ZHCSDC8A December   2014  – November 2017

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     bq24193 的 PSEL、USB On-The-Go (OTG) 和支持 JEITA 配置文件
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Power Up
        1. 8.3.1.1 Power-On-Reset (POR)
        2. 8.3.1.2 Power Up from Battery without DC Source
          1. 8.3.1.2.1 BATFET Turn Off
          2. 8.3.1.2.2 Shipping Mode
        3. 8.3.1.3 Power Up from DC Source
          1. 8.3.1.3.1 REGN LDO
          2. 8.3.1.3.2 Input Source Qualification
          3. 8.3.1.3.3 Input Current Limit Detection
          4. 8.3.1.3.4 PSEL/OTG Pins Set Input Current Limit
          5. 8.3.1.3.5 HIZ State wth 100mA USB Host
          6. 8.3.1.3.6 Force Input Current Limit Detection
        4. 8.3.1.4 Converter Power-Up
        5. 8.3.1.5 Boost Mode Operation from Battery
      2. 8.3.2 Power Path Management
        1. 8.3.2.1 Narrow VDC Architecture
        2. 8.3.2.2 Dynamic Power Management
        3. 8.3.2.3 Supplement Mode
      3. 8.3.3 Battery Charging Management
        1. 8.3.3.1 Autonomous Charging Cycle
        2. 8.3.3.2 Battery Charging Profile
        3. 8.3.3.3 Battery Path Impedance IR Compensation
        4. 8.3.3.4 Thermistor Qualification
          1. 8.3.3.4.1 JEITA Guideline Compliance
        5. 8.3.3.5 Charging Termination
          1. 8.3.3.5.1 Termination when REG02[0] = 1
          2. 8.3.3.5.2 Termination when REG05[6] = 1
        6. 8.3.3.6 Charging Safety Timer
        7. 8.3.3.7 USB Timer when Charging from USB100mA Source
      4. 8.3.4 Status Outputs (PG, STAT, and INT)
        1. 8.3.4.1 Power Good Indicator (PG)
        2. 8.3.4.2 Charging Status Indicator (STAT)
        3. 8.3.4.3 Interrupt to Host (INT)
      5. 8.3.5 Protections
        1. 8.3.5.1 Input Current Limit on ILIM
        2. 8.3.5.2 Thermal Regulation and Thermal Shutdown
        3. 8.3.5.3 Voltage and Current Monitoring in Buck Mode
          1. 8.3.5.3.1 Input Over-Voltage (ACOV)
          2. 8.3.5.3.2 System Over-Voltage Protection (SYSOVP)
        4. 8.3.5.4 Voltage and Current Monitoring in Boost Mode
          1. 8.3.5.4.1 VBUS Over-Voltage Protection
        5. 8.3.5.5 Battery Protection
          1. 8.3.5.5.1 Battery Over-Current Protection (BATOVP)
          2. 8.3.5.5.2 Charging During Battery Short Protection
          3. 8.3.5.5.3 System Over-Current Protection
      6. 8.3.6 Serial Interface
        1. 8.3.6.1 Data Validity
        2. 8.3.6.2 START and STOP Conditions
        3. 8.3.6.3 Byte Format
        4. 8.3.6.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.3.6.5 Slave Address and Data Direction Bit
          1. 8.3.6.5.1 Single Read and Write
          2. 8.3.6.5.2 Multi-Read and Multi-Write
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
        1. 8.4.1.1 Plug in USB100mA Source with Good Battery
        2. 8.4.1.2 USB Timer when Charging from USB 100-mA Source
    5. 8.5 Register Map
      1. 8.5.1 I2C Registers
        1. 8.5.1.1  Input Source Control Register REG00 (reset = 00110000, or 30)
          1. Table 7. REG00 Input Source Control Register Description
        2. 8.5.1.2  Power-On Configuration Register REG01 (reset = 00011011, or 1B)
          1. Table 8. REG01 Power-On Configuration Register Description
        3. 8.5.1.3  Charge Current Control Register REG02 (reset = 01100000, or 60)
          1. Table 9. REG02 Charge Current Control Register Description
        4. 8.5.1.4  Pre-Charge/Termination Current Control Register REG03 (reset = 00010001, or 11)
          1. Table 10. REG03 Pre-Charge/Termination Current Control Register Description
        5. 8.5.1.5  Charge Voltage Control Register REG04 (reset = 10110010, or B2)
          1. Table 11. REG04 Charge Voltage Control Register Description
        6. 8.5.1.6  Charge Termination/Timer Control Register REG05 (reset = 10011010, or 9A)
          1. Table 12. REG05 Charge Termination/Timer Control Register Description
        7. 8.5.1.7  IR Compensation / Thermal Regulation Control Register REG06 (reset = 00000011, or 03)
          1. Table 13. REG06 IR Compensation / Thermal Regulation Control Register Description
        8. 8.5.1.8  Misc Operation Control Register REG07 (reset = 01001011, or 4B)
          1. Table 14. REG07 Misc Operation Control Register Description
        9. 8.5.1.9  System Status Register REG08
          1. Table 15. REG08 System Status Register Description
        10. 8.5.1.10 Fault Register REG09
          1. Table 16. REG09 Fault Register Description
        11. 8.5.1.11 Vender / Part / Revision Status Register REG0A (reset = 00101111, or 2F)
          1. Table 17. REG0A Vender / Part / Revision Status Register Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

