | 4.0 | 15.0 | 18.0 | V | |
VCAP | VCAP pin voltage | 3.45 | V | |||
ILDOIN | LDOIN pin input current | 5.3 | 6.5 | mA | ||
DVDD | Controller-side supply voltage | 3.0 | 3.3 | 5.5 | V | |
IDVDD | Controller-side supply current | LVDS, RLOAD = 100 Ω | 6.1 | 8.0 | mA | |
CMOS, 3.0 V ≤ DVDD ≤ 3.6 V, CLOAD = 5 pF |
2.7 | 4.0 | ||||
CMOS, 4.5 V ≤ DVDD ≤ 5.5 V, CLOAD = 5 pF |
3.2 | 5.5 |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
tCLK | CLKIN, CLKIN_N clock period | 49.75 | 50 | 200 | ns | |
tHIGH | CLKIN, CLKIN_N clock high time | 19.9 | 25 | 120 | ns | |
tLOW | CLKIN, CLKIN_N clock low time | 19.9 | 25 | 120 | ns | |
tD | Falling edge of CLKIN, CLKIN_N to DOUT, DOUT_N valid delay | 0 | 15 | ns | ||
tISTART | Interface startup time | DVDD at 3.0 V (min) to DOUT, DOUT_N valid with LDO_IN > 4 V | 32 | 32 | CLKIN cycles | |
tASTART | Analog startup time | LDOIN step to 4 V with DVDD ≥ 3.0 V, and 0.1 µF at VCAP pin | 1 | ms |