ZHCSNC6D september   2009  – may 2021 BQ24050 , BQ24052

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-2D40D94D-8E9B-4250-B39D-57145C9518DB/SLUS9405873
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions #GUID-C5354C38-DF78-4F74-91ED-68706C55D3F9/SLUS9401392
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Power Up, Down, OVP, Disable and Enable Waveforms
      2. 6.8.2 Protection Circuits Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Down, or Undervoltage Lockout (UVLO)
      2. 7.3.2  Power Up
      3. 7.3.3  D+, D– Detection
      4. 7.3.4  New Charge Cycle
      5. 7.3.5  Overvoltage Protection (OVP) – Continuously Monitored
      6. 7.3.6  CHG Pin Indication
      7. 7.3.7  CHG LED Pullup Source
      8. 7.3.8  Input DPM Mode (VIN-DPM or IN-DPM)
      9. 7.3.9  OUT
      10. 7.3.10 ISET
      11. 7.3.11 TS
      12. 7.3.12 Termination and Timer Disable Mode (TTDM) -TS Pin High
      13. 7.3.13 Timers
      14. 7.3.14 Termination
      15. 7.3.15 Battery Detect Routine
      16. 7.3.16 Refresh Threshold
      17. 7.3.17 Starting a Charge on a Full Battery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 PRE_TERM – Precharge and Termination Programmable Threshold
      2. 7.5.2 ISET2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BQ2405x Charger Application Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Program the Fast Charge Current, ISET
          2. 8.2.1.2.2 Program the Termination Current Threshold, ITERM
          3. 8.2.1.2.3 TS Function
          4. 8.2.1.2.4 CHG
          5. 8.2.1.2.5 Selecting IN and OUT Pin Capacitors
        3. 8.2.1.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Leakage Current Effects on Battery Capacity
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13.   Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)BQ24050
BQ24052		UNIT
DSQ (WSON)
10 PINS
RθJAJunction-to-ambient thermal resistance63.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance79.5
RθJBJunction-to-board thermal resistance33.9
ψJTJunction-to-top characterization parameter7.8
ψJBJunction-to-board characterization parameter34.3
RθJC(bot)Junction-to-case (bottom) thermal resistance7.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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