RGE Package
24-Pin VQFN With Exposed Thermal Pad
(Top View)
bq24193 Pinout1_SLUSBG7.gif

Pin Functions

PINTYPEDESCRIPTION
NAMENUMBER
VBUS 1,24 P Charger Input Voltage. The internal n-channel reverse block MOSFET (RBFET) is connected between VBUS and PMID with VBUS on source. Place a 1-µF ceramic capacitor from VBUS to PGND and place it as close as possible to IC. (Refer to Application Information Section for details)
PSEL 2 I
Digital		 Power source selection input. High indicates a USB host source and Low indicates an adapter source.
PG 3 O
Digital		 Open drain active low power good indicator. Connect to the pull up rail via 10-kΩ resistor. LOW indicates a good input source if the input voltage is between UVLO and ACOV, above SLEEP mode threshold, and current limit is above 30 mA.
STAT 4 O
Digital		 Open drain charge status output to indicate various charger operation. Connect to the pull up rail via 10-kΩ. LOW indicates charge in progress. HIGH indicates charge complete or charge disabled. When any fault condition occurs, STAT pin blinks at 1 Hz.
SCL 5 I
Digital		 I2C Interface clock. Connect SCL to the logic rail through a 10-kΩ resistor.
SDA 6 I/O
Digital		 I2C Interface data. Connect SDA to the logic rail through a 10-kΩ resistor.
INT 7 O
Digital		 Open-drain Interrupt Output. Connect the INT to a logic rail via 10-kΩ resistor. The INT pin sends active low, 256-us pulse to host to report charger device status and fault.
OTG 8 I
Digital		 USB current limit selection pin during buck mode, and active high enable pin during boost mode.
In buck mode with USB host (PSEL=High), when OTG = High, IIN limit = 500 mA and when OTG = Low, IIN limit = 100 mA.
The boost mode is activated when the REG01[5:4] = 10 and OTG pin is High.
CE 9 I
Digital		 Active low Charge Enable pin. Battery charging is enabled when REG01[5:4] = 01 and CE pin = Low. CE pin must be pulled high or low.
ILIM 10 I
Analog		 ILIM pin sets the maximum input current limit by regulating the ILIM voltage at 1 V. A resistor is connected from ILIM pin to ground to set the maximum limit as IINMAX = (1V/RILIM) × 530. The actual input current limit is the lower one set by ILIM and by I2C REG00[2:0]. The minimum input current programmed on ILIM pin is 500 mA.
TS1 11 I
Analog		 Temperature qualification voltage input #1. Connect a negative temperature coefficient thermistor. Program temperature window with a resistor divider from REGN to TS1 to GND. Charge suspends when either TS pin is out of range. Recommend 103AT-2 thermistor. TS1 and TS2 pins have to be shorted together in bq24193.
TS2 12 I
Analog		 Temperature qualification voltage input #2. Connect a negative temperature coefficient thermistor. Program temperature window with a resistor divider from REGN to TS2 to GND. Charge suspends when either TS pin is out of range. Recommend 103AT-2 thermistor. TS1 and TS2 pins have to be connected together in bq24193.
BAT 13,14 P Battery connection point to the positive terminal of the battery pack. The internal BATFET is connected between BAT and SYS. Connect a 10 µF closely to the BAT pin.
SYS 15,16 P System connection point. The internal BATFET is connected between BAT and SYS. When the battery falls below the minimum system voltage, switch-mode converter keeps SYS above the minimum system voltage. (Refer to Application Information Section for inductor and capacitor selection.)
PGND 17,18 P Power ground connection for high-current power converter node. Internally, PGND is connected to the source of the n-channel LSFET. On PCB layout, connect directly to ground connection of input and output capacitors of the charger. A single point connection is recommended between power PGND and the analog GND near the IC PGND pin.
SW 19,20 O
Analog		 Switching node connecting to output inductor. Internally SW is connected to the source of the n-channel HSFET and the drain of the n-channel LSFET. Connect the 0.047-µF bootstrap capacitor from SW to BTST.
BTST 21 P PWM high side driver positive supply. Internally, the BTST is connected to the anode of the boost-strap diode. Connect the 0.047-µF bootstrap capacitor from SW to BTST.
REGN 22 P PWM low side driver positive supply output. Internally, REGN is connected to the cathode of the boost-strap diode. Connect a 4.7-µF (10-V rating) ceramic capacitor from REGN to analog GND. The capacitor should be placed close to the IC. REGN also serves as bias rail of TS1 and TS2 pins.
PMID 23 O
Analog		 Connected to the drain of the reverse blocking MOSFET and the drain of HSFET. Given the total input capacitance, connect a 1-µF capacitor on VBUS to PGND, and the rest all on PMID to PGND. (Refer to Application Information Section for details)
Thermal Pad – P Exposed pad beneath the IC for heat dissipation. Always solder thermal pad to the board, and have vias on the thermal pad plane star-connecting to PGND and ground plane for high-current power converter.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |