ZHCSL85B May   2020  – April 2021 AMC3306M25

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 7.3.4.2 Output Behavior in Case of a High-Side Supply Failure
      5. 7.3.5 Isolated DC/DC Converter
      6. 7.3.6 Diagnostic Output
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Digital Filter Usage
    2. 8.2 Typical Application
      1. 8.2.1 Solar Inverter Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Shunt Resistor Sizing
          2. 8.2.1.2.2 Input Filter Design
          3. 8.2.1.2.3 Bitstream Filtering
        3. 8.2.1.3 Application Curve
      2. 8.2.2 What To Do and What Not To Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Isolation Glossary
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-20201221-CA0I-KZFJ-QKGZ-6PVFK1TNXWXQ-low.gif Figure 5-1 DWE Package,16-Pin SOIC,Top View
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 DCDC_OUT Power High-side output of the DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2 DCDC_HGND High-side Power Ground High-side ground reference for the DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN Power Input of the high-side LDO; connect this pin to the DCDC_OUT pin.(1)
4 NC — No internal connection. Connect this pin to the high-side ground or leave unconnected (floating).
5 HLDO_OUT Power Output of the high-side LDO.(1)
6 INP Analog Input Noninverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
7 INN Analog Input Inverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
8 HGND High-side Signal Ground High-side analog signal ground; connect this pin to the DCDC_HGND pin.
9 GND Low-side Signal Ground Low-side analog signal ground; connect this pin to the DCDC_GND pin.
10 DOUT Digital Output Modulator data output.
11 CLKIN Digital Input Modulator clock input with internal pulldown resistor (typical value: 1.5 MΩ).
12 VDD Low-side Power Low-side power supply.(1)
13 LDO_OUT Power Output of the low-side LDO; connect this pin to the DCDC_IN pin. The output of the LDO must not be loaded by external circuitry.(1)
14 DIAG Digital Output Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND Low-side Power Ground Low-side ground reference for the DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN Power Low-side input of the DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Section 9 section for power-supply decoupling recommendations.
(2) See the Section 10 section for details.
